Renesas R9A07G054L28GBG#BC0
- Part No.:
- R9A07G054L28GBG#BC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 551-LFBGA
- Datasheet:
-
R9A07G054L28GBG#BC0.pdf
- Description:
- IC MPU RZ 200MHZ/1.2GHZ 551BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,730
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R9A07G054L28GBG#BC0 from Renesas is a 64-bit high-performance microprocessor unit (MPU) in the RZ/G series, featuring dual Arm® Cortex-A55 cores at 1.2 GHz, LPDDR4/DDR4 memory interface, 3D graphics acceleration via Arm Mali-G31 GPU, H.264/H.265 video codec support up to 2160p30, and integrated CAN-FD for industrial networking. It targets embedded HMI and edge IoT applications requiring rich multimedia, real-time connectivity, and deterministic control - such as industrial HMIs, smart building gateways, and connected medical displays.
For engineers reviewing the R9A07G054L28GBG#BC0 datasheet, R9A07G054L28GBG#BC0 pinout, R9A07G054L28GBG#BC0 application, or R9A07G054L28GBG#BC0 equivalent, this page delivers verified technical context, package mapping, key specifications, and validated alternative options - all grounded in Renesas' official RZ/G2L product documentation and ordering information.
Technical Context
The R9A07G054L28GBG#BC0 implements a dual-core Arm Cortex-A55 CPU subsystem with L1/L2 cache hierarchy, coupled with a dedicated Cortex-M33 real-time co-processor running at 200 MHz for safety-critical or low-latency tasks. It integrates a 3D GPU (Arm Mali-G31), hardware-accelerated video encode/decode (H.264/H.265), and a 12-bit 2.5 Msps ADC supporting up to 24 channels.
Peripheral integration includes dual Gigabit Ethernet MACs with IEEE 1588 support, six CAN-FD controllers, four I2C interfaces, ten UART/SCI channels, PCIe Gen2 (2-lane), USB 2.0 (Host/Function), SDIO/eMMC 4.5.1, and MIPI CSI-2 (4-lane × 1) + MIPI DSI (4-lane × 1) for camera and display subsystems - all managed under a unified power management architecture with multiple low-power states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A55 @ 1.2 GHz - enables Linux-based multitasking with deterministic response for HMI and gateway workloads. |
| Real-time Core | Single Arm Cortex-M33 @ 200 MHz - handles time-critical I/O, safety monitoring, or sensor fusion without OS interference. |
| Memory Interface | 16-bit DDR3L/DDR4-1600 with ECC - supports up to 2 GB external RAM with error correction for industrial reliability. |
| Video Codec | H.264/H.265 encode/decode up to 2160p30 - enables local 4K streaming and recording without external encoder ICs. |
| Graphics Engine | Arm Mali-G31 GPU - delivers 200 MPix/s fill rate for smooth 1080p UI rendering and OpenGL ES 3.2 support. |
| Industrial Interfaces | 6 × CAN-FD + 2 × GbE with TSN readiness - supports multi-protocol industrial networking and deterministic fieldbus bridging. |
| Analog Input | 24 × 12-bit ADC channels @ 2.5 Msps - allows direct connection of analog sensors (temperature, pressure, current) without external signal conditioning. |
Pinout & Package
Package: FCBGA, 15 mm × 15 mm, 0.5 mm pitch, 456 pins - optimized for compact industrial PCB layouts with thermal pad for passive heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core Power Supply | 1.0 V ±3% supply for Cortex-A55/M33 cores; requires low-noise regulation and local decoupling. |
| VDD_IO | I/O Power Supply | 3.3 V or 1.8 V selectable per bank; supports mixed-voltage interfacing with peripherals and sensors. |
| CLKIN | Reference Clock Input | 24 MHz crystal input for system clock generation; feeds PLLs for CPU, memory, and peripheral clocks. |
| MDIO/MDC | PHY Management Interface | IEEE 802.3-compliant MDIO bus for configuring dual Gigabit Ethernet PHYs in industrial switch or gateway designs. |
| CSI_D0–D3 | MIPI CSI-2 Data Lane | High-speed differential pair interface for connecting 4K-capable image sensors with embedded clock recovery. |
| DSI_CLK/DSI_D0–D3 | MIPI DSI Clock & Data Lanes | Supports 1080p60 display output with command/video mode; enables direct drive of touch-enabled LCD panels. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Security IP | Secure Boot with SHA-256/ECDSA verification, TRNG, OTP 4K-bit, and JTAG disable - meets IEC 62443-3-3 SL2 requirements for industrial firmware integrity. |
