Renesas R9A07G044C26GBG#AC0

Overview

R9A07G044C26GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous microprocessor in the RZ/G2L Group, integrating an Arm Cortex-A55 application processor and an Arm Cortex-M33 real-time co-processor on a single die. It features 1MB L2 cache, dual-channel LPDDR4x memory interface (up to 1600 MT/s), and integrated 2D/3D graphics (Arm Mali-G31 MP2). It targets industrial HMI, entry-level edge AI gateways, and embedded vision systems requiring Linux + RTOS coexistence.

For engineers reviewing the R9A07G044C26GBG#AC0 datasheet, R9A07G044C26GBG#AC0 pinout, R9A07G044C26GBG#AC0 application, or R9A07G044C26GBG#AC0 equivalent, key selection criteria include its dual-core asymmetric architecture, LPDDR4x support, integrated security (TrustZone, cryptographic accelerators), and 14 mm × 14 mm 324-pin BGA package with 0.65 mm pitch.

Technical Context

The R9A07G044C26GBG#AC0 implements a tightly coupled heterogeneous compute architecture: the Cortex-A55 core runs Linux-based applications with full MMU support and executes at up to 1.2 GHz, while the Cortex-M33 core handles deterministic real-time tasks-including sensor fusion, motor control, and secure boot-running at up to 400 MHz with TCM and TrustZone isolation. Both cores share access to on-chip peripherals including GIC-600 interrupt controller and AXI/AHB bus matrix.

Its system-level integration includes hardware-accelerated crypto engines (AES-128/256, SHA-256, RSA-2048), a dedicated security subsystem (SCE7), and dual-camera MIPI CSI-2 interfaces supporting up to 13 MP resolution. Memory subsystem supports ECC on LPDDR4x and configurable AXI slave ports for custom IP integration.

Key Specifications

Pinout & Package

Package: 324-pin Fine-Pitch Ball Grid Array (FBGA), 14 mm × 14 mm body, 0.65 mm ball pitch, 0.8 mm nominal height, RoHS-compliant matte tin finish. Thermal pad (exposed die attach) centered on underside for PCB-level heat sinking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous processor applications.

Compared with R9A07G044C26GBG#AC0, the R9A07G043C26GBG#AC0 offers identical real-time and security capabilities at lower cost and power, while the i.MX 8M Mini provides broader multimedia support but weaker hardware-enforced separation between application and control domains.

Availability

R9A07G044C26GBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, edge AI gateways, embedded vision cameras, and secure access control panels requiring stable component supply across multi-year production cycles.

Supply support for R9A07G044C26GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/G series - including R9A07G044C26GBG#AC0 - is designed for Linux-capable, high-reliability embedded applications demanding real-time responsiveness, hardware security, and long-term availability in industrial automation and edge infrastructure.

FAQ

What is the maximum supported LPDDR4x speed for R9A07G044C26GBG#AC0?

The R9A07G044C26GBG#AC0 supports LPDDR4x memory at data rates up to 1600 MT/s across two 16-bit channels. This configuration delivers a theoretical peak bandwidth of 25.6 GB/s and requires strict PCB layout adherence to Renesas' DDR layout guidelines - including length matching within ±5 mm, 40 Ω single-ended impedance, and dedicated VDDQ/VSSQ planes. The R9A07G044C26GBG#AC0's memory controller includes built-in training and calibration logic to compensate for process/voltage/temperature variation.

Does R9A07G044C26GBG#AC0 include hardware support for secure boot?

Yes, R9A07G044C26GBG#AC0 implements a multi-stage secure boot chain anchored in ROM code, verified by the SCE7 security module. It supports cryptographic verification of bootloader images using ECDSA-P256 or RSA-2048 signatures, with keys stored in one-time-programmable (OTP) fuses. The R9A07G044C26GBG#AC0 also enforces TrustZone-based memory isolation during boot, preventing unauthorized access to secure firmware regions - a requirement for IEC 62443-3-3 compliance.

Can R9A07G044C26GBG#AC0 run both Linux and FreeRTOS simultaneously?

Yes, R9A07G044C26GBG#AC0 is architected for asymmetric multiprocessing (AMP): the Cortex-A55 core typically runs a full Linux distribution (e.g., Yocto Project), while the Cortex-M33 core independently executes FreeRTOS or bare-metal firmware. Inter-core communication occurs via shared memory and mailbox interrupts, with hardware-enforced memory protection preventing interference. This configuration is validated in Renesas' "RZ/G2L AMP Reference Software" package, which includes sample IPC drivers and synchronization primitives for R9A07G044C26GBG#AC0.

What camera interfaces does R9A07G044C26GBG#AC0 support?

R9A07G044C26GBG#AC0 integrates two independent MIPI CSI-2 receivers, each supporting up to four data lanes and one clock lane. Each interface handles up to 13 MP resolution at 30 fps (or 5 MP at 60 fps), with programmable pixel format (RAW10/12, YUV422, RGB888) and on-the-fly cropping/scaling. The R9A07G044C26GBG#AC0 does not include an integrated ISP; however, it supports external ISPs via parallel or CSI-2 daisy-chain configurations, and provides DMA engines optimized for direct frame transfer to LPDDR4x.

Is R9A07G044C26GBG#AC0 qualified for industrial temperature range?

Yes, R9A07G044C26GBG#AC0 is rated for operation from −40°C to +85°C ambient temperature and is classified as Industrial Grade per Renesas' quality standards. It undergoes extended burn-in and HTOL (High-Temperature Operating Life) testing per JESD22-A108, with failure-in-time (FIT) rate <100 FIT. The R9A07G044C26GBG#AC0's thermal design power (TDP) is specified at 2.5 W typical under balanced A55+M33 load, enabling passive cooling in sealed enclosures - a key requirement for DIN-rail mounted industrial controllers.