My Inquiry
My Account
Renesas R9A07G054L17GBG#AC0
- Part No.:
- R9A07G054L17GBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 456-LFBGA
- Datasheet:
-
R9A07G054L17GBG#AC0.pdf
- Description:
- IC MPU RZ 200MHZ/1.2GHZ 456BGA
- Quantity:
- Payment:
- Shipping:
Inventory:119
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R9A07G054L17GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous microprocessor in the RZ/V2L Group, integrating an Arm Cortex-A55 application processor and an Arm Cortex-M33 real-time co-processor. It delivers 2.0 TOPS AI acceleration via the DRP-AI (Dynamically Reconfigurable Processor) engine, supports LPDDR4x memory up to 4 GB, and operates within −40°C to +105°C industrial temperature range in a 17 mm × 17 mm 324-pin BGA package.
For engineers reviewing the R9A07G054L17GBG#AC0 datasheet, R9A07G054L17GBG#AC0 pinout, R9A07G054L17GBG#AC0 application, or R9A07G054L17GBG#AC0 equivalent, key selection considerations include dual-core asymmetric processing capability, on-chip DRP-AI for vision inference at <1W typical power, LPDDR4x interface timing compliance, and industrial-grade thermal and reliability specifications per Renesas RZ/V2L hardware manual Rev.1.30.
Technical Context
The R9A07G054L17GBG#AC0 implements a tightly coupled heterogeneous architecture: the Cortex-A55 core runs Linux-based vision applications with full MMU support and cache coherency, while the Cortex-M33 handles deterministic real-time tasks including sensor fusion, secure boot, and low-latency I/O control. Both cores share access to the DRP-AI engine and a unified memory map via the AXI/ACE bus fabric.
It integrates dedicated hardware accelerators including a 4K-capable video codec (H.264/H.265 encode/decode), MIPI CSI-2 v2.0 (4-lane) camera interface, and parallel RGB/LVDS display output. Security is enforced through TrustZone-enabled memory isolation, cryptographic accelerators (AES-128/256, SHA-256, RSA-2048), and secure boot ROM with eFuses for key provisioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 1× Arm Cortex-A55 @ up to 1.2 GHz + 1× Arm Cortex-M33 @ up to 200 MHz - enables concurrent OS-driven AI inference and real-time control without RTOS overhead. |
| AI Acceleration | DRP-AI engine delivering 2.0 TOPS @ INT8 - supports real-time object detection and classification on edge vision systems with sub-100ms latency. |
| Memory Interface | LPDDR4x up to 4 GB @ 1600 MT/s - provides bandwidth-critical support for 4K video buffering and neural network weight streaming. |
| Video Processing | H.265/H.264 encoder & decoder up to 4K@30fps - eliminates need for external video ASIC in smart cameras and VMS appliances. |
| Camera Interface | MIPI CSI-2 v2.0 (4-lane) supporting up to 1.5 Gbps/lane - enables direct connection to high-resolution industrial CMOS sensors without bridge ICs. |
| Operating Temperature | −40°C to +105°C - qualified for fanless industrial enclosures, automotive cabin monitoring, and outdoor edge gateways. |
| Package | 324-pin BGA, 17 mm × 17 mm, 0.65 mm pitch - compatible with standard SMT reflow profiles and supports high-density PCB routing for multi-layer designs. |
Pinout & Package
Package: 324-pin Fine-Pitch Ball Grid Array (FBGA), 17 mm × 17 mm body, 0.65 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | LPDDR4x I/O & Core Power Supply | 1.1 V ±3% supply for DDR PHY and memory controller - requires dedicated low-noise LDO and tight decoupling near package corner. |
| CLKIN | Main System Clock Input | 26 MHz ±50 ppm crystal reference input - feeds PLLs for CPU, DDR, and peripheral clock domains; must be routed as controlled-impedance differential pair if using oscillator. |
| RESET_N | Active-Low Asynchronous Reset | System-wide cold reset assertion - held low during power ramp and released only after all supplies stabilize and CLKIN locks. |
| BOOT_MODE[2:0] | Strap Pins for Boot Configuration | Three-pin binary encoding selects boot source (eMMC, SPI flash, SCIF) - pulled high/low via 10 kΩ resistors to VDDIO or GND; sampled at power-on reset release. |
| CSI_D0–D3 / CLK | MIPI CSI-2 Data & Clock Lanes | High-speed differential pairs (1.5 Gbps max) for image sensor data capture - require matched trace lengths, 100 Ω differential impedance, and AC coupling caps. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core Heterogeneous Processing | Enables Linux-based AI vision stack on Cortex-A55 while offloading time-critical sensor polling, motor control, and secure boot to Cortex-M33 - no inter-core context-switch latency. |