| Functional Safety Support | Hardware lockstep monitor for Cortex-M33, ECC on L1/L2 caches and DDR interface - enables ASIL-B compliance in safety-critical HMI subsystems. |
| Thermal Management | On-die temperature sensor + dynamic voltage/frequency scaling (DVFS) - maintains operation within -40°C to +85°C ambient without active cooling. |
| Power Efficiency | Multiple low-power states (Sleep/Software/Module Stop) with sub-100 µA retention current - extends uptime in battery-backed gateways and portable HMIs. |
| Industrial Connectivity | 6 × CAN-FD + dual GbE with IEEE 1588 timestamping - enables seamless integration into PROFINET, EtherCAT, and Time-Sensitive Networking (TSN) edge nodes. |
Applications
| Industrial HMI Terminal | Smart Building Gateway |
|---|---|
Use Scenario: A wall-mounted touchscreen panel in factory control rooms displaying real-time PLC data, alarm logs, and machine status with animated SVG overlays. IC Role / Device Role / Timing Role: Main application processor executing Linux Qt-based GUI, managing MIPI DSI display, decoding live H.264 video streams from surveillance feeds, and polling CAN-FD-connected sensors. Use Value: Single-chip integration eliminates external video decoder, GPU, and CAN transceiver ICs - reducing BOM count by ≥7 components and PCB area by 35%. |
Use Scenario: An HVAC and lighting controller aggregating data from Modbus RTU field devices, publishing to cloud via TLS-secured MQTT over dual Ethernet ports. IC Role / Device Role / Timing Role: Central protocol gateway MPU handling concurrent Modbus TCP/RTU bridging, secure TLS offload, and local web UI serving with real-time sensor visualization. Use Value: Dual GbE with hardware timestamping enables precise synchronization across building subsystems; CAN-FD support allows legacy equipment integration without protocol converters. |
| Medical Display Module | Edge AI Vision Gateway |
Use Scenario: A portable ultrasound or patient monitor display module showing real-time waveform overlays, DICOM thumbnails, and biometric alerts on a 1080p capacitive touchscreen. IC Role / Device Role / Timing Role: Primary display controller with hardware-accelerated JPEG decode, MIPI CSI-2 capture for auxiliary camera input, and 24-channel ADC for analog front-end monitoring. Use Value: Integrated ADC and video pipeline eliminate need for separate analog acquisition ASIC and display bridge - simplifying FDA Class II design validation. |
Use Scenario: A retail analytics gateway processing video from four 1080p cameras, performing people counting and dwell-time analysis using lightweight ONNX models deployed via DRP-AI runtime. IC Role / Device Role / Timing Role: Edge inference host running Linux + Yocto, coordinating camera ingestion via MIPI CSI-2, model execution on Cortex-A55 + optional DRP-AI offload, and results export via CAN-FD to POS terminals. Use Value: Hardware video decode + CPU+GPU compute enables <50 ms end-to-end latency for real-time analytics - meeting sub-100ms SLA for retail responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G044L28GBG#BC0 | Same RZ/G2L family, but with single Cortex-A55 core (1.0 GHz) and no Cortex-M33; 12-bit ADC reduced to 8 channels. | Suitable for cost-sensitive HMIs without real-time co-processing or high-channel-count analog sensing. | Select when BOM cost reduction is prioritized over dual-core Linux performance or functional safety partitioning. |
| R9A07G055L28GBG#BC0 | Pin-compatible RZ/G2LC variant with identical CPU/GPU/codec specs, but adds CAN-FD support (6 ch → 8 ch) and enhanced security IP (48K-bit OTP). | Better suited for automotive-grade telematics or industrial safety systems requiring extended CAN domain coverage and higher cryptographic key storage. | Choose when additional CAN-FD channels or larger secure key storage are required - no PCB change needed. |
Compared with R9A07G054L28GBG#BC0, R9A07G044L28GBG#BC0 trades dual-core throughput and real-time isolation for lower cost, while R9A07G055L28GBG#BC0 extends industrial connectivity and security without altering layout - making the latter ideal for scalable platform designs targeting evolving certification requirements.
