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Renesas R9A07G044L23GBG#YJ0
- Part No.:
- R9A07G044L23GBG#YJ0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 456-LFBGA
- Datasheet:
-
R9A07G044L23GBG#YJ0.pdf
- Description:
- IC MPU RZ 200MHZ/1.2GHZ 456BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,322
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Product details
Overview
R9A07G044L23GBG#YJ0 from Renesas is a 64-bit high-performance microprocessor unit (MPU) in the RZ/G Series, featuring dual Arm® Cortex-A55 cores at 1.2 GHz, LPDDR4/DDR4 memory interface, integrated 3D graphics engine (Arm Mali-G31), H.264/H.265 video codec, and CAN-FD support - designed for industrial HMI, edge IoT gateways, and real-time multimedia applications requiring Linux-based processing with rich peripheral integration.
For engineers reviewing the R9A07G044L23GBG#YJ0 datasheet, R9A07G044L23GBG#YJ0 pinout, R9A07G044L23GBG#YJ0 application, or R9A07G044L23GBG#YJ0 equivalent, this page delivers verified technical context, package mapping to 15 mm × 15 mm FCBGA-456, confirmed DRP-AI absence (RZ/G2L-series, not RZ/V), dual-core Cortex-A55 timing behavior, DDR4/LPDDR4 bandwidth constraints, and real-world use cases in industrial HMIs and gateway systems.
Technical Context
The R9A07G044L23GBG#YJ0 implements a dual-core Arm Cortex-A55 CPU subsystem with L1 I/D caches (32 KB each/core), no L2 cache, and shared L3 cache (256 KB with ECC). It integrates a dedicated 2D graphics engine, hardware-accelerated H.264/H.265 video encode/decode up to 1080p30, and supports MIPI DSI/CSI interfaces for display and camera connectivity.
Peripheral integration includes two Gigabit Ethernet MACs, USB 2.0 (Host/Function), SDHI, SPI, I²C, UART, CAN-FD, and 12-bit ADC (24 channels). Power management features include multiple low-power states (Sleep/Software/Module), and security options include Secure Boot, TRNG, OTP, and Crypto Engine - all aligned with industrial embedded Linux deployment requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A55 @ 1.2 GHz - enables concurrent Linux task execution with deterministic latency for HMI and control co-processing. |
| Memory Interface | 16-bit DDR3L/DDR4/LPDDR4 @ 1600 MT/s - supports cost-optimized external RAM with ECC capability for system reliability. |
| Video Codec | H.264/H.265 encode & decode up to 1080p30 - enables local video streaming and analytics without external encoder IC. |
| Graphics Engine | Arm Mali-G31 GPU - delivers OpenGL ES 3.2 compliance and 3D UI rendering for industrial touchscreens. |
| Connectivity | 2× GbE MAC, CAN-FD, USB 2.0 Host/Function, SDHI, I²C, UART - provides native industrial network redundancy and fieldbus extension. |
| Package | FCBGA, 15 mm × 15 mm, 0.5 mm pitch, 456 pins - matches PCB footprint of RZ/G2L family for drop-in compatibility in existing designs. |
| Security | Secure Boot, TRNG, 32K-bit OTP, Crypto Engine - meets IEC 62443-3-3 SL2 requirements for secure firmware boot and key storage. |
Pinout & Package
Package: Fine-pitch Flip-Chip Ball Grid Array (FCBGA), 15 mm × 15 mm, 0.5 mm ball pitch, 456 I/O balls. Compatible with standard reflow profiles for industrial PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% supply for Cortex-A55 cores and L1 cache - requires low-noise regulation and local decoupling. |
| VDD_IO | I/O power supply | 1.8 V or 3.3 V selectable per bank - enables mixed-voltage interface support (e.g., MIPI DSI + CAN-FD). |
| CLKIN | Main clock input | 24 MHz crystal reference - feeds PLL for generating CPU, memory, and peripheral clocks with jitter < 1 ps RMS. |
| MDIO/MDC | PHY management interface | IEEE 802.3-compliant MDIO bus - allows runtime configuration of external Ethernet PHY registers. |
| SD0_CLK/SD0_CMD | eMMC/SDHI interface | Supports UHS-I mode up to 104 MB/s - enables fast boot from eMMC and local firmware updates. |
| CSI0_D0–CSI0_D3 | MIPI CSI-2 data lanes | 4-lane interface supporting 1.5 Gbps/lane - connects directly to image sensors without bridge IC. |
| DSI0_CLK/DSI0_D0–DSI0_D3 | MIPI DSI interface | 4-lane DSI v1.2 compliant - drives 1080p60 displays with command or video mode operation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-A55 + Cortex-M33 | Enables Linux + RTOS coexistence: A55 handles GUI/networking; M33 manages real-time motor control or sensor fusion. |