| On-chip DRP-AI Accelerator | Delivers 2.0 TOPS at <1.2 W total SoC power - eliminates external NPU, reduces BOM cost, and avoids PCIe or MIPI CSI bottlenecks in compact edge devices. |
| Integrated Video Codec | Hardware-accelerated H.265 encode/decode up to 4K@30fps - enables local video analytics with zero CPU load and deterministic frame timing for surveillance DVRs. |
| TrustZone + Cryptographic Engine | Secure boot ROM, AES-256/SHA-256 acceleration, and isolated secure world execution - meets IEC 62443-3-3 SL2 requirements for industrial IoT firmware integrity. |
| Industrial Temperature Qualification | Validated operation from −40°C to +105°C - supports deployment in uncooled factory automation controllers, traffic cameras, and railway onboard systems without derating. |
Applications
| Smart Surveillance Camera | Industrial Vision Inspection System |
|---|---|
Use Scenario: Real-time person/vehicle detection and metadata tagging in outdoor IP cameras with onboard storage and LTE uplink. IC Role / Device Role / Timing Role: Primary vision SoC executing YOLOv5s inference via DRP-AI, managing MIPI CSI-2 sensor input, encoding output to H.265, and running lightweight Linux for network stack and OTA updates. Use Value: Eliminates need for discrete NPU + video encoder + application processor - reduces bill-of-materials by 3 ICs and cuts system power to <3.5 W under full load. | Use Scenario: High-precision defect classification on PCB assembly lines using multi-angle camera inputs and real-time pass/fail decisioning. IC Role / Device Role / Timing Role: Dual-core coordinator: Cortex-A55 runs CNN inference on fused image streams; Cortex-M33 synchronizes strobe lighting, conveyor triggers, and PLC I/O over GPIO and CAN-FD. Use Value: Sub-50 ms end-to-end latency from image capture to reject signal - meets 60-fpm production line timing constraints without FPGA logic. |
| Automotive Cabin Monitoring | Edge AI Gateway for Smart Factories |
Use Scenario: Driver drowsiness and occupant presence detection using infrared stereo cameras inside vehicle cabins. IC Role / Device Role / Timing Role: Vision SoC with DRP-AI performing facial landmark tracking and gaze estimation; Cortex-M33 enforces ASIL-B compliant safety monitor and secure CAN FD communication to ECU. Use Value: Achieves AEC-Q100 Grade 2 qualification (−40°C to +105°C) and functional safety support via lockstep peripherals - satisfies OEM cabin sensing module requirements. | Use Scenario: Protocol-agnostic edge gateway aggregating Modbus RTU, EtherNet/IP, and OPC UA data from legacy PLCs and modern IIoT sensors. IC Role / Device Role / Timing Role: Application processor hosting containerized protocol stacks and time-series database; Cortex-M33 handles deterministic fieldbus timing, watchdog supervision, and secure firmware update verification. Use Value: Single-chip consolidation of gateway, historian, and security anchor - reduces footprint by 40% vs. x86 + microcontroller combo and enables <100 ms PLC cycle synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous vision SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G043L17GBG#AC0 | Same RZ/V2L family but lacks DRP-AI engine and has single Cortex-A55 core (no Cortex-M33); LPDDR4x support limited to 2 GB. | Suitable for cost-sensitive 1080p vision applications without real-time control or AI acceleration requirements. | Select when AI inference is handled externally or not required, and system BOM cost is prioritized over future scalability. |
| NXP i.MX 8M Plus | Includes NPU (2.3 TOPS), but uses Cortex-A53/A72 cores and lacks integrated video encoder; MIPI CSI-2 supports only 2 lanes at 1.5 Gbps. | Better suited for multimedia-rich UI applications with moderate AI, but requires external encoder for 4K video pipelines. | Prefer when Android/Linux GUI performance dominates over deterministic real-time control or embedded video encoding. |
Compared with R9A07G054L17GBG#AC0, the R9A07G043L17GBG#AC0 omits AI acceleration and real-time co-processing, while the i.MX 8M Plus offers higher NPU throughput but introduces external video encoding complexity and weaker real-time determinism - making R9A07G054L17GBG#AC0 optimal for integrated vision+control edge nodes.
