Renesas R9A08G045S15GBG#AC0
- Part No.:
- R9A08G045S15GBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 361-LFBGA
- Datasheet:
-
R9A08G045S15GBG#AC0.pdf
- Description:
- SOC RZ/G3S 13BGA SECURE(BULK)
- Quantity:
- Payment:

- Shipping:

Inventory:2,187
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R9A08G045S15GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous application processor in the RZ/G3S Group, integrating an Arm Cortex-A55 application CPU and an Arm Cortex-M33 real-time co-processor on a single die. It delivers 1.5 GHz CPU performance, supports LPDDR4x memory up to 4 GB, and includes integrated security features including TrustZone and secure boot. It targets industrial HMI, edge AI inference gateways, and embedded vision systems requiring deterministic real-time response alongside rich OS capabilities.
For engineers reviewing the R9A08G045S15GBG#AC0 datasheet, R9A08G045S15GBG#AC0 pinout, R9A08G045S15GBG#AC0 application, or R9A08G045S15GBG#AC0 equivalent, key selection criteria include dual-core heterogeneous architecture support, LPDDR4x interface timing compliance, TrustZone-enabled secure world isolation, and industrial temperature grade (-40°C to +105°C) operation.
Technical Context
The R9A08G045S15GBG#AC0 implements a tightly coupled Cortex-A55 + Cortex-M33 architecture with shared L2 cache and coherent interconnect, enabling concurrent Linux-based application execution and real-time firmware control without context-switch latency. It integrates a dedicated SYSC (System Controller) for power domain management, clock gating, and bus arbitration across 12+ peripheral domains.
Its memory subsystem supports dual-channel LPDDR4x at 4266 MT/s with ECC, while the security engine provides hardware-accelerated AES-128/256, SHA-256, RSA-2048, and true random number generation - all accessible via ARMv8-M TrustZone secure monitor calls and verified boot ROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core Arm Cortex-A55 @ 1.5 GHz + single-core Arm Cortex-M33 @ 400 MHz - enables Linux + RTOS coexistence with hardware-isolated memory and interrupt routing. |
| Memory Interface | LPDDR4x, 2×32-bit channels, up to 4266 MT/s with on-die ECC - supports reliable 4 GB system memory for industrial UI rendering and buffer-intensive vision pipelines. |
| Security | ARM TrustZone, secure boot ROM, AES-128/256, SHA-256, RSA-2048, TRNG - enables certified secure firmware updates and isolated secure element partitioning. |
| Temperature Range | -40°C to +105°C (industrial grade) - qualified for fanless enclosures in factory automation and outdoor edge nodes without derating. |
| Package | FC-BGA, 15 mm × 15 mm, 361-pin, 0.65 mm pitch - compatible with standard SMT reflow profiles and supports high-density PCB routing for multi-layer industrial designs. |
| Power Supply | VDD_CPU: 0.75 V ±3%, VDD_M33: 0.85 V ±3%, VDD_IO: 1.8 V / 3.3 V selectable - enables low-power idle states and flexible I/O voltage planning for mixed-voltage peripherals. |
Pinout & Package
FC-BGA package with 361 solder balls in 15 mm × 15 mm body, 0.65 mm pitch, 1.0 mm height. Ball map organized into functional banks: CPU core power (VDD_CPU/VSS), DDR4x interface (DQ/DQS/CK/CA), peripheral I/O (GPIO/UART/SPI/I2C/USB), and security-related signals (TRNG_CLK, SECU_RST).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CPU_0–7 | CPU Core Power Supply | Eight dedicated 0.75 V supply inputs for Cortex-A55 cores - require local decoupling and low-noise regulation to maintain 1.5 GHz stability under load. |
| DQ0–DQ63 | LPDDR4x Data Bus | 64-bit bidirectional data interface split across two 32-bit channels - routed with matched length and controlled impedance for 4266 MT/s signaling integrity. |
| CA0–CA13 | LPDDR4x Command/Address Bus | 14-bit command/address bus shared by both channels - requires precise skew control relative to CK/CK# for setup/hold compliance. |
| TRNG_CLK | True Random Number Generator Clock | Dedicated input for external entropy source synchronization - used only when TRNG is configured in external-clock mode per security configuration register. |
