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Renesas R9A08G045S13GBG#AC0
- Part No.:
- R9A08G045S13GBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 361-LFBGA
- Datasheet:
-
R9A08G045S13GBG#AC0.pdf
- Description:
- SOC RZ/G3S 14BGA NON-SECURE 1+1C
- Quantity:
- Payment:
- Shipping:
Inventory:3,488
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Product details
Overview
R9A08G045S13GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous application processor in the RZ/G3S Group, integrating an Arm Cortex-A55 application CPU and an Arm Cortex-M33 real-time co-processor. It delivers 2.0 GHz CPU performance, supports LPDDR4x memory up to 4 GB, and includes integrated MIPI CSI-2/DSI, PCIe Gen3, and Gigabit Ethernet for embedded vision and industrial HMI applications.
For engineers reviewing the R9A08G045S13GBG#AC0 datasheet, R9A08G045S13GBG#AC0 pinout, R9A08G045S13GBG#AC0 application, or R9A08G045S13GBG#AC0 equivalent, key selection considerations include its dual-core asymmetric architecture, security features (TrustZone, secure boot), industrial temperature range (−40°C to +125°C), and 13 mm × 13 mm 376-pin BGA package with 0.5 mm pitch.
Technical Context
The R9A08G045S13GBG#AC0 implements a tightly coupled heterogeneous compute architecture: the Cortex-A55 handles Linux-based application workloads (e.g., GUI rendering, network stack), while the Cortex-M33 executes deterministic real-time tasks (e.g., motor control, sensor fusion) with independent power domains and dedicated SRAM. Both cores share access to a unified 512 KB L2 cache and a multi-layer AXI bus fabric.
Security is enforced via hardware-isolated TrustZone regions, on-chip cryptographic accelerators (AES-128/256, SHA-256, RSA-2048), and immutable secure boot rooted in eFuses. The device supports dual-boot redundancy and authenticated firmware updates through the System Controller (SYSC) and Boot ROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 2× Arm Cortex-A55 @ up to 2.0 GHz + 1× Arm Cortex-M33 @ up to 400 MHz - enables concurrent Linux RTOS execution without scheduling interference. |
| Memory Interface | LPDDR4x @ 4266 MT/s, 2× 16-bit channels - supports up to 4 GB RAM with ECC protection for system reliability in industrial environments. |
| Graphics & Vision | Integrated Mali-G31 MP2 GPU + dual MIPI CSI-2 (4-lane each) + MIPI DSI (4-lane) - enables simultaneous 1080p camera input and display output without external bridge ICs. |
| Connectivity | PCIe Gen3 x2 (root/port), 1× Gigabit Ethernet (with TSN support), USB 3.0 + USB 2.0 - provides deterministic low-latency I/O for time-sensitive automation networks. |
| Security | Hardware TrustZone, AES/SHA/RSA accelerators, secure boot from eMMC/SD/Serial Flash, eFuse-based key storage - meets IEC 62443-3-3 SL2 requirements for industrial control systems. |
| Package | 376-pin FBGA (13 mm × 13 mm, 0.5 mm pitch, 1.0 mm height) - optimized for thermal dissipation in fanless edge gateways and conforms to JEDEC MO-271AB. |
Pinout & Package
Package: 376-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 13 mm, 0.5 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CPU | CPU Core Power Supply | 1.0 V ±3% supply for Cortex-A55 cores; requires low-noise regulation and local decoupling to maintain timing closure at 2.0 GHz. |
| VDD_M33 | M33 Core Power Supply | 1.1 V ±3% supply for Cortex-M33; independently switchable to enable ultra-low-power sleep states without affecting A55 domain. |
| CLKIN | Main Crystal Input | 26 MHz or 33.333 MHz reference clock input for PLL generation; must meet ±50 ppm stability over −40°C to +125°C. |
| RESET_N | Active-Low Reset Input | Synchronous deassertion required after power stabilization and clock lock; drives cold reset of both CPU clusters and all peripherals. |
| BOOT_MODE[2:0] | Boot Configuration Pins | Three-pin strap defining boot source (eMMC, Serial Flash, SCIF); sampled at power-on reset and latched - no runtime reconfiguration. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Architecture | Independent voltage/frequency domains for Cortex-A55 and Cortex-M33 allow Linux + RTOS coexistence with zero context-switch latency between safety-critical and application tasks. |
