Renesas R9A07G054L18GBG#AC0
- Part No.:
- R9A07G054L18GBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 551-LFBGA
- Datasheet:
-
R9A07G054L18GBG#AC0.pdf
- Description:
- IC MPU RZ 200MHZ/1.2GHZ 551BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,738
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R9A07G054L18GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous microprocessor in the RZ/V2L Group, integrating an Arm Cortex-A55 application processor and an Arm Cortex-M33 real-time co-processor on a single die. It delivers 2.0 TOPS AI acceleration via the DRP-AI (Dynamically Reconfigurable Processor-AI), supports LPDDR4x memory up to 4 GB, and operates within −40°C to +85°C industrial temperature range in a 15 mm × 15 mm 272-pin BGA package.
For engineers reviewing the R9A07G054L18GBG#AC0 datasheet, R9A07G054L18GBG#AC0 pinout, R9A07G054L18GBG#AC0 application, or R9A07G054L18GBG#AC0 equivalent, key selection considerations include its dual-CPU architecture with TrustZone security, DRP-AI inference throughput, LPDDR4x interface timing, and industrial-grade thermal performance - all critical for vision-enabled edge AI deployments.
Technical Context
The R9A07G054L18GBG#AC0 implements a tightly coupled heterogeneous compute architecture: the Cortex-A55 core handles Linux-based application workloads (e.g., OpenCV, GStreamer pipelines), while the Cortex-M33 executes deterministic real-time tasks (sensor fusion, motor control, secure boot) with independent memory mapping and interrupt routing. Both cores share access to the DRP-AI engine, which processes neural network layers at configurable precision (INT4/INT8) without CPU intervention.
Its system-level design includes dual-channel LPDDR4x support (up to 3200 MT/s), MIPI CSI-2 (4-lane) and MIPI DSI (4-lane) interfaces for camera and display I/O, and hardware-accelerated cryptographic engines (AES-256, SHA-2, RSA-2048, TRNG) compliant with Arm TrustZone and PSA Certified Level 2 requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core Arm Cortex-A55 @ up to 1.2 GHz + single-core Arm Cortex-M33 @ up to 200 MHz - enables concurrent OS-driven and bare-metal real-time execution |
| AI Acceleration | DRP-AI delivering 2.0 TOPS at INT8 - offloads CNN inference (e.g., YOLOv5s, MobileNetV2) from CPU, reducing latency and power |
| Memory Interface | LPDDR4x, 2×32-bit channels, up to 4 GB capacity, 3200 MT/s data rate - supports high-bandwidth vision buffer streaming |
| Video Input/Output | MIPI CSI-2 (4-lane, 1.5 Gbps/lane) + MIPI DSI (4-lane, 1.5 Gbps/lane) - enables direct connection to 4K-capable image sensors and displays |
| Security Features | Arm TrustZone, PSA Certified Level 2, AES-256/SHA-2/RSA-2048 accelerators, TRNG, secure boot ROM - enforces hardware-rooted chain of trust |
| Operating Temp. | −40°C to +85°C - qualified for uncontrolled industrial environments without active cooling |
| Package | 272-pin FBGA, 15 mm × 15 mm, 0.65 mm pitch - compatible with standard SMT reflow profiles and IPC Class 3 assembly |
Pinout & Package
Package: 272-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 15 mm body, 0.65 mm ball pitch, RoHS-compliant, lead-free matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | LPDDR4x I/O Power Supply | 1.1 V ±3% supply for DDR interface signaling - requires low-noise regulation and local decoupling |
| CLKIN | Main System Clock Input | 26 MHz crystal oscillator input - feeds PLLs for CPU, DDR, and peripheral clock domains |
| RESET_N | Active-Low Reset Input | Synchronous deassertion required after power stabilization - initiates cold reset sequence per RZ/V2L boot flow |
| CSI_D0–D3 | MIPI CSI-2 Data Lanes | Differential pairs supporting 1.5 Gbps/lane - routed as controlled-impedance 100 Ω differential traces |
| DSI_CLK/DSI_D0–D3 | MIPI DSI Clock & Data Lanes | High-speed differential outputs for display timing and pixel data - require matched length and ESD protection |
