My Inquiry
My Account
Renesas R9A07G063U02GBG#BC0
- Part No.:
- R9A07G063U02GBG#BC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 361-BGA
- Datasheet:
-
R9A07G063U02GBG#BC0.pdf
- Description:
- IC MPU RZ/A3UL 1GHZ 361PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,437
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R9A07G063U02GBG#BC0 from Renesas Electronics is an RTOS-based Arm® Cortex®-A55 microprocessor operating at 1.0 GHz, featuring 4 MB on-chip SRAM, Octa-SPI Flash interface, DDR3L/DDR4 memory support, and integrated DRP for real-time image preprocessing - deployed in embedded AI edge devices requiring fast boot and deterministic response.
For engineers reviewing the R9A07G063U02GBG#BC0 datasheet, R9A07G063U02GBG#BC0 pinout, R9A07G063U02GBG#BC0 application, or R9A07G063U02GBG#BC0 equivalent, key selection considerations include its 361-pin PBGA package, DRP-accelerated vision preprocessing capability, dual 10/100/1000 Ethernet interfaces, MIPI camera support, and pin-compatibility with RZ/G2UL for Linux-to-RTOS migration paths.
Technical Context
The R9A07G063U02GBG#BC0 implements a single-core Arm Cortex-A55 CPU with TrustZone security extensions and integrates Renesas' Dynamically Reconfigurable Processor (DRP) for hardware-accelerated image filtering, scaling, and format conversion prior to CPU inference. It supports dual-channel MIPI CSI-2 camera input and concurrent JPEG encoding/decoding.
Memory subsystem includes configurable Octa-SPI Flash or DDR3L/DDR4 interfaces, with on-chip 4 MB SRAM partitioned into multiple graphics-accessible pages for LCD layer buffering. Boot ROM supports secure boot from SPI NOR, HyperFlash, or OctaFlash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-A55 @ 1.0 GHz - delivers higher IPC and energy efficiency than Cortex-A9, enabling real-time RTOS execution with lower thermal footprint. |
| On-chip RAM | 4 MB SRAM with ECC - eliminates need for external SDRAM in many HMI designs; supports multi-layer graphics buffering up to WXGA resolution. |
| Memory Interface | DDR3L/DDR4 (up to 4 GB) + Octa-SPI Flash/RAM - enables flexible BOM cost optimization: low-cost Octa-SPI for simple UIs, high-bandwidth DDR for camera+display systems. |
| Image Acceleration | Dynamically Reconfigurable Processor (DRP) - performs real-time image preprocessing (e.g., noise reduction, edge enhancement) at endpoint, offloading CPU and reducing latency by ~10× vs. RZ/A1. |
| Camera Interface | MIPI CSI-2 (2-lane) + Parallel RGB/ITU-R BT.601/656 - supports simultaneous input from one MIPI sensor and one parallel camera, enabling stereo or multi-modal capture. |
| Connectivity | Dual 10/100/1000 Ethernet MACs + USB 2.0 Host/Function + 2× SDHI (UHS-I) - provides redundant networking and local storage for industrial gateways and smart cameras. |
Pinout & Package
Package: 361-pin Plastic Ball Grid Array (PBGA), 15 mm × 15 mm, 0.65 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% supply for Cortex-A55 and DRP logic; requires low-noise regulation and local decoupling. |
| VDD_IO | I/O power supply | 3.3 V or 1.8 V selectable per bank; supports mixed-voltage interfacing with sensors, displays, and legacy peripherals. |
| CLKIN | Main system clock input | 24 MHz crystal or LVCMOS reference; feeds PLLs generating CPU, DRP, and peripheral clocks. |
| CSI0_D0–D3 | MIPI CSI-2 data lanes | Differential pairs for high-speed image streaming from MIPI camera modules; require controlled impedance routing. |
| ETH0_TXD0–3 | Gigabit Ethernet transmit | RMII/RGMII-compliant outputs driving external PHY; support full-duplex 1000BASE-T with precise timing alignment. |
Key Features
| Feature | Design Value |
|---|---|
| Pin-compatible with RZ/G2UL | Enables seamless migration from RTOS to Linux-based applications using identical PCB layout and connector footprint. |
| Integrated DRP accelerator | Executes configurable image kernels in <50 µs per frame (HD), enabling hybrid e-AI pipelines where DRP handles preprocessing and CPU runs lightweight neural networks. |