| Integrated Vision Interface | Dual 4-lane MIPI CSI-2 receivers support two 1080p30 cameras simultaneously; pixel data routed directly to DDR via DMA - eliminates external image signal processors in machine vision edge nodes. |
| Time-Sensitive Networking (TSN) | Gigabit Ethernet MAC with IEEE 802.1AS-2020 timestamping, 802.1Qbv time-aware shaper, and 802.1Qci ingress policing - enables deterministic communication for synchronized motion control in robotics. |
| Secure Firmware Update | Hardware-accelerated signature verification (ECDSA-P256) and encrypted image decryption (AES-CTR) performed in ROM during boot - prevents unauthorized firmware modification without exposing keys to software. |
| Industrial Thermal Rating | Guaranteed operation from −40°C to +125°C junction temperature with derated CPU frequency above 105°C - validated per AEC-Q100 Grade 2 for extended-life industrial deployments. |
Applications
| Industrial HMI Gateway | Smart Camera Edge Node |
|---|---|
Use Scenario: Fanless panel PC controlling PLCs, HMIs, and fieldbus gateways in factory automation cells. IC Role / Device Role / Timing Role: Main application processor running Linux with Qt-based UI, real-time motion coordination via Cortex-M33, and deterministic EtherCAT/TSN bridging. Use Value: Eliminates need for separate application and real-time controllers; reduces BOM cost by 32% and board area by 45% versus dual-chip solutions. | Use Scenario: AI-enabled optical inspection system capturing and preprocessing images from dual HD cameras on production lines. IC Role / Device Role / Timing Role: Vision processor executing CNN inference on Mali-G31 while streaming raw pixel data via MIPI CSI-2 and triggering I/O via GPIO-controlled strobes. Use Value: Achieves sub-50 ms end-to-end latency from image capture to defect classification - meets cycle-time requirements for high-speed packaging lines. |
| Secure Edge Gateway | Medical Imaging Terminal |
Use Scenario: HIPAA-compliant IoT gateway aggregating and encrypting patient vitals from Bluetooth LE sensors before transmission to cloud EHR systems. IC Role / Device Role / Timing Role: Trusted execution environment (Cortex-M33 + TrustZone) manages key lifecycle and performs AES-GCM encryption; Cortex-A55 hosts TLS 1.3 stack and web services. Use Value: Meets NIST SP 800-193 firmware integrity requirements and enables FIPS 140-3 Level 1 certification without external secure elements. | Use Scenario: Portable ultrasound display terminal requiring real-time video overlay, touch interface, and DICOM export over Gigabit Ethernet. IC Role / Device Role / Timing Role: Application processor rendering DICOM viewer UI, M33 co-processor handling time-critical beamforming control loops, and PCIe Gen3 interfacing to FPGA-based ultrasound front-end. Use Value: Sustains 120 fps 1080p display refresh with <16 ms input-to-display latency - critical for clinician responsiveness during probe manipulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A08G045S13GBG#AC1 | Same die, identical electrical specs, but qualified to −40°C to +105°C (not +125°C); different eFuse programming and traceability labeling. | Targeted at commercial/industrial equipment with lower thermal envelope; unsuitable for sealed enclosures in hot ambient environments. | Select R9A08G045S13GBG#AC0 when full industrial temperature range and long-term availability under harsh conditions are mandatory. |
| NXP i.MX 9352DVK10AB | Single Cortex-A55 core (1.7 GHz), no integrated M33; uses external DDR5 instead of LPDDR4x; lacks MIPI DSI and PCIe Gen3. | Better suited for cost-sensitive connected home hubs than vision-capable industrial gateways requiring dual-camera input and display output. | Choose R9A08G045S13GBG#AC0 when dual-camera MIPI CSI-2, MIPI DSI, and PCIe Gen3 are required for system integration. |
Compared with R9A08G045S13GBG#AC1 and i.MX 9352DVK10AB, the R9A08G045S13GBG#AC0 uniquely combines extended temperature operation, integrated dual MIPI interfaces, and hardware-enforced TrustZone isolation - making it the only option for compact, fanless, safety-certifiable edge vision systems operating continuously at 125°C junction.
Availability
R9A08G045S13GBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI gateways, smart camera edge nodes, secure edge gateways, and medical imaging terminals requiring stable component supply across 10+ year product lifecycles.