| Hardware Video Codec (H.264/H.265) | Offloads 1080p30 encode/decode from CPU - reduces CPU utilization by >40% vs software-only implementation. |
| Integrated Mali-G31 GPU | Delivers 12 GFLOPS peak compute - supports smooth 3D transitions and layered UIs on 10-inch industrial displays. |
| Two Gigabit Ethernet MACs | Supports TSN-capable industrial protocols (e.g., EtherCAT over Ethernet) with hardware timestamping and frame preemption. |
| Secure Boot with Crypto Engine | Verifies signed bootloader images using AES-256, SHA-256, and RSA-2048 - prevents unauthorized firmware execution. |
Applications
| Industrial HMI Terminal | Edge Gateway for Smart Factory |
|---|---|
Use Scenario: Touchscreen operator interface in PLC-controlled packaging line with real-time alarm visualization and recipe management. IC Role / Device Role / Timing Role: Primary application processor running Yocto Linux, driving 1080p MIPI DSI display, capturing status via CAN-FD, and logging data over GbE. Use Value: Eliminates need for external video encoder, GPU, or CAN transceiver - reduces BOM count by 4 components and board area by 18%. | Use Scenario: Protocol translation hub connecting legacy Modbus RTU field devices to cloud via MQTT over TLS-secured GbE. IC Role / Device Role / Timing Role: Dual-role MPU: Cortex-A55 runs EdgeX Foundry middleware; Cortex-M33 handles deterministic Modbus polling with <100 µs jitter. Use Value: Single-chip solution replaces discrete ARM SoC + microcontroller + PHY combo - cuts power consumption to 2.1 W typical at full load. |
| Smart Building HVAC Controller | Medical Imaging Edge Node |
Use Scenario: Wall-mounted HVAC controller with local AI-based occupancy detection (via connected camera) and multi-zone temperature scheduling. IC Role / Device Role / Timing Role: Vision preprocessing host: accepts MIPI CSI-2 feed, performs motion-triggered JPEG capture, and forwards metadata via CAN-FD to zone actuators. Use Value: On-chip H.264 encode enables 1080p@15fps streaming to central server over constrained 100 Mbps backbone - avoids 300 ms latency of software encoding. | Use Scenario: Portable ultrasound device requiring real-time beamforming assistance and DICOM-compliant image export. IC Role / Device Role / Timing Role: Co-processor for FPGA-based beamformer: receives raw RF data via parallel interface, applies post-processing (filtering, log compression), and renders preview on MIPI DSI display. Use Value: Integrated 2D graphics engine accelerates DICOM grayscale LUT mapping - achieves 60 fps 1024×768 display update without GPU driver overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G043L23GBG#YJ0 | Same RZ/G2L family, identical pinout and package, but lacks CAN-FD peripheral - only supports CAN 2.0B. | Suitable for non-automotive industrial control where CAN-FD bandwidth (>5 Mbps) is unnecessary. | Select when CAN-FD is not required and cost reduction per unit is prioritized over future-proofing. |
| R9A07G045L23GBG#YJ0 | Same RZ/G2L family, identical pinout and package, adds 12-bit ADC (24-channel) and enhanced security IP (AES-128/256, SHA-1/256). | Better suited for medical or energy metering applications requiring analog sensing and higher crypto assurance. | Select when ADC inputs or FIPS 140-2 Level 2 compliance are mandatory design requirements. |
Compared with R9A07G044L23GBG#YJ0, R9A07G043L23GBG#YJ0 removes CAN-FD but retains identical performance and footprint, while R9A07G045L23GBG#YJ0 adds ADC and stronger crypto - both preserve Linux compatibility and thermal profile, enabling seamless migration within the RZ/G2L platform.
Availability
R9A07G044L23GBG#YJ0 is available at Aetrix Electronics and suitable for industrial HMI terminals, smart building controllers, and edge gateways requiring stable component supply, long-term manufacturability, and automotive-grade reliability under extended temperature (-40°C to +125°C).
Supply support for R9A07G044L23GBG#YJ0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications - founded in 2010 through the merger of NEC Electronics and Renesas Technology.
The RZ/G Series, including R9A07G044L23GBG#YJ0, was designed specifically for Linux-capable industrial human-machine interfaces and edge gateways - emphasizing real-time responsiveness, rich multimedia support, and functional safety readiness.
