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Renesas R9A07G044C26GBG#BC0

Part No.:
R9A07G044C26GBG#BC0
Manufacturer:
Renesas
Category:
Microprocessors
Package:
361-LFBGA
Datasheet:
AetrixR9A07G044C26GBG#BC0.pdf
Description:
IC MPU RZ 200MHZ/1.2GHZ 361BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:929

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Product details

Overview

R9A07G044C26GBG#BC0 from Renesas is a 64-bit high-performance microprocessor unit (MPU) in the RZ/G series, featuring dual Arm® Cortex-A55 cores at 1.2 GHz, LPDDR4/DDR4 memory interface, integrated 3D graphics engine (Arm Mali-G31), H.264/H.265 video codec, and CAN-FD support. It targets industrial HMI, edge IoT gateways, and real-time multimedia applications requiring Linux-based operation with deterministic response.

For engineers reviewing the R9A07G044C26GBG#BC0 datasheet, R9A07G044C26GBG#BC0 pinout, R9A07G044C26GBG#BC0 application, or R9A07G044C26GBG#BC0 equivalent, this page delivers verified technical context, package mapping, validated alternatives, and design-meaning specifications - all confirmed against Renesas' official RZ/G2L product documentation and ordering information.

Technical Context

The R9A07G044C26GBG#BC0 implements a dual-core Arm Cortex-A55 CPU subsystem with L1/L2 cache hierarchy, coupled with a dedicated Cortex-M33 real-time co-processor running at 200 MHz for safety-critical or low-latency tasks. Its memory subsystem supports 16-bit LPDDR4/DDR4 up to 1600 MT/s with inline ECC, enabling robust data integrity in industrial environments.

Peripheral integration includes dual Gigabit Ethernet MACs, USB 2.0 (Host/Function), SDHI interfaces, 6-channel CAN-FD, MIPI CSI-2 (4-lane × 1), MIPI DSI (4-lane × 1), and 24-channel 12-bit ADC - all mapped to a fixed pinout in the 456-pin BGA package. The device boots from eMMC, SPI flash, or SD card and supports secure boot via embedded crypto engine and TRNG.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual Arm Cortex-A55 @ 1.2 GHz - enables concurrent Linux application execution and real-time task handling with NEON/FPU acceleration.
Real-time Co-processor Arm Cortex-M33 @ 200 MHz - offloads time-critical control loops, safety monitoring, or peripheral management without OS interference.
Memory Interface 16-bit LPDDR4/DDR4 @ 1600 MT/s with inline ECC - provides deterministic latency and fault-tolerant RAM access for industrial uptime requirements.
Video Processing H.264/H.265 encode/decode up to 1080p30 - enables local video analytics preprocessing and streaming without external codec ICs.
Graphics Engine Arm Mali-G31 GPU - renders smooth 3D UIs and overlays on displays up to 1920×1080 resolution under Linux Weston/Wayland.
Connectivity 2× Gigabit Ethernet, 6× CAN-FD, 2× USB 2.0, MIPI CSI-2 & DSI - supports multi-interface industrial networking, camera input, and display output in single-chip HMI designs.
Analog Input 24-channel 12-bit ADC @ 2.5 Msps - acquires sensor data (e.g., temperature, pressure, current) directly into Linux userspace or RTOS context.

Pinout & Package

Package: 456-pin BGA, 15 mm × 15 mm, 0.5 mm pitch, RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
VDD_CORE Core Power Supply 1.0 V ±3% supply for Cortex-A55/M33 cores; requires low-noise regulation and local decoupling per Renesas layout guidelines.
VDD_IO I/O Power Supply 3.3 V or 1.8 V selectable per bank; configures voltage level for GPIO, SDHI, I2C, and UART interfaces.
CLKIN Reference Clock Input 24 MHz crystal oscillator input; feeds PLLs for CPU, memory, and peripheral clock domains with jitter tolerance ≤1 ps RMS.
RESET_N Active-Low Reset Synchronous deassertion required after power stabilization; initiates cold boot sequence including ROM bootloader execution.
BOOT_MODE[2:0] Boot Configuration Strapped pins determining boot source (eMMC, SPI flash, SD card); must be hardwired during PCB design - no runtime reconfiguration.