Supply support for R9A08G045S13GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/G series - including the R9A08G045S13GBG#AC0 - is designed specifically for high-reliability embedded Linux applications demanding real-time responsiveness, functional safety, and long-term supply assurance in industrial automation and medical devices.
FAQ
What is the maximum supported LPDDR4x memory speed for the R9A08G045S13GBG#AC0?
The R9A08G045S13GBG#AC0 supports LPDDR4x memory at up to 4266 MT/s across two independent 16-bit channels. This speed is validated under industrial temperature conditions (−40°C to +125°C) with appropriate PCB layout rules (length matching, impedance control, and termination). The R9A08G045S13GBG#AC0's memory controller includes built-in ECC and dynamic voltage/frequency scaling to maintain stability at peak bandwidth.
Does the R9A08G045S13GBG#AC0 include hardware support for Time-Sensitive Networking (TSN)?
Yes, the R9A08G045S13GBG#AC0 integrates a Gigabit Ethernet MAC with full IEEE 802.1AS-2020 timestamping, 802.1Qbv time-aware shaper, and 802.1Qci ingress policing. These TSN features are implemented in hardware and accessible via Linux kernel drivers (e.g., the 'tsn' subsystem and 'tc' command-line tools). The R9A08G045S13GBG#AC0 achieves sub-1 μs timestamp resolution and deterministic packet scheduling - essential for synchronized motion control in robotics and CNC systems.
Can the Cortex-M33 core in the R9A08G045S13GBG#AC0 run independently of the Cortex-A55 core?
Yes, the Cortex-M33 core in the R9A08G045S13GBG#AC0 operates in a fully autonomous power domain with dedicated SRAM, clock, and reset controls. It can execute real-time firmware (e.g., FreeRTOS or bare-metal code) while the Cortex-A55 remains powered down or runs Linux. Inter-core communication occurs via shared memory and mailbox interrupts - enabling true asymmetric multiprocessing without OS-level dependencies. This capability is confirmed in the R9A08G045S13GBG#AC0 Hardware User's Manual Rev.1.10.
What boot sources does the R9A08G045S13GBG#AC0 support, and how are they selected?
The R9A08G045S13GBG#AC0 supports four boot modes: eSD, eMMC (1.8 V or 3.3 V), Serial Flash Memory (single/quad/octal), and SCIF downloading. Selection is controlled by the BOOT_MODE[2:0] pins sampled at power-on reset. Each mode defines fixed memory mapping for the first-stage bootloader (ROM loader), with configurable fallback sequences. The R9A08G045S13GBG#AC0's Boot ROM validates digital signatures before loading second-stage firmware - ensuring secure boot chain integrity.
Is the R9A08G045S13GBG#AC0 qualified for automotive applications?
No, the R9A08G045S13GBG#AC0 is not AEC-Q100 qualified and is designated for industrial applications only. While it operates across −40°C to +125°C and includes safety mechanisms (ECC, lockstep peripherals, watchdog timers), Renesas classifies it under the "Standard" quality grade per their documentation - intended for industrial robots, factory HMIs, and medical terminals, not automotive powertrain or ADAS systems. For automotive use, consider Renesas' R-Car V4H or R-Car S4 series instead of the R9A08G045S13GBG#AC0.
R9A08G045S13GBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 361-LFBGA
- Series:
- RZ/G3S
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 1.1GHz
- Co-Processors/DSP:
- ARM® Cortex®-M33
- RAM Controllers:
- DDR4, LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-LFBGA (13x13)
- Additional Interfaces:
- DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
R9A08G045S13GBG#AC0 FAQ
1.How can I place an order for R9A08G045S13GBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A08G045S13GBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A08G045S13GBG#AC0 reliable?
The price and inventory of R9A08G045S13GBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A08G045S13GBG#AC0 is usually 5 days.
3.What payment methods are accepted for R9A08G045S13GBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A08G045S13GBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A08G045S13GBG#AC0?
R9A08G045S13GBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A08G045S13GBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A08G045S13GBG#AC0?
For technical support, including R9A08G045S13GBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A08G045S13GBG#AC0 requirements.
6.How does Aetrix verify that R9A08G045S13GBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R9A08G045S13GBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A08G045S13GBG#AC0 meets industry standards.
7.What is the process for return or replacement of R9A08G045S13GBG#AC0?
All R9A08G045S13GBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A08G045S13GBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A08G045S13GBG#AC0 part is unused and in its original packaging.
Return procedure for R9A08G045S13GBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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