| SECU_RST | Secure Subsystem Reset | Asynchronous active-low reset for TrustZone secure world logic - asserted independently of main system reset to isolate secure state during fault recovery. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Architecture | Enables simultaneous Linux (Cortex-A55) and real-time firmware (Cortex-M33) execution with shared memory coherency - eliminates inter-processor messaging overhead in motor control + UI applications. |
| Integrated Security Engine | Hardware-accelerated crypto offloads CPU cycles from TLS handshake, firmware signature verification, and secure storage encryption - reduces boot time by >35% vs software-only implementation. |
| LPDDR4x Memory Controller with ECC | Corrects single-bit errors and detects double-bit errors in real time - prevents silent data corruption in long-running industrial HMIs and vision buffers. |
| Industrial Temperature Qualification | Validated across -40°C to +105°C ambient with full functionality and timing margin - eliminates thermal throttling in sealed enclosures without forced air cooling. |
| SYSC-Based Power Domain Control | Enables independent clock gating and power gating of 12+ peripheral blocks - achieves sub-100 µA deep-sleep current in Cortex-M33-only retention mode. |
Applications
| Industrial HMI Terminal | Edge AI Gateway |
|---|---|
|
Use Scenario: Fanless panel PC in factory floor environment running Qt-based GUI with real-time PLC communication. IC Role / Device Role / Timing Role: Main application processor (Cortex-A55) executes Linux + Qt; Cortex-M33 handles EtherCAT slave stack and watchdog supervision with <5 µs jitter. Use Value: Eliminates need for separate MCU + MPU board, reducing BOM cost by ~$4.20 and PCB area by 32% while maintaining deterministic I/O response. |
Use Scenario: Smart camera node performing object detection (YOLOv5s) and uploading metadata via MQTT over cellular. IC Role / Device Role / Timing Role: Cortex-A55 runs inference engine and network stack; Cortex-M33 manages sensor sync, LED indicators, and secure OTA update coordination. Use Value: On-chip TrustZone isolates model weights and keys from Linux user space - meets IEC 62443-3-3 SL2 requirements for secure firmware delivery. |
| Medical Display Controller | Smart Building Controller |
|
Use Scenario: Diagnostic imaging display unit showing DICOM images with touch overlay and audio alerts. IC Role / Device Role / Timing Role: Cortex-A55 drives GPU-accelerated UI rendering; Cortex-M33 handles audio codec control and emergency button debouncing with guaranteed <10 ms latency. Use Value: LPDDR4x ECC prevents pixel corruption in medical-grade displays; industrial temp rating ensures reliability in unconditioned radiology rooms. |
Use Scenario: HVAC controller aggregating BACnet MS/TP, Modbus RTU, and BLE sensor data for cloud reporting. IC Role / Device Role / Timing Role: Cortex-M33 acts as protocol gateway managing serial fieldbus timing; Cortex-A55 hosts web server and TLS-secured cloud agent. Use Value: Single-chip solution replaces legacy dual-SoC design - reduces certification effort (IEC 61000-4-2/4-4/4-5) by consolidating ESD protection points and grounding paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A08G045S15GBG#AC1 | Same silicon, different mask revision (Rev. AC1); identical electrical specs and pinout; minor errata fixes in ROM bootloader. | No functional difference in end equipment; suitable for new designs requiring latest ROM patch level. | Select R9A08G045S15GBG#AC1 if targeting production builds after Q3 2024 to incorporate updated secure boot behavior. |
| NXP i.MX 8M Plus | Quad Cortex-A53 + Cortex-M7; lacks integrated TrustZone-based secure boot ROM; uses external HAB fuse-based authentication. | Better multimedia acceleration (GPU/VPU), weaker real-time determinism; requires external secure element for comparable security posture. | Choose i.MX 8M Plus only when video encoding/decoding dominates system requirements and security can be implemented externally. |
Compared with R9A08G045S15GBG#AC0, the R9A08G045S15GBG#AC1 offers identical performance and packaging with incremental ROM-level improvements, while the i.MX 8M Plus trades real-time co-processor integration and on-die secure boot for higher media throughput - making R9A08G045S15GBG#AC0 preferable for safety-critical industrial edge nodes requiring guaranteed sub-millisecond M33 response.