| TRST_N | JTAG Test Reset | Optional boundary-scan initialization - used during production test and debug bring-up |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Architecture | Enables Linux + RTOS coexistence on one SoC - eliminates inter-processor communication overhead and reduces BOM count |
| DRP-AI Engine | Configurable reconfigurable logic for layer-wise CNN execution - achieves sub-10ms inference latency on 640×480 inputs at INT8 |
| Hardware Cryptographic Acceleration | Offloads AES-256 encryption/decryption and SHA-256 hashing - sustains >200 Mbps encrypted video stream throughput |
| MIPI CSI-2 + DSI Integration | Eliminates need for external bridge ICs - reduces PCB area and signal integrity complexity in compact vision modules |
| Industrial Temperature Range | Validated operation from −40°C to +85°C - supports fanless deployment in factory automation and outdoor gateways |
Applications
| Smart Surveillance Camera | Autonomous Mobile Robot (AMR) |
|---|---|
Use Scenario: Real-time person detection and tracking in retail or warehouse environments using dual 4K image streams. IC Role / Device Role / Timing Role: R9A07G054L18GBG#AC0 serves as the central vision AI SoC - Cortex-A55 runs YOLOv5 inference pipeline, Cortex-M33 manages IMU fusion and motor control timing, DRP-AI accelerates feature extraction. Use Value: Achieves 25 FPS object detection at 1080p resolution with <2W typical power draw - enabling battery-operated or PoE-powered edge deployment. | Use Scenario: Navigation and obstacle avoidance in logistics AMRs using stereo vision and SLAM algorithms. IC Role / Device Role / Timing Role: R9A07G054L18GBG#AC0 hosts ROS 2 on Cortex-A55 for path planning, while Cortex-M33 executes time-critical motor PWM and encoder feedback loops with <10 μs jitter. Use Value: Hardware-synced MIPI CSI-2 capture and DRP-AI preprocessing reduce end-to-end latency to <35 ms - critical for dynamic obstacle response. |
| Industrial Quality Inspection System | Medical Imaging Edge Gateway |
Use Scenario: High-speed PCB defect classification using line-scan cameras and CNN-based anomaly detection. IC Role / Device Role / Timing Role: R9A07G054L18GBG#AC0 ingests 12-bit monochrome image data via parallel interface (via GPIO expansion), performs real-time DRP-AI inference, and triggers pneumatic reject actuators via Cortex-M33 GPIO. Use Value: On-device inference eliminates cloud round-trip delay - enabling sub-millisecond decision latency for 120 fps inline inspection lines. | Use Scenario: Secure aggregation and pre-processing of ultrasound DICOM streams from portable probes before transmission to PACS. IC Role / Device Role / Timing Role: R9A07G054L18GBG#AC0 acts as a HIPAA-compliant edge gateway - Cortex-A55 runs DICOM compression and TLS 1.3 encryption, Cortex-M33 validates digital signatures and manages secure key storage. Use Value: Integrated TrustZone and cryptographic accelerators meet FDA cybersecurity guidance for Class II medical devices - no external security IC required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous vision AI SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G044L18GBG#AC0 | Same RZ/V2L family but with single Cortex-A55 core (no dual-core A55), identical DRP-AI and peripherals - lower AI throughput (1.0 TOPS) | Suitable for cost-sensitive applications requiring only basic inference (e.g., presence detection), not multi-stream analytics | Select when BOM cost reduction is prioritized over concurrent workload capacity and peak AI performance |
| i.MX 8M Plus (MCIMX8ML8DVJZ | NXP part with Cortex-A53 + Cortex-M7, NPU delivering 2.3 TOPS - different memory subsystem (LPDDR4, not LPDDR4x), no MIPI DSI native support | Better suited for audio-visual gateway use cases; requires external DSI bridge for display output | Choose when existing NXP toolchain familiarity or audio DSP integration outweighs native MIPI display advantages |
Compared with R9A07G044L18GBG#AC0, the R9A07G054L18GBG#AC0 provides dual A55 cores for scalable Linux workloads and full 2.0 TOPS DRP-AI throughput; versus i.MX 8M Plus, it offers tighter MIPI CSI/DSI integration and industrial temperature qualification without add-on components.