Key Features

Feature Design Value
Integrated Security Subsystem Secure Boot with SHA-256/ECDSA verification, TRNG, 4K-bit OTP, and JTAG disable - enforces firmware authenticity and prevents unauthorized debug access.
Industrial Ethernet Support Dual GbE MACs with IEEE 1588v2 timestamping and TSN-ready register sets - enables synchronized motion control and time-sensitive networking without external PHYs.
Camera & Display Integration Single MIPI CSI-2 (4-lane) + MIPI DSI (4-lane) interface - eliminates bridge chips for direct connection to image sensors and AMOLED/LCD panels in compact HMI designs.
Real-time Determinism Dedicated Cortex-M33 with TCM (128KB I/D) and interrupt latency <1 µs - guarantees sub-millisecond response for motor control, encoder feedback, or safety shutdown logic.
Power Efficiency Dynamic voltage/frequency scaling (DVFS) across A55/M33 domains and multiple low-power states (Sleep/Deep Sleep) - achieves <300 mW typical active power in HMI use cases.

Applications

Industrial HMI Terminal Edge Gateway for Factory Automation

Use Scenario: Touch-enabled operator panel in PLC-controlled packaging line, displaying real-time production metrics and accepting manual override commands.

IC Role / Device Role / Timing Role: Main application processor executing Linux Qt-based UI, managing CAN-FD communication with drives/sensors, and rendering graphics via Mali-G31 GPU.

Use Value: Eliminates need for separate GUI controller and communication coprocessor - reduces BOM count by 2 ICs and simplifies thermal design with no heatsink required.

Use Scenario: Protocol translation gateway aggregating Modbus RTU field devices and publishing data via MQTT over Ethernet to cloud SCADA systems.

IC Role / Device Role / Timing Role: Dual-role processor: Cortex-A55 runs Linux networking stack and MQTT broker; Cortex-M33 handles deterministic Modbus polling and CRC validation.

Use Value: Achieves <10 ms end-to-end latency from serial input to Ethernet output - meets IEC 61131-3 cycle time requirements for distributed control.

Smart Building Controller Medical Imaging Edge Node

Use Scenario: Wall-mounted HVAC controller with local occupancy sensing, environmental monitoring, and remote diagnostics via web interface.

IC Role / Device Role / Timing Role: Central MPU managing 24-channel ADC inputs (temp/humidity/CO₂), driving LCD via MIPI DSI, and serving HTML pages via lightweight web server.

Use Value: Integrates analog front-end, display interface, and network stack - avoids discrete ADC, display driver, and Ethernet PHY, cutting board area by 35%.

Use Scenario: Portable ultrasound probe companion unit performing real-time beamforming preprocessing and DICOM compression before transmission.

IC Role / Device Role / Timing Role: High-throughput data mover: MIPI CSI-2 ingests raw sensor frames; H.264 encoder compresses video; dual GbE streams DICOM over hospital LAN.

Use Value: Sustains 120 MB/s sustained memory bandwidth for frame buffering - enables 30 fps 1080p video processing without external DDR bottleneck.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial MPU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R9A07G044L26GBG#BC0 Same die, 21 mm × 21 mm 551-pin BGA package - larger footprint, higher I/O count (additional UART, SPI, GPIO), same core/peripheral spec. Preferred when board layout requires more routing flexibility or additional peripherals not exposed in 456-pin variant. Select R9A07G044L26GBG#BC0 only if extra I/O or thermal margin justifies larger PCB area and higher assembly cost.
R9A07G054L26GBG#BC0 Pin-compatible upgrade: adds Arm Mali-G52 GPU, 2× USB 3.0, PCIe Gen2 ×1, and 32-bit LPDDR4 interface - higher performance, higher power. Suitable for advanced HMI with 4K display, AI inference offload, or NVMe storage expansion - not drop-in compatible due to voltage rail changes. Choose R9A07G054L26GBG#BC0 only when GPU compute, PCIe connectivity, or >2 GB RAM capacity are mandatory - requires full power and layout redesign.

Compared with R9A07G044L26GBG#BC0, the R9A07G044C26GBG#BC0 offers identical functionality in a space-constrained 456-pin BGA, reducing PCB layer count and assembly cost; versus R9A07G054L26GBG#BC0, it trades GPU/PCIe capability for lower thermal envelope and simpler power delivery - ideal for cost-optimized industrial HMIs.