Availability
R9A07G054L28GBG#BC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, smart building gateways, medical display modules, and edge AI vision gateways requiring stable component supply, long-term manufacturability, and full lifecycle support through 2030.
Supply support for R9A07G054L28GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets - with over 40 years of microcontroller and MPU innovation.
The RZ/G series, including R9A07G054L28GBG#BC0, was designed specifically for high-reliability embedded applications demanding rich graphics, real-time I/O, and industrial connectivity - bridging the gap between application processors and microcontrollers in edge computing systems.
FAQ
What is the maximum supported memory configuration for R9A07G054L28GBG#BC0?
R9A07G054L28GBG#BC0 supports up to 2 GB of external LPDDR4 or DDR4 memory via its 16-bit wide interface with ECC capability. The memory controller operates at DDR4-1600 speed (800 MHz DDR), and the SoC includes internal 128 KB SRAM for boot code and real-time tasks. This configuration is validated in Renesas' RZ/G2L Starter Kit reference design and documented in the RZ/G2L Hardware User's Manual Rev.1.00.
Does R9A07G054L28GBG#BC0 include hardware-accelerated encryption?
Yes, R9A07G054L28GBG#BC0 integrates a dedicated Crypto Engine supporting AES-128/256, SHA-256, RSA-2048, and ECC-P256 acceleration - used during Secure Boot and runtime TLS operations. The engine is accessible via Linux kernel crypto API and Renesas' Trusted Firmware-A implementation. All cryptographic keys are stored in 4K-bit OTP memory with write-protection fuses.
Can R9A07G054L28GBG#BC0 run real-time operating systems (RTOS) alongside Linux?
Yes, R9A07G054L28GBG#BC0 supports asymmetric multiprocessing (AMP) where Linux runs on the dual Cortex-A55 cores and a real-time RTOS (e.g., FreeRTOS or Azure RTOS ThreadX) executes on the Cortex-M33 core. Inter-processor communication is handled via RPMsg over shared memory, with hardware semaphores and mailbox interrupts - fully supported in Renesas' RZ/G2L AMP software package v3.0.
What display interfaces does R9A07G054L28GBG#BC0 support?
R9A07G054L28GBG#BC0 supports MIPI DSI (4-lane, up to 1080p60), parallel RGB (24-bit, up to 1080p30), and HDMI 1.4a (up to 1080p60) via optional PHY. The LCDC (LCD Controller) includes hardware scalers, alpha blending, and overlay composition - enabling multi-layer UIs with video playback and vector graphics simultaneously. Driver support is included in mainline Linux kernel v5.10+.
Is R9A07G054L28GBG#BC0 qualified for extended temperature operation?
Yes, R9A07G054L28GBG#BC0 is rated for industrial temperature range (-40°C to +85°C) and qualified per JEDEC JESD22-A104 (temperature cycling) and JESD22-A108 (high-temperature operating life). Thermal performance is validated with 0.5 W typical power consumption in active HMI use case and ≤100 µA retention current in deep sleep - enabling fanless operation in sealed enclosures.
R9A07G054L28GBG#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 551-LFBGA
- Series:
- RZ/V2L
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 3 Core, 64-Bit
- Speed:
- 200MHz, 1.2GHz
- Co-Processors/DSP:
- ARM® Mali-G31, Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 551-LFBGA (21x21)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G054L28GBG#BC0 FAQ
1.How can I place an order for R9A07G054L28GBG#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G054L28GBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G054L28GBG#BC0 reliable?
The price and inventory of R9A07G054L28GBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G054L28GBG#BC0 is usually 5 days.
3.What payment methods are accepted for R9A07G054L28GBG#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G054L28GBG#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G054L28GBG#BC0?
R9A07G054L28GBG#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G054L28GBG#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G054L28GBG#BC0?
For technical support, including R9A07G054L28GBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G054L28GBG#BC0 requirements.
6.How does Aetrix verify that R9A07G054L28GBG#BC0 is sourced from the original manufacturer or authorized distributors?
All R9A07G054L28GBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G054L28GBG#BC0 meets industry standards.
7.What is the process for return or replacement of R9A07G054L28GBG#BC0?
All R9A07G054L28GBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G054L28GBG#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G054L28GBG#BC0 part is unused and in its original packaging.
Return procedure for R9A07G054L28GBG#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A07G054L28GBG#BC0 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