Availability
R9A07G054L18GBG#AC0 is available at Aetrix Electronics and suitable for smart camera systems, autonomous mobile robots, industrial inspection equipment, and medical imaging gateways requiring stable component supply across multi-year production cycles.
Supply support for R9A07G054L18GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/V Series - including the R9A07G054L18GBG#AC0 - was designed specifically for vision AI at the edge, combining application processing, real-time control, and dedicated neural inference in a single industrial-grade package.
FAQ
What is the maximum supported LPDDR4x memory configuration for the R9A07G054L18GBG#AC0?
The R9A07G054L18GBG#AC0 supports dual-channel LPDDR4x memory up to 4 GB total capacity, with data rates up to 3200 MT/s. Each channel uses a 32-bit bus width, and the memory controller includes hardware ECC for single-bit error correction and detection - essential for reliable long-term operation in industrial vision systems. This configuration is validated in Renesas' RZ/V2L reference design boards.
Does the R9A07G054L18GBG#AC0 include hardware support for secure boot and runtime attestation?
Yes, the R9A07G054L18GBG#AC0 integrates a secure boot ROM with immutable root-of-trust, hardware cryptographic accelerators (AES-256, SHA-2, RSA-2048, TRNG), and Arm TrustZone-enabled memory isolation. It supports PSA Certified Level 2 and enables measured boot with hash-based firmware verification - all implemented without external security ICs. The R9A07G054L18GBG#AC0's SYSC module enforces secure world/non-secure world separation at silicon level.
Can the DRP-AI engine in the R9A07G054L18GBG#AC0 be programmed for custom neural network layers beyond standard CNNs?
Yes, the DRP-AI in the R9A07G054L18GBG#AC0 is a dynamically reconfigurable processor that accepts layer definitions via configuration bitstreams generated by Renesas' DRP-AI Translator toolchain. It supports convolution, pooling, activation (ReLU, sigmoid), and element-wise operations - enabling custom quantized layers (INT4/INT8) not limited to fixed CNN topologies. This capability is documented in the RZ/V2L DRP-AI User's Manual Rev.1.00.
What camera interfaces does the R9A07G054L18GBG#AC0 natively support, and what are their electrical specifications?
The R9A07G054L18GBG#AC0 features two native MIPI CSI-2 interfaces: one 4-lane port supporting up to 1.5 Gbps per lane (6 Gbps aggregate), and one 2-lane port. Both comply with MIPI CSI-2 v2.0 and support CPHY and DPHY modes. Electrical specs include 100 Ω differential impedance, ±100 mV common-mode voltage tolerance, and integrated termination - eliminating need for external CSI redrivers in most board layouts.
Is the R9A07G054L18GBG#AC0 qualified for extended temperature operation, and what is its industrial reliability rating?
Yes, the R9A07G054L18GBG#AC0 is rated for industrial temperature operation from −40°C to +85°C and classified as a "Standard" quality grade device per Renesas' internal categorization - intended for applications including factory automation, robotics, and commercial vision systems. It undergoes HTOL (High-Temperature Operating Life) testing per JESD22-A108 and meets JEDEC JESD47 reliability standards for 10-year field life under specified thermal and voltage conditions.
R9A07G054L18GBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 551-LFBGA
- Series:
- RZ/V2L
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 200MHz, 1.2GHz
- Co-Processors/DSP:
- ARM® Mali-G31, Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 551-LFBGA (21x21)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G054L18GBG#AC0 FAQ
1.How can I place an order for R9A07G054L18GBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G054L18GBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G054L18GBG#AC0 reliable?
The price and inventory of R9A07G054L18GBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G054L18GBG#AC0 is usually 5 days.
3.What payment methods are accepted for R9A07G054L18GBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G054L18GBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G054L18GBG#AC0?
R9A07G054L18GBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G054L18GBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G054L18GBG#AC0?
For technical support, including R9A07G054L18GBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G054L18GBG#AC0 requirements.
6.How does Aetrix verify that R9A07G054L18GBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R9A07G054L18GBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G054L18GBG#AC0 meets industry standards.
7.What is the process for return or replacement of R9A07G054L18GBG#AC0?
All R9A07G054L18GBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G054L18GBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G054L18GBG#AC0 part is unused and in its original packaging.
Return procedure for R9A07G054L18GBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A07G054L18GBG#AC0 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