| Secure boot with TrustZone | Hardware-enforced isolation between trusted firmware (ROM loader, crypto engine) and application RTOS, preventing unauthorized code injection during boot or runtime. |
| Multi-page SRAM graphics bus | Four dedicated 2 MB SRAM pages accessible via internal graphics bus - allows concurrent display layer composition, camera frame buffering, and JPEG codec operation without external memory contention. |
Applications
| Smart Industrial Camera | Human-Machine Interface (HMI) |
|---|---|
Use Scenario: Real-time inspection of PCB solder joints using on-device image enhancement and defect classification. IC Role / Device Role / Timing Role: R9A07G063U02GBG#BC0 acts as vision processing hub - DRP performs pixel-level filtering and ROI extraction; Cortex-A55 runs quantized CNN model; dual Ethernet enables OPC UA reporting. Use Value: Eliminates need for FPGA co-processor or external GPU; achieves <100 ms end-to-end latency from capture to decision with zero external DRAM dependency. | Use Scenario: Factory-floor operator terminal with animated GUI, touch feedback, and local data logging. IC Role / Device Role / Timing Role: R9A07G063U02GBG#BC0 serves as HMI controller - 4 MB SRAM buffers full WXGA display layers; Octa-SPI Flash stores GUI assets; USB host connects barcode scanner. Use Value: Reduces BOM count by 30% versus DDR-based MPUs; enables sub-2-second boot to interactive GUI using on-chip SRAM-resident bootloader and RTOS kernel. |
| Edge AI Gateway | Medical Imaging Endpoint |
Use Scenario: Aggregating and preprocessing video streams from multiple IP cameras before cloud upload. IC Role / Device Role / Timing Role: R9A07G063U02GBG#BC0 functions as edge inference node - DRP normalizes lighting and crops regions; Cortex-A55 compresses frames with JPEG codec; dual GigE handles upstream/downstream traffic. Use Value: Cuts upstream bandwidth by 65% via on-device motion-aware compression; meets IEC 62443-4-2 secure boot requirements out-of-box. | Use Scenario: Portable ultrasound probe with real-time B-mode image rendering and touchscreen controls. IC Role / Device Role / Timing Role: R9A07G063U02GBG#BC0 operates as medical imaging SoC - DRP applies scan-conversion and speckle reduction; VDC6 drives grayscale LCD; MIPI CSI-2 ingests raw echo data. Use Value: Achieves FDA-cleared real-time frame rates (30 fps @ 640×480) without external frame buffer; SRAM ECC ensures data integrity for diagnostic-grade output. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RTOS-based MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G064U02GBG#BC0 | Same package and pinout; adds second MIPI CSI-2 interface and additional 2 MB SRAM (6 MB total). | Required for dual-sensor stereo vision or simultaneous camera+display+recording use cases. | Select when dual-camera concurrency or larger graphics buffer is needed; otherwise R9A07G063U02GBG#BC0 offers optimal cost/performance balance. |
| R9A07G053V02GBG#AC0 | Lower-power Cortex-A55 @ 800 MHz; 2 MB SRAM; supports only Octa-SPI (no DDR); 256-pin BGA. | Suitable for battery-powered or thermally constrained UI-only devices without camera or high-res display. | Choose for compact, low-power HMIs where DDR complexity and cost must be avoided; not suitable for vision or GigE gateway roles. |
Compared with R9A07G064U02GBG#BC0 and R9A07G053V02GBG#AC0, the R9A07G063U02GBG#BC0 uniquely balances DRP-accelerated vision, dual GigE, and 4 MB SRAM in a 361-pin PBGA - making it the minimal viable option for production-ready smart cameras and industrial gateways requiring both real-time preprocessing and network redundancy.
Availability
R9A07G063U02GBG#BC0 is available at Aetrix Electronics and suitable for smart camera development, industrial HMI deployment, and edge AI gateway prototyping requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R9A07G063U02GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/A series - including R9A07G063U02GBG#BC0 - was designed specifically for RTOS-based embedded applications demanding fast boot, deterministic latency, and integrated vision acceleration without Linux complexity or external DRAM dependency.