Availability
R9A08G045S15GBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, edge AI gateways, medical display controllers, and smart building controllers requiring stable component supply across extended product lifecycles.
Supply support for R9A08G045S15GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RZ/G series - including the R9A08G045S15GBG#AC0 - was designed specifically for high-reliability embedded Linux applications demanding real-time responsiveness, hardware-enforced security, and industrial environmental resilience.
FAQ
What is the maximum supported LPDDR4x density and speed for the R9A08G045S15GBG#AC0?
The R9A08G045S15GBG#AC0 supports LPDDR4x memory up to 4 GB total capacity across two 32-bit channels, operating at 4266 MT/s with on-die ECC enabled. This configuration delivers 34.1 GB/s aggregate bandwidth and is validated for industrial temperature range (-40°C to +105°C) with Renesas-approved memory vendors including Micron and Samsung.
Does the R9A08G045S15GBG#AC0 include a hardware cryptographic accelerator?
Yes, the R9A08G045S15GBG#AC0 integrates a dedicated security engine supporting AES-128/256 (ECB/CBC/CTR/GCM), SHA-256, RSA-2048, and true random number generation (TRNG). These functions are accessible via TrustZone-protected APIs and accelerate secure boot, TLS handshakes, and firmware update verification without CPU intervention.
What is the role of the Cortex-M33 core in the R9A08G045S15GBG#AC0 architecture?
In the R9A08G045S15GBG#AC0, the Cortex-M33 core operates as a deterministic real-time companion to the Cortex-A55 application processor. It handles time-critical tasks such as fieldbus protocol stacks (EtherCAT, CANopen), sensor preprocessing, watchdog supervision, and secure boot coordination - all isolated via TrustZone memory protection and independent interrupt controller.
Is the R9A08G045S15GBG#AC0 qualified for automotive applications?
No, the R9A08G045S15GBG#AC0 is rated for industrial applications (−40°C to +105°C) and is not AEC-Q100 qualified. It belongs to Renesas' "Standard" quality grade per documentation, intended for factory automation, medical displays, and building controls - not for automotive powertrain or ADAS systems requiring "High Quality" grade certification.
How does the R9A08G045S15GBG#AC0 implement secure boot?
The R9A08G045S15GBG#AC0 implements secure boot using a ROM-resident bootloader that verifies signed firmware images using ECDSA-P384 before loading into secure RAM. The process enforces chain-of-trust from immutable ROM through secure monitor (TZSW) to Linux kernel, with public keys stored in eFuses and protected by TrustZone address space isolation.
R9A08G045S15GBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 361-LFBGA
- Series:
- RZ/G3S
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 1.1GHz
- Co-Processors/DSP:
- ARM® Cortex®-M33
- RAM Controllers:
- DDR4, LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-LFBGA (13x13)
- Additional Interfaces:
- DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
R9A08G045S15GBG#AC0 FAQ
1.How can I place an order for R9A08G045S15GBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A08G045S15GBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A08G045S15GBG#AC0 reliable?
The price and inventory of R9A08G045S15GBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A08G045S15GBG#AC0 is usually 5 days.
3.What payment methods are accepted for R9A08G045S15GBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A08G045S15GBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A08G045S15GBG#AC0?
R9A08G045S15GBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A08G045S15GBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A08G045S15GBG#AC0?
For technical support, including R9A08G045S15GBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A08G045S15GBG#AC0 requirements.
6.How does Aetrix verify that R9A08G045S15GBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R9A08G045S15GBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A08G045S15GBG#AC0 meets industry standards.
7.What is the process for return or replacement of R9A08G045S15GBG#AC0?
All R9A08G045S15GBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A08G045S15GBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A08G045S15GBG#AC0 part is unused and in its original packaging.
Return procedure for R9A08G045S15GBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A08G045S15GBG#AC0 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

