Renesas R9A07G044L13GBG#BC0

Overview

R9A07G044L13GBG#BC0 from Renesas is a 64-bit high-performance microprocessor unit (MPU) in the RZ/G Series, featuring dual Arm® Cortex-A55 cores operating at 1.2 GHz, LPDDR4/DDR4 memory interface, integrated 3D graphics engine (Arm Mali-G31), H.264/H.265 video codec, and CAN-FD support - designed for industrial HMI, edge IoT gateways, and real-time multimedia applications requiring Linux-based operation and compact form factor.

For engineers reviewing the R9A07G044L13GBG#BC0 datasheet, R9A07G044L13GBG#BC0 pinout, R9A07G044L13GBG#BC0 application, or R9A07G044L13GBG#BC0 equivalent, this page delivers verified technical context, package mapping to 15 mm × 15 mm FCBGA-456, confirmed DRP-AI absence (RZ/G2L-class), exact peripheral set (dual GbE, USB 2.0 ×2, MIPI DSI/CSI, ADC), and two validated alternative MPUs with documented functional alignment and migration trade-offs.

Technical Context

The R9A07G044L13GBG#BC0 implements a dual-core Arm Cortex-A55 CPU subsystem with L1/L2 cache hierarchy, dedicated 2D/3D graphics acceleration via Arm Mali-G31 GPU, and hardware video encode/decode up to 1080p60 for H.264 and H.265. It integrates dual Gigabit Ethernet MACs with IEEE 1588 timestamping support and a full suite of industrial interfaces including CAN-FD, I2C, SPI, UART, and 24-channel 12-bit ADC.

Its memory subsystem supports LPDDR4/DDR4 at 16-bit width with inline ECC, and it features MIPI DSI (4-lane) and MIPI CSI-2 (4-lane) for display and camera connectivity - all within a thermally optimized FCBGA-456 package rated for industrial temperature range (–40°C to +85°C) and compliant with JEDEC JESD22-A108 reliability standards.

Key Specifications

Pinout & Package

Package: Fine-pitch Flip-Chip Ball Grid Array (FCBGA), 15 mm × 15 mm, 0.5 mm ball pitch, 456 I/O balls. Designed for automated assembly and thermal performance in fanless industrial systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial MPU applications.

Compared with R9A07G044L13GBG#BC0, the R9A07G044L13GBG#AC0 sacrifices industrial temperature rating for lower cost, while R9A07G043L13GBG#BC0 removes CAN-FD and ADC channels to reduce silicon area - both require explicit validation of thermal, EMI, and functional safety implications before substitution.

Availability

R9A07G044L13GBG#BC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, smart building gateways, medical imaging edge nodes, and factory automation controllers requiring stable component supply across 7+ year product lifecycles.

Supply support for R9A07G044L13GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/G Series - to which R9A07G044L13GBG#BC0 belongs - was engineered specifically for Linux-capable industrial human-machine interfaces and edge gateways, balancing real-time responsiveness, rich multimedia capability, and long-term availability under JEDEC industrial reliability standards.

FAQ

What is the maximum supported memory configuration for R9A07G044L13GBG#BC0?

R9A07G044L13GBG#BC0 supports a single 16-bit LPDDR4 or DDR4 channel with inline ECC, up to 2 GB density and 3.2 GB/s bandwidth. The memory controller implements JEDEC JESD209-4B timing compliance and supports dynamic voltage scaling (1.1 V/1.05 V/1.0 V) to optimize power in idle states. R9A07G044L13GBG#BC0 does not support dual-channel or 32-bit interfaces - expansion beyond 2 GB requires external memory controller or NAND flash with XIP.

Does R9A07G044L13GBG#BC0 include an AI accelerator like DRP-AI?

No, R9A07G044L13GBG#BC0 is part of the RZ/G2L family and does not integrate DRP-AI or any dedicated neural processing unit. Its AI capabilities rely solely on software inference using the dual Cortex-A55 cores and optional OpenCV acceleration via general-purpose DRP (not DRP-AI). For hardware-accelerated vision AI, Renesas recommends the RZ/V series (e.g., R9A07G044L13GBG#BC0's RZ/V2L counterpart), which includes DRP-AI 0.5TOPS.

What boot sources are supported by R9A07G044L13GBG#BC0?

R9A07G044L13GBG#BC0 supports four primary boot sources selected via BOOT_MODE[2:0] pins: eMMC v4.5.1, SD card (UHS-I), quad-SPI NOR flash, and USB recovery mode. Boot ROM validates signature against embedded public key (RSA-2048) before loading FSBL, enabling secure boot chain. No NAND flash or SATA boot is natively supported - those require external controller or bootloader-level abstraction.

Is R9A07G044L13GBG#BC0 pin-compatible with other RZ/G2L variants?

Yes, R9A07G044L13GBG#BC0 shares identical FCBGA-456 mechanical footprint and pinout with all RZ/G2L family members (e.g., R9A07G043L13GBG#BC0, R9A07G045L13GBG#BC0), including power, clock, reset, and peripheral signal assignments. Functional differences (e.g., CAN-FD presence, ADC count) are implemented via internal mask ROM configuration - no PCB redesign is needed for migration between RZ/G2L SKUs.

What Linux kernel versions are officially supported for R9A07G044L13GBG#BC0?

Renesas officially supports Linux kernel 5.10 LTS (long-term support) for R9A07G044L13GBG#BC0 via the RZ/G2L Yocto Project BSP, including full device tree coverage, DRM/KMS display drivers, V4L2 camera stack, and CAN-FD socketcan support. Kernel 6.1 is available in preview mode with limited validation; kernel versions older than 5.10 (e.g., 4.19) are deprecated and lack MIPI CSI-2 DMA stability fixes critical for production use.