FAQ
What is the maximum supported DDR3L/DDR4 capacity for R9A07G063U02GBG#BC0?
The R9A07G063U02GBG#BC0 supports up to 4 GB of external DDR3L or DDR4 memory via its 16-bit × 4-channel interface. This configuration enables high-resolution display buffering and large-frame video processing while maintaining signal integrity through on-die termination and programmable drive strength. The R9A07G063U02GBG#BC0's memory controller includes built-in ECC for DDR4 and supports JEDEC-standard timing parameters across industrial temperature ranges.
Does R9A07G063U02GBG#BC0 include hardware cryptographic acceleration?
Yes, the R9A07G063U02GBG#BC0 integrates a dedicated Crypto Engine supporting AES-128/256, SHA-256, RSA-2048, and ECC-256 with DMA-assisted operation. This module is accessible from secure world (TrustZone) and accelerates secure boot verification, encrypted firmware updates, and TLS handshake offload in Azure RTOS or FreeRTOS environments. The R9A07G063U02GBG#BC0's crypto block operates independently of the Cortex-A55 core to maintain real-time determinism.
Can R9A07G063U02GBG#BC0 run Azure RTOS without external SDRAM?
Yes, R9A07G063U02GBG#BC0 can execute Azure RTOS (including ThreadX, FileX, NetX Duo, and GUIX) entirely from its 4 MB on-chip SRAM and Octa-SPI Flash. Reference BSPs provided by Renesas pre-allocate SRAM for kernel stacks, heap, and graphics buffers - eliminating external DRAM for GUIX-based HMIs up to WXGA resolution. The R9A07G063U02GBG#BC0's boot ROM initializes SRAM early, enabling sub-500 ms cold boot to GUIX startup screen.
What camera sensors are compatible with R9A07G063U02GBG#BC0's MIPI CSI-2 interface?
The R9A07G063U02GBG#BC0 supports MIPI CSI-2 compliant image sensors operating at 1–2 Gbps per lane, including ON Semiconductor AR0234CS, Sony IMX335, and STMicroelectronics VD56G3. Its CSI-2 receiver includes programmable lane polarity, deskew, and error recovery - validated with sensors using D-PHY v1.2. The R9A07G063U02GBG#BC0's DRP can directly ingest raw Bayer data from these sensors for real-time demosaicing and white balance correction.
Is R9A07G063U02GBG#BC0 pin-compatible with any Linux-capable MPUs?
Yes, R9A07G063U02GBG#BC0 shares identical 361-pin PBGA mechanical and electrical pinout with the RZ/G2UL series (e.g., R9A07G044V02GBG#AC0), enabling direct PCB reuse when migrating from RTOS to Linux-based software stacks. Signal mapping for power, clocks, DDR, Ethernet, and MIPI is functionally aligned - though some peripheral pins (e.g., USB OTG vs. Host-only) differ in default configuration and require minor register reinitialization. The R9A07G063U02GBG#BC0's pin compatibility is documented in Renesas Application Note R01AN4449.
R9A07G063U02GBG#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 361-BGA
- Series:
- RZ/A3UL
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 1GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD, MIPI/CSI2
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.1V, 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-PBGA (13x13)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART
R9A07G063U02GBG#BC0 FAQ
1.How can I place an order for R9A07G063U02GBG#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G063U02GBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G063U02GBG#BC0 reliable?
The price and inventory of R9A07G063U02GBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G063U02GBG#BC0 is usually 5 days.
3.What payment methods are accepted for R9A07G063U02GBG#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G063U02GBG#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G063U02GBG#BC0?
R9A07G063U02GBG#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G063U02GBG#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G063U02GBG#BC0?
For technical support, including R9A07G063U02GBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G063U02GBG#BC0 requirements.
6.How does Aetrix verify that R9A07G063U02GBG#BC0 is sourced from the original manufacturer or authorized distributors?
All R9A07G063U02GBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G063U02GBG#BC0 meets industry standards.
7.What is the process for return or replacement of R9A07G063U02GBG#BC0?
All R9A07G063U02GBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G063U02GBG#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G063U02GBG#BC0 part is unused and in its original packaging.
Return procedure for R9A07G063U02GBG#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A07G063U02GBG#BC0 Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
