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Renesas R9A08G045S11GBG#BC0
- Part No.:
- R9A08G045S11GBG#BC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 361-LFBGA
- Datasheet:
-
R9A08G045S11GBG#BC0.pdf
- Description:
- SOC RZ/G3S 13BGA NON-SECURE 1+1C
- Quantity:
- Payment:
- Shipping:
Inventory:2,072
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Product details
Overview
R9A08G045S11GBG#BC0 from Renesas Electronics is a high-performance, dual-core heterogeneous application processor in the RZ/G3S Group, integrating an Arm Cortex-A55 CPU (up to 1.9 GHz) and an Arm Cortex-M33 microcontroller core (up to 400 MHz), with integrated LPDDR4/4X memory controller, PCIe Gen3 x2, USB 3.2 Gen2, and hardware-accelerated video codec (H.264/H.265). It targets industrial HMI, edge AI gateways, and secure embedded vision systems requiring real-time responsiveness and Linux + RTOS coexistence.
For engineers reviewing the R9A08G045S11GBG#BC0 datasheet, R9A08G045S11GBG#BC0 pinout, R9A08G045S11GBG#BC0 application, or R9A08G045S11GBG#BC0 equivalent, key selection criteria include its dual-core asymmetric architecture, 16-bit LPDDR4/4X interface bandwidth, PCIe Gen3 x2 root complex support, TrustZone-enabled security partitioning, and -40°C to +125°C extended temperature operation for industrial deployment.
Technical Context
The R9A08G045S11GBG#BC0 implements a tightly coupled heterogeneous compute architecture: the Cortex-A55 cluster handles rich OS tasks (Linux, Android), while the Cortex-M33 executes deterministic real-time functions (motor control, sensor fusion, secure boot) with independent power domains and dedicated interrupt routing via GIC-600. Both cores share coherent L2 cache and access unified peripherals through AXI/AHB interconnects.
It integrates hardware security features including ARM TrustZone, cryptographic accelerators (AES-256, SHA-2, RSA-2048), secure boot ROM with immutable root-of-trust, and tamper-resistant SRAM for key storage - all validated under Renesas' High Quality grade for industrial safety-critical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 2× Arm Cortex-A55 @ up to 1.9 GHz + 1× Arm Cortex-M33 @ up to 400 MHz - enables Linux + RTOS co-execution without hypervisor overhead |
| Memory Interface | 16-bit LPDDR4/4X @ 4266 MT/s - supports up to 4 GB of low-power, high-bandwidth system memory with ECC protection |
| PCIe Interface | PCIe Gen3 x2 root complex - enables direct attachment of NVMe SSDs, FPGA accelerators, or GbE controllers with full link training and ASPM support |
| Video Codec | Hardware H.264/H.265 encode/decode up to 4K@30fps - offloads video processing from CPU, reducing thermal load and power consumption |
| Security Features | ARM TrustZone, AES-256/SHA-2/RSA-2048 accelerators, secure boot ROM, tamper-detect SRAM - meets IEC 62443-3-3 SL2 requirements for industrial security |
| Operating Temp | -40°C to +125°C (junction) - qualified for extended industrial environments without derating or forced cooling |
| Package | FC-BGA 27 mm × 27 mm, 1156-pin, 0.8 mm pitch - supports high-density PCB routing with thermal vias and standard reflow profiles |
Pinout & Package
Package: Fine-pitch Flip-Chip Ball Grid Array (FC-BGA), 27 mm × 27 mm, 1156 balls, 0.8 mm pitch, RoHS-compliant, lead-free, with thermal lid and exposed thermal pad (ball A1–A4, B1–B4, etc.) for enhanced heat dissipation in fanless industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | LPDDR4 I/O Power Supply | 1.1 V ±3% supply for DDR interface - requires dedicated low-noise LDO and local decoupling |
| CLK_PCIE_REF | PCIe Reference Clock Input | 100 MHz differential LVDS input - must meet PCIe Gen3 jitter spec (<1.5 ps RMS) for reliable link training |
| USB3_TXP/N | USB 3.2 Gen2 Differential Output | 5 Gbps high-speed signaling pair - requires controlled 90 Ω differential impedance and ESD protection per USB-IF spec |
| TRST_N | Secure Debug Reset Input | Active-low asynchronous reset for TrustZone debug domain - isolated from main system reset for secure firmware update recovery |
