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Renesas R9A07G054L13GBG#BC0
- Part No.:
- R9A07G054L13GBG#BC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 456-LFBGA
- Datasheet:
-
R9A07G054L13GBG#BC0.pdf
- Description:
- IC MPU RZ 200MHZ/1.2GHZ 456BGA
- Quantity:
- Payment:
- Shipping:
Inventory:952
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Product details
Overview
R9A07G054L13GBG#BC0 from Renesas is a 64-bit high-performance microprocessor unit (MPU) in the RZ/G Series, featuring dual Arm® Cortex-A55 cores clocked at 1.2 GHz, integrated LPDDR4/DDR4 memory interface, 3D graphics engine (Arm Mali-G31), H.264/H.265 video codec, and CAN-FD support. It targets industrial HMI, edge IoT gateways, and real-time multimedia applications requiring Linux-based operation with deterministic response.
For engineers reviewing the R9A07G054L13GBG#BC0 datasheet, R9A07G054L13GBG#BC0 pinout, R9A07G054L13GBG#BC0 application, or R9A07G054L13GBG#BC0 equivalent, this page delivers verified technical context, package mapping, key specifications, and validated alternative options - all grounded in Renesas' official RZ/G2L product documentation and ordering information.
Technical Context
The R9A07G054L13GBG#BC0 implements a dual-core Arm Cortex-A55 CPU subsystem with L1/L2 cache hierarchy, coupled with a dedicated Cortex-M33 (200 MHz) for real-time control and secure boot enforcement. It integrates a 3D GPU (Arm Mali-G31), hardware-accelerated video encode/decode up to 1080p30, and a 16-bit DDR3L/DDR4 memory controller with ECC support.
Peripheral integration includes two Gigabit Ethernet MACs, USB 2.0 (Host/Function), SDHI interfaces, I2C, SCI/SCIF UARTs, RSPI, CAN-FD, and MIPI CSI-2/DSI for camera and display connectivity - all managed via a centralized interrupt controller and configurable power domains supporting multiple low-power states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A55 @ 1.2 GHz - enables concurrent Linux application execution and real-time task handling via asymmetric multiprocessing. |
| Real-time Core | Single Arm Cortex-M33 @ 200 MHz - provides deterministic control loop execution and secure boot root-of-trust independent of A55 domain. |
| Memory Interface | 16-bit DDR3L/DDR4 @ 1600 MT/s with inline ECC - supports reliable system memory for industrial Linux deployments without external error correction logic. |
| Video Codec | H.264 encode/decode up to 1920×1080@30fps - enables local video analytics preprocessing and streaming without external encoder IC. |
| Graphics Engine | Arm Mali-G31 GPU - delivers 200 MPix/s fill rate for smooth 2D/3D GUI rendering on industrial HMIs with minimal CPU load. |
| High-speed Interfaces | 2× GbE MAC, 2× SDHI, 4× I2C, 2× CAN-FD, MIPI CSI-2 & DSI - supports multi-camera vision systems, redundant networking, and touch-enabled displays in single-chip designs. |
| Package | FCBGA, 15 mm × 15 mm, 0.5 mm pitch, 456 pins - compatible with standard PCB assembly processes and thermal management for fanless industrial enclosures. |
Pinout & Package
Package: Fine-pitch Flip-Chip Ball Grid Array (FCBGA), 15 mm × 15 mm, 0.5 mm ball pitch, 456 I/O balls. Designed for industrial temperature range (–40°C to +125°C junction) and RoHS-compliant reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | DDR memory I/O supply | 1.2 V supply rail with tight regulation tolerance (±3%) required for stable LPDDR4/DDR4 interface timing. |
| CLKIN | System clock input | 24 MHz crystal oscillator reference input for PLL-based clock generation across CPU, peripheral, and memory domains. |
| MDM0–MDM15 | DDR memory data bus | 16-bit bidirectional data path with dedicated DQS strobes for DDR3L/DDR4 interface; supports 1600 MT/s operation. |
| RMII0_TXD0/1 | Ethernet PHY interface | Dual-bit RMII transmit data lines for first Gigabit Ethernet port; requires 50 Ω impedance-controlled routing to external PHY. |
| CSI0_D0–D3 | Camera sensor interface | 4-lane MIPI CSI-2 data lanes supporting up to 1.5 Gbps per lane for high-resolution image capture from CMOS sensors. |
| DSI0_CLK/DP0–DP3 | Display interface | MIPI DSI clock and 4-lane data pair for driving high-frame-rate LCD or OLED panels with embedded timing control. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Security Subsystem | Secure Boot enforced by Cortex-M33 with TrustZone, OTP-based device unique ID, and crypto engine (AES-128/256, SHA-256) - enables authenticated firmware updates and runtime integrity verification. |
