Renesas R9A07G054L28GBG#AC0

Overview

R9A07G054L28GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous microprocessor in the RZ/V2L Group, integrating an Arm Cortex-A55 application processor and an Arm Cortex-M33 real-time co-processor. It delivers 2.0 TOPS AI acceleration via the DRP-AI (Dynamically Reconfigurable Processor-AI), supports 4K HDR video processing, and operates within industrial temperature range (−40°C to +85°C) in a 21 mm × 21 mm 376-pin BGA package.

For engineers reviewing the R9A07G054L28GBG#AC0 datasheet, R9A07G054L28GBG#AC0 pinout, R9A07G054L28GBG#AC0 application, or R9A07G054L28GBG#AC0 equivalent, key selection criteria include its dual-CPU architecture, DRP-AI inference throughput, MIPI CSI-2/DSI interface support, eMMC 5.1 and Octal SPI boot capability, and industrial-grade thermal and reliability specifications.

Technical Context

The R9A07G054L28GBG#AC0 implements a tightly coupled heterogeneous compute architecture: the Cortex-A55 handles Linux-based application workloads (up to 1.2 GHz), while the Cortex-M33 manages deterministic real-time tasks (up to 400 MHz) and secure boot execution. Both cores share access to 2 MB L3 cache and a unified memory controller supporting LPDDR4x-4266.

Its DRP-AI accelerator executes CNN-based vision inference with configurable dataflow, achieving 2.0 TOPS at INT8 precision without external memory bandwidth bottlenecks. The device integrates hardware security features including TrustZone, cryptographic accelerators (AES-256, SHA-256, RSA-2048), and secure boot ROM with immutable root-of-trust.

Key Specifications

Pinout & Package

Package: 376-pin FBGA (21 mm × 21 mm, 0.65 mm pitch, 1.2 mm height), RoHS-compliant, industrial-grade thermal profile (θ_JA = 22°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous vision-SoC applications.

Compared with R9A07G054L28GBG#AC0, the R9A07G044L28GBG#AC0 removes AI capability while retaining identical real-time control and video features, whereas the i.MX 8M Plus offers higher NPU throughput but sacrifices the tightly coupled Cortex-M33 real-time domain and DRP-AI's low-latency configurability.

Availability

R9A07G054L28GBG#AC0 is available at Aetrix Electronics and suitable for smart surveillance systems, industrial vision inspection, medical imaging terminals, and autonomous mobile robot controllers requiring stable component supply across extended product lifecycles.

Supply support for R9A07G054L28GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RZ/V Series - including the R9A07G054L28GBG#AC0 - was designed specifically for AI-enabled vision edge devices requiring integrated real-time control, low-power 4K video processing, and hardware-enforced security.

FAQ

What is the primary function of the R9A07G054L28GBG#AC0 in an embedded vision system?

The R9A07G054L28GBG#AC0 serves as a full-featured vision SoC, integrating dual Arm CPUs (Cortex-A55 and Cortex-M33), a 2.0 TOPS DRP-AI accelerator, 4K video codec, MIPI CSI-2/DSI interfaces, and hardware security. In embedded vision systems, the R9A07G054L28GBG#AC0 concurrently runs Linux-based AI inference, real-time sensor control, and video encoding - eliminating need for discrete processors or AI coprocessors.

Does the R9A07G054L28GBG#AC0 support booting from eMMC 5.1?

Yes, the R9A07G054L28GBG#AC0 supports Boot Mode 1 (1.8-V eMMC) and Boot Mode 2 (3.3-V eMMC), both compliant with JEDEC eMMC 5.1 standards. The device initializes from eMMC using HS400 mode with UHS-I timing, enabling fast, reliable boot with secure authentication via the built-in boot ROM and TrustZone-enabled firmware validation.

What thermal and environmental specifications apply to the R9A07G054L28GBG#AC0?

The R9A07G054L28GBG#AC0 is rated for industrial temperature operation from −40°C to +85°C and qualifies as a "Standard" grade Renesas product per documentation. Its 376-pin FBGA package has a thermal resistance (θ_JA) of 22°C/W, and it requires a 4-layer PCB with dedicated thermal vias under the package for sustained 2.0 TOPS AI workload operation.

How does the DRP-AI accelerator in the R9A07G054L28GBG#AC0 differ from fixed-function NPUs?

The DRP-AI in the R9A07G054L28GBG#AC0 is a dynamically reconfigurable processor that adapts its dataflow architecture per neural network layer - unlike fixed-function NPUs. This enables efficient execution of diverse CNN topologies (e.g., ResNet, YOLO, EfficientNet) at 2.0 TOPS INT8 without performance cliffs or compiler limitations, preserving low latency and high utilization across model variants.

Is the R9A07G054L28GBG#AC0 pin-compatible with other RZ/V2L family members?

Yes, the R9A07G054L28GBG#AC0 shares identical 376-pin FBGA mechanical and electrical pinout with other RZ/V2L variants including R9A07G044L28GBG#AC0 and R9A07G055L28GBG#AC0. This enables hardware reuse across AI-capable and non-AI designs, with differentiation handled solely by firmware and DRP-AI configuration - no PCB redesign required.