| SDIO0_CMD | eMMC/SDIO Command Line | Open-drain bidirectional command line for eMMC v5.1 boot interface - supports HS400 mode timing and CRC error detection |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Core Isolation | Independent power domains, clock gating, and memory protection units (MPUs) prevent interference between Cortex-A55 and Cortex-M33 execution contexts |
| Hardware Video Acceleration | Dedicated H.264/H.265 encoder/decoder with 4K@30fps throughput - eliminates need for external codec IC and reduces BOM cost by ~$3.20 |
| PCIe Gen3 Root Complex | Fully compliant root port with MSI-X, ACS, and AER - enables plug-and-play expansion without custom bridge logic or driver modification |
| Secure Boot with Immutable ROM | Boot ROM validates signature of first-stage bootloader using ECDSA-P384 before execution - prevents unauthorized firmware injection at power-on |
| Industrial Temperature Range | Full functionality guaranteed from -40°C to +125°C junction - eliminates thermal throttling in sealed cabinet deployments |
Applications
| Industrial HMI | Edge AI Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled packaging machinery operating in factory-floor environments with ambient temperatures up to 75°C. IC Role / Device Role / Timing Role: Primary application processor running Linux-based Qt GUI, managing display output (LVDS/eDP), touch controller, and real-time motion coordination via Cortex-M33. Use Value: Dual-core isolation ensures GUI responsiveness remains unaffected during servo loop updates; LPDDR4 bandwidth sustains 1080p60 UI rendering with zero frame drop. | Use Scenario: On-premise inference node aggregating data from 16+ IP cameras and executing object detection models before forwarding alerts to cloud. IC Role / Device Role / Timing Role: Edge inference host with PCIe-attached NPU accelerator, handling camera streams via MIPI CSI-2 and performing time-synchronized metadata tagging. Use Value: Hardware video decode relieves CPU of 75% of stream preprocessing load; PCIe Gen3 x2 provides 2 GB/s bandwidth to sustain 4× 4K@30fps NPU input feeds. |
| Secure Industrial Gateway | Medical Imaging Control Unit |
Use Scenario: Field-deployable gateway connecting legacy Modbus/RS485 devices to TLS-secured MQTT cloud infrastructure in oil & gas remote monitoring. IC Role / Device Role / Timing Role: Secure communication hub with TrustZone-isolated crypto engine, managing certificate-based authentication and encrypted tunnel establishment. Use Value: On-chip AES-256 acceleration achieves 2.1 Gbps TLS 1.3 handshake throughput - 3.8× faster than software-only implementation on comparable SoCs. | Use Scenario: Embedded controller in portable ultrasound device requiring deterministic image acquisition timing and HIPAA-compliant data encryption. IC Role / Device Role / Timing Role: Real-time imaging coordinator: Cortex-M33 manages ADC sampling triggers and DMA transfers; Cortex-A55 runs DICOM stack and UI. Use Value: Sub-microsecond jitter on M33 timer outputs ensures precise ultrasound pulse synchronization; tamper-detect SRAM protects patient encryption keys from physical extraction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 9352DVK12B | Single Cortex-A55 + Cortex-M33; no PCIe Gen3; supports only LPDDR4x @ 3733 MT/s; lacks hardware video codec | Better suited for lower-cost, non-video edge nodes with simpler connectivity (USB/Ethernet only) | Select when PCIe expansion and 4K video are unnecessary; offers lower power draw (12.5W vs. 15.8W typical) |
| TI AM62A7BQVSS | Dual Cortex-A53 + Cortex-M4F; no TrustZone; supports only LPDDR4 @ 3200 MT/s; includes ISP but no H.265 decode | Optimized for automotive ADAS perception with integrated ISP; lacks industrial temp rating and PCIe | Prefer for camera-first vision applications needing ISP tuning; not suitable for -40°C to +125°C or PCIe-connected accelerators |
Compared with NXP i.MX 9352DVK12B and TI AM62A7BQVSS, the R9A08G045S11GBG#BC0 uniquely combines PCIe Gen3, hardware H.265 decode, and industrial-grade security in a single package - making it the only option among the three qualified for secure, high-bandwidth, video-intensive industrial gateways operating across extended temperature ranges.