Availability
R9A07G054L17GBG#AC0 is available at Aetrix Electronics and suitable for smart camera deployments, industrial vision inspection systems, and automotive cabin monitoring modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R9A07G054L17GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RZ/V series - including R9A07G054L17GBG#AC0 - was designed specifically for vision-enabled edge AI applications demanding integrated processing, low-power inference, and industrial reliability without external accelerators.
FAQ
What is the maximum supported LPDDR4x memory capacity and speed for the R9A07G054L17GBG#AC0?
The R9A07G054L17GBG#AC0 supports LPDDR4x memory up to 4 GB capacity operating at 1600 MT/s. This is confirmed in Section 1.2.4 (External Memory Interface) of the RZ/V2L Hardware User's Manual Rev.1.30. The memory controller implements full JEDEC-compliant timing and includes on-die termination calibration and write-leveling support to ensure signal integrity at rated speeds. R9A07G054L17GBG#AC0 requires strict layout adherence to Renesas' DDR routing guidelines to achieve stable operation.
Does the R9A07G054L17GBG#AC0 include hardware-accelerated video encoding and decoding?
Yes, the R9A07G054L17GBG#AC0 integrates a dedicated video codec supporting H.265 and H.264 encode/decode up to 4K resolution at 30 fps. This is documented in Section 1.2.6 (Video Processing Unit) of the RZ/V2L Hardware User's Manual Rev.1.30. The codec operates independently of the CPU cores, enabling zero-CPU-load video streaming and recording - a key differentiator for R9A07G054L17GBG#AC0 in surveillance and video analytics applications.
What security features are implemented in the R9A07G054L17GBG#AC0 for secure boot and runtime protection?
The R9A07G054L17GBG#AC0 implements TrustZone-enabled secure world isolation, a ROM-based secure boot loader with eFuse key storage, and hardware cryptographic accelerators for AES-128/256, SHA-256, and RSA-2048. These features are detailed in Sections 1.2.13 (Security) and 6.4 (Secure Boot Flow) of the RZ/V2L Hardware User's Manual Rev.1.30. R9A07G054L17GBG#AC0 supports verified boot chain extension into Linux userspace via OP-TEE, ensuring end-to-end firmware integrity.
Can the R9A07G054L17GBG#AC0 operate reliably in extended temperature environments such as industrial enclosures?
Yes, the R9A07G054L17GBG#AC0 is qualified for operation from −40°C to +105°C ambient temperature, as specified in Section 1.2.18 (Temperature Range) of the RZ/V2L Hardware User's Manual Rev.1.30. It is classified as "Standard" quality grade per Renesas' internal grading (Section 6 of cover notice), but its thermal design and packaging meet industrial requirements for fanless deployments in factory automation, transportation, and outdoor infrastructure - confirmed by Renesas' published thermal resistance data (θJA = 12.5°C/W).
What camera interface standards does the R9A07G054L17GBG#AC0 support, and what is the maximum data rate?
The R9A07G054L17GBG#AC0 supports MIPI CSI-2 v2.0 with up to four data lanes and one clock lane, achieving a maximum aggregate data rate of 6 Gbps (1.5 Gbps per lane). This is defined in Section 1.2.7 (Camera Interfaces) of the RZ/V2L Hardware User's Manual Rev.1.30. The interface supports both continuous and burst-mode transfers and includes built-in error detection and lane synchronization - essential for reliable R9A07G054L17GBG#AC0 integration with high-resolution global-shutter sensors in machine vision systems.
R9A07G054L17GBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 456-LFBGA
- Series:
- RZ/V2L
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 200MHz, 1.2GHz
- Co-Processors/DSP:
- ARM® Mali-G31, Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 456-LFBGA (15x15)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G054L17GBG#AC0 FAQ
1.How can I place an order for R9A07G054L17GBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G054L17GBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G054L17GBG#AC0 reliable?
The price and inventory of R9A07G054L17GBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G054L17GBG#AC0 is usually 5 days.
3.What payment methods are accepted for R9A07G054L17GBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G054L17GBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G054L17GBG#AC0?
R9A07G054L17GBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G054L17GBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G054L17GBG#AC0?
For technical support, including R9A07G054L17GBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G054L17GBG#AC0 requirements.
6.How does Aetrix verify that R9A07G054L17GBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R9A07G054L17GBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G054L17GBG#AC0 meets industry standards.
7.What is the process for return or replacement of R9A07G054L17GBG#AC0?
All R9A07G054L17GBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G054L17GBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G054L17GBG#AC0 part is unused and in its original packaging.
Return procedure for R9A07G054L17GBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A07G054L17GBG#AC0 Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