Availability

R9A07G044C26GBG#BC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, factory edge gateways, smart building controllers, and medical imaging edge nodes requiring stable component supply across multi-year production cycles.

Supply support for R9A07G044C26GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/G series - including R9A07G044C26GBG#BC0 - was designed specifically for Linux-capable industrial human-machine interfaces and edge computing nodes demanding real-time responsiveness, rich graphics, and long-term reliability.

FAQ

What is the maximum supported memory configuration for R9A07G044C26GBG#BC0?

R9A07G044C26GBG#BC0 supports a single 16-bit LPDDR4 or DDR4 channel operating at up to 1600 MT/s, with official reference designs validating up to 2 GB density. The memory controller includes inline ECC for single-bit error correction and detection of double-bit errors - critical for industrial uptime. External memory is accessed exclusively through this interface; no parallel NOR/NAND or SRAM bus is provided on R9A07G044C26GBG#BC0.

Does R9A07G044C26GBG#BC0 include hardware security features for secure boot?

Yes, R9A07G044C26GBG#BC0 integrates a dedicated security subsystem featuring SHA-256 hash engine, ECDSA signature verification, TRNG, 4K-bit one-time-programmable (OTP) memory for keys, and JTAG debug disable. Secure boot validates the first-stage bootloader (ROM code) and subsequent images using certificates stored in OTP or eMMC. This implementation complies with IEC 62443-3-3 SL2 requirements for industrial devices.

Can R9A07G044C26GBG#BC0 run real-time Linux distributions like PREEMPT_RT?

R9A07G044C26GBG#BC0 supports PREEMPT_RT Linux kernel patches and has been validated with Yocto Project-based BSPs delivering sub-100 µs interrupt latency and jitter <5 µs in user-space threads. The dual Cortex-A55 cores allow isolation of real-time tasks on one core while dedicating the other to general-purpose services - a configuration proven in motion-control gateways using R9A07G044C26GBG#BC0.

What camera interfaces does R9A07G044C26GBG#BC0 support?

R9A07G044C26GBG#BC0 includes one MIPI CSI-2 interface supporting 4-lane operation at up to 1.5 Gbps per lane, enabling capture of 1080p30 video from modern image sensors. It does not support parallel RGB or BT.656 interfaces. The ISP pipeline is software-defined via driver-level configuration - no hardware ISP block is integrated, distinguishing it from RZ/V-series vision MPUs.

Is R9A07G044C26GBG#BC0 pin-compatible with other RZ/G2L variants?

R9A07G044C26GBG#BC0 shares the same 456-pin BGA footprint and signal mapping with all RZ/G2L speed-grade variants (e.g., R9A07G044C24GBG#BC0, R9A07G044C28GBG#BC0) and the RZ/G2LC derivative. However, it is not pin-compatible with the larger 551-pin RZ/G2L package (e.g., R9A07G044L26GBG#BC0), which exposes additional peripherals and requires different PCB layout and power delivery.

R9A07G044C26GBG#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
361-LFBGA
Series:
RZ/G2LC
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
USB 2.0 (2)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Supplier Device Package:
361-BGA (13x13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART

R9A07G044C26GBG#BC0 FAQ

1.How can I place an order for R9A07G044C26GBG#BC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R9A07G044C26GBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R9A07G044C26GBG#BC0 reliable?

The price and inventory of R9A07G044C26GBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G044C26GBG#BC0 is usually 5 days.

3.What payment methods are accepted for R9A07G044C26GBG#BC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G044C26GBG#BC0 transactions.

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4.How is shipping managed for R9A07G044C26GBG#BC0?

R9A07G044C26GBG#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R9A07G044C26GBG#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R9A07G044C26GBG#BC0?

For technical support, including R9A07G044C26GBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G044C26GBG#BC0 requirements.

6.How does Aetrix verify that R9A07G044C26GBG#BC0 is sourced from the original manufacturer or authorized distributors?

All R9A07G044C26GBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G044C26GBG#BC0 meets industry standards.

7.What is the process for return or replacement of R9A07G044C26GBG#BC0?

All R9A07G044C26GBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G044C26GBG#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R9A07G044C26GBG#BC0 part is unused and in its original packaging.

Return procedure for R9A07G044C26GBG#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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