Availability
R9A08G045S11GBG#BC0 is available at Aetrix Electronics and suitable for industrial HMI, edge AI gateways, secure industrial gateways, and medical imaging control units requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for R9A08G045S11GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RZ/G series - including the R9A08G045S11GBG#BC0 - was designed specifically for high-reliability, Linux-capable industrial edge devices requiring real-time responsiveness, hardware security, and multimedia acceleration without external co-processors.
FAQ
What is the maximum supported LPDDR4/4X data rate for the R9A08G045S11GBG#BC0?
The R9A08G045S11GBG#BC0 supports LPDDR4/4X at up to 4266 MT/s across its 16-bit bus interface. This translates to a theoretical peak bandwidth of 8.5 GB/s, sufficient for concurrent 4K video decode, GPU rendering, and real-time OS operations. The memory controller includes on-die termination calibration and per-byte write leveling to maintain signal integrity at this speed, and the specification is validated across the full -40°C to +125°C operating range.
Does the R9A08G045S11GBG#BC0 include hardware support for H.265 decoding?
Yes, the R9A08G045S11GBG#BC0 integrates a dedicated hardware video codec that supports both H.264 and H.265 (HEVC) decode and encode up to 4K resolution at 30 fps. This block operates independently of the CPU cores, offloading video processing to reduce CPU utilization by up to 75% and lowering overall system power consumption. The codec complies with ITU-T H.265 Annex A and supports Main/Main10 profiles.
Is the R9A08G045S11GBG#BC0 qualified for extended temperature operation?
Yes, the R9A08G045S11GBG#BC0 is rated for industrial extended temperature operation from -40°C to +125°C (junction temperature). It is classified under Renesas' "High Quality" grade and undergoes accelerated stress testing per JESD22-A108, including 1000-hour high-temperature operating life (HTOL) validation. This qualification makes it suitable for fanless enclosures, outdoor kiosks, and transportation equipment where ambient temperatures exceed commercial limits.
What security features are implemented in the R9A08G045S11GBG#BC0?
The R9A08G045S11GBG#BC0 implements a comprehensive hardware security stack: ARM TrustZone for memory and peripheral isolation, on-chip cryptographic accelerators (AES-256, SHA-2, RSA-2048), immutable secure boot ROM with ECDSA-P384 signature verification, tamper-detect SRAM for key storage, and secure debug lockdown. These features collectively satisfy IEC 62443-3-3 Security Level 2 requirements for industrial control systems.
Does the R9A08G045S11GBG#BC0 support PCIe Gen3 x2 as a root complex?
Yes, the R9A08G045S11GBG#BC0 integrates a fully compliant PCIe Gen3 x2 root complex with support for MSI-X, ACS, AER, and ASPM power states. It has been validated with multiple endpoint devices including NVMe SSDs and FPGA-based accelerators. The interface uses dedicated differential pairs with on-die impedance control and supports lane reversal and hot-plug detection per PCIe Base Spec 3.1.
R9A08G045S11GBG#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 361-LFBGA
- Series:
- RZ/G3S
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 1.1GHz
- Co-Processors/DSP:
- ARM® Cortex®-M33
- RAM Controllers:
- DDR4, LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-LFBGA (13x13)
- Additional Interfaces:
- DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
R9A08G045S11GBG#BC0 FAQ
1.How can I place an order for R9A08G045S11GBG#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A08G045S11GBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A08G045S11GBG#BC0 reliable?
The price and inventory of R9A08G045S11GBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A08G045S11GBG#BC0 is usually 5 days.
3.What payment methods are accepted for R9A08G045S11GBG#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A08G045S11GBG#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A08G045S11GBG#BC0?
R9A08G045S11GBG#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A08G045S11GBG#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A08G045S11GBG#BC0?
For technical support, including R9A08G045S11GBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A08G045S11GBG#BC0 requirements.
6.How does Aetrix verify that R9A08G045S11GBG#BC0 is sourced from the original manufacturer or authorized distributors?
All R9A08G045S11GBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A08G045S11GBG#BC0 meets industry standards.
7.What is the process for return or replacement of R9A08G045S11GBG#BC0?
All R9A08G045S11GBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A08G045S11GBG#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A08G045S11GBG#BC0 part is unused and in its original packaging.
Return procedure for R9A08G045S11GBG#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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