Renesas R9A08G045S17GBG#AC0

Overview

R9A08G045S17GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous application processor in the RZ/G3S Group, integrating an Arm Cortex-A55 CPU (up to 1.9 GHz) and an Arm Cortex-M33_FPU (up to 400 MHz), with 4 MB on-chip SRAM, DDR4/LPDDR4x memory interface, and hardware-accelerated video codec support for 4K60 H.265 decode. It targets industrial HMIs, edge AI gateways, and secure IoT edge nodes requiring real-time responsiveness and Linux/RTOS coexistence.

For engineers reviewing the R9A08G045S17GBG#AC0 datasheet, R9A08G045S17GBG#AC0 pinout, R9A08G045S17GBG#AC0 application, or R9A08G045S17GBG#AC0 equivalent, key selection criteria include dual-core asymmetric architecture, integrated security engine (TrustZone + Crypto Accelerator), 17mm × 17mm 484-pin BGA package with 0.5 mm pitch, and industrial temperature range (−40°C to +105°C).

Technical Context

The R9A08G045S17GBG#AC0 implements a tightly coupled heterogeneous compute architecture: the Cortex-A55 cluster handles rich OS tasks (Linux-based UI, networking, application logic), while the Cortex-M33_FPU executes deterministic real-time control, sensor fusion, and secure boot services. Both cores share coherent L2 cache and access unified system memory via AXI bus interconnect.

Hardware security is implemented through Arm TrustZone, a dedicated Cryptographic Acceleration Engine (AES-256/GCM, SHA-256, RSA-2048), and secure boot ROM with immutable root-of-trust. The device supports boot from eMMC, serial flash, or SCIF, with configurable boot mode pins and hardware-enforced image authentication.

Key Specifications

Pinout & Package

Package: 484-pin Fine-Pitch Ball Grid Array (FBGA), 17 mm × 17 mm body, 0.5 mm ball pitch, 0.8 mm maximum height, RoHS-compliant matte tin finish. Thermal pad on underside for enhanced heat dissipation in fanless industrial enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous application processor applications.

Compared with R9A08G045S17GBG#AC0, the #AC1 variant delivers identical silicon performance with factory-hardened boot assets, while the i.MX 8M Plus trades integrated video decode and real-time MCU co-processing for higher AI throughput-making R9A