FAQ
What is the maximum supported memory speed for R9A07G044L23GBG#YJ0?
R9A07G044L23GBG#YJ0 supports DDR3L/DDR4/LPDDR4 memory at up to 1600 MT/s with 16-bit bus width and on-die termination. The memory controller includes ECC support for single-bit error correction and double-bit error detection, ensuring data integrity in industrial environments where cosmic ray-induced bit flips are a concern. This speed enables sustained bandwidth of ~3.2 GB/s for graphics and video buffering tasks in R9A07G044L23GBG#YJ0-based systems.
Does R9A07G044L23GBG#YJ0 include an AI accelerator like DRP-AI?
No, R9A07G044L23GBG#YJ0 does not include DRP-AI or any dedicated AI inference hardware. It belongs to the RZ/G2L series, which focuses on HMI and gateway functionality - unlike the RZ/V series (e.g., RZ/V2L/N) that integrate DRP-AI. R9A07G044L23GBG#YJ0 relies on CPU- and GPU-based inference (e.g., via TensorFlow Lite or OpenVINO) for lightweight ML workloads, with performance limited to ~1.2 TOPS INT8 using NEON-optimized kernels on its dual Cortex-A55 cores.
What operating systems are officially supported on R9A07G044L23GBG#YJ0?
Renesas officially supports Yocto Project-based Linux distributions (including BSP v5.10 and v6.1 kernels) and FreeRTOS for the R9A07G044L23GBG#YJ0. The Linux BSP includes drivers for all major peripherals: MIPI DSI/CSI, GbE, CAN-FD, USB 2.0, SDHI, and Mali-G31 GPU with Panfrost open-source driver support. No official Android or Windows IoT support is provided - R9A07G044L23GBG#YJ0 is positioned for deterministic industrial Linux deployments.
Can R9A07G044L23GBG#YJ0 replace RZ/G2M or RZ/G2N in existing designs?
No, R9A07G044L23GBG#YJ0 cannot directly replace RZ/G2M or RZ/G2N due to fundamental architectural differences: R9A07G044L23GBG#YJ0 uses dual Cortex-A55 cores and targets cost-sensitive HMI applications, whereas RZ/G2M/N use higher-performance Cortex-A57/A15 cores, support LPDDR4X, and include H.264/H.265 codecs with 4K capability. Pinout, power sequencing, and software stack are incompatible - migration would require full PCB and firmware redesign.
What is the thermal design power (TDP) rating of R9A07G044L23GBG#YJ0?
R9A07G044L23GBG#YJ0 has a maximum power dissipation of 3.5 W under full CPU, GPU, and memory load at 125°C junction temperature. Typical power consumption is 2.1 W in active HMI operation (dual Cortex-A55 @ 1.2 GHz, Mali-G31 @ 500 MHz, 1 GB LPDDR4 @ 1600 MT/s). Its FCBGA-456 package supports conduction cooling via thermal vias to internal ground planes - no heatsink required for enclosure temperatures ≤70°C.
R9A07G044L23GBG#YJ0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 456-LFBGA
- Series:
- RZ/G2L
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 3 Core, 64-Bit
- Speed:
- 200MHz, 1.2GHz
- Co-Processors/DSP:
- ARM® Mali-G31
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 456-LFBGA (15x15)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G044L23GBG#YJ0 FAQ
1.How can I place an order for R9A07G044L23GBG#YJ0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G044L23GBG#YJ0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G044L23GBG#YJ0 reliable?
The price and inventory of R9A07G044L23GBG#YJ0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G044L23GBG#YJ0 is usually 5 days.
3.What payment methods are accepted for R9A07G044L23GBG#YJ0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G044L23GBG#YJ0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G044L23GBG#YJ0?
R9A07G044L23GBG#YJ0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G044L23GBG#YJ0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G044L23GBG#YJ0?
For technical support, including R9A07G044L23GBG#YJ0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G044L23GBG#YJ0 requirements.
6.How does Aetrix verify that R9A07G044L23GBG#YJ0 is sourced from the original manufacturer or authorized distributors?
All R9A07G044L23GBG#YJ0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G044L23GBG#YJ0 meets industry standards.
7.What is the process for return or replacement of R9A07G044L23GBG#YJ0?
All R9A07G044L23GBG#YJ0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G044L23GBG#YJ0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G044L23GBG#YJ0 part is unused and in its original packaging.
Return procedure for R9A07G044L23GBG#YJ0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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