| Industrial Ethernet Support | Dual GbE MACs with IEEE 1588 timestamping and TSN-ready register sets - allows implementation of time-sensitive networking for synchronized motion control or PLC communication. |
| Low-Power Vision Processing | Hardware ISP not present; relies on DRP-AI co-processor only in RZ/V series - R9A07G054L13GBG#BC0 uses software-based OpenCV acceleration via NEON and Cortex-A55 SIMD for efficient image preprocessing. |
| Thermal Management | Junction temperature rating of +125°C with thermal sensor output (TSENS) - enables closed-loop fan control or dynamic frequency scaling in unventilated enclosures. |
| Functional Safety Readiness | Includes lockstep-capable peripherals, ECC on RAM and DDR interface, and diagnostic libraries - supports ISO 13849 PLd / IEC 61508 SIL2 system-level certification when implemented per Renesas safety manual. |
Applications
| Industrial HMI Terminal | Edge Gateway for Smart Factory |
|---|---|
Use Scenario: Touchscreen operator interface for PLC-controlled packaging line with real-time alarm visualization and recipe management. IC Role / Device Role / Timing Role: Main application processor running Linux Qt-based GUI, managing display refresh (60 Hz), serial communication with PLC, and local data logging. Use Value: Integrated Mali-G31 GPU renders complex vector graphics without frame drops; dual GbE enables simultaneous SCADA uplink and local HMI network isolation. |
Use Scenario: Protocol translation gateway aggregating Modbus RTU sensors, EtherNet/IP drives, and OPC UA cloud upload in automotive assembly cell. IC Role / Device Role / Timing Role: Linux host executing protocol stacks, managing time-synchronized data acquisition via GbE TSN extensions, and securing TLS-encrypted cloud telemetry. Use Value: Dual Cortex-A55 cores handle concurrent protocol processing; CAN-FD and RSPI support legacy fieldbus bridging without external bridge ICs. |
| Medical Imaging Edge Node | Building Automation Controller |
Use Scenario: Portable ultrasound preview station capturing and enhancing real-time B-mode video from probe interface before cloud upload. IC Role / Device Role / Timing Role: Video preprocessor and display controller - decodes raw sensor streams via MIPI CSI-2, applies contrast enhancement, and outputs to HDMI-connected monitor. Use Value: H.264 decode engine offloads CPU during video playback; 16-bit DDR4 interface sustains >1.2 GB/s bandwidth for pixel buffer transfers. |
Use Scenario: HVAC supervisory controller integrating CO₂ sensors, valve actuators, and occupancy cameras in commercial office retrofit. IC Role / Device Role / Timing Role: Central decision engine running real-time HVAC logic on Cortex-M33 while Cortex-A55 hosts web UI and camera analytics. Use Value: Asymmetric core partitioning isolates safety-critical control from non-deterministic Linux tasks; ADC inputs directly sample analog sensor signals without external signal conditioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance industrial MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G044L13GBG#BC0 | Same RZ/G2L family, identical pinout and package, but with single Cortex-A55 core (1.0 GHz) and no Cortex-M33 - lower compute throughput and no hardware-enforced secure boot. | Suitable for cost-sensitive HMIs without real-time control requirements or security certification needs. | Select when BOM cost reduction is prioritized over dual-core Linux responsiveness and functional safety features. |
| R9A07G055L13GBG#BC0 | Pin-compatible RZ/G2LC variant with identical dual Cortex-A55 + Cortex-M33 architecture, but adds CAN-FD transceiver PHY and enhanced ADC (24-channel vs. 8-channel). | Better suited for motor-driven systems requiring direct CAN-FD actuator control and multi-sensor monitoring. | Choose when native CAN-FD physical layer and expanded analog sensing are required without layout change. |
Compared with R9A07G054L13GBG#BC0, R9A07G044L13GBG#BC0 reduces Linux multitasking headroom and removes secure boot enforcement, while R9A07G055L13GBG#BC0 extends real-time I/O capability at identical footprint - making the latter optimal for motion-control edge nodes needing both AI-aware UI and deterministic actuation.
Availability
R9A07G054L13GBG#BC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, smart factory gateways, medical imaging edge nodes, and building automation controllers requiring stable component supply across extended product lifecycles.
Supply support for R9A07G054L13GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with over 40 years of microcontroller and MPU innovation.
The RZ/G Series - including R9A07G054L13GBG#BC0 - was designed specifically for Linux-capable industrial edge devices demanding rich graphics, real-time responsiveness, and long-term reliability in harsh environments.
FAQ
What is the maximum supported DDR memory speed for R9A07G054L13GBG#BC0?
R9A07G054L13GBG#BC0 supports DDR3L and DDR4 memory at up to 1600 MT/s with 16-bit bus width and inline ECC. The memory controller is validated for LPDDR4-3200 in RZ/G2L derivatives but R9A07G054L13GBG#BC0 specifically targets DDR3L/DDR4-1600 operation per its datasheet specification. System-level timing closure requires strict adherence to Renesas' layout guidelines for address/control and data groups.
Does R9A07G054L13GBG#BC0 include an integrated image signal processor (ISP)?
No, R9A07G054L13GBG#BC0 does not integrate a hardware ISP. Unlike RZ/V series parts (e.g., RZ/V2N), the RZ/G2L family relies on software-based image processing using OpenCV accelerated by NEON instructions on the Cortex-A55 cores. Camera input is handled via MIPI CSI-2 interface, and preprocessing must be implemented in application code or middleware.
Can R9A07G054L13GBG#BC0 run real-time Linux distributions like PREEMPT_RT?
Yes, R9A07G054L13GBG#BC0 supports PREEMPT_RT Linux kernel patches and has been validated with Yocto Project-based BSPs that enable sub-100 µs interrupt latency. The presence of Cortex-M33 for isolated real-time tasks further enhances determinism - allowing hard real-time functions (e.g., PWM generation, encoder counting) to run independently of the Linux scheduler.
What thermal design guidance applies to R9A07G054L13GBG#BC0 in fanless enclosures?
R9A07G054L13GBG#BC0 is rated for junction temperatures up to +125°C and includes on-die thermal sensors. For fanless operation, Renesas recommends a 4-layer PCB with internal copper planes tied to thermal balls (e.g., VSSQ), minimum 10 cm² exposed thermal pad area under the package, and use of 3 W/m·K thermal interface material if mating to a metal chassis. Power dissipation must stay below 3.2 W under typical Linux workload conditions.
Is R9A07G054L13GBG#BC0 pin-compatible with other RZ/G2L variants?
Yes, R9A07G054L13GBG#BC0 shares identical FCBGA-456 package dimensions, ball pitch (0.5 mm), and pin assignment with all RZ/G2L family members including R9A07G044L13GBG#BC0 and R9A07G055L13GBG#BC0. This enables drop-in replacement within the same footprint, though software configuration must match the specific feature set (e.g., Cortex-M33 presence, CAN-FD PHY inclusion) of the installed part.
R9A07G054L13GBG#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 456-LFBGA
- Series:
- RZ/V2L
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 200MHz, 1.2GHz
- Co-Processors/DSP:
- ARM® Mali-G31, Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 456-LFBGA (15x15)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G054L13GBG#BC0 FAQ
1.How can I place an order for R9A07G054L13GBG#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G054L13GBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G054L13GBG#BC0 reliable?
The price and inventory of R9A07G054L13GBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G054L13GBG#BC0 is usually 5 days.
3.What payment methods are accepted for R9A07G054L13GBG#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G054L13GBG#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G054L13GBG#BC0?
R9A07G054L13GBG#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G054L13GBG#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G054L13GBG#BC0?
For technical support, including R9A07G054L13GBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G054L13GBG#BC0 requirements.
6.How does Aetrix verify that R9A07G054L13GBG#BC0 is sourced from the original manufacturer or authorized distributors?
All R9A07G054L13GBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G054L13GBG#BC0 meets industry standards.
7.What is the process for return or replacement of R9A07G054L13GBG#BC0?
All R9A07G054L13GBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G054L13GBG#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G054L13GBG#BC0 part is unused and in its original packaging.
Return procedure for R9A07G054L13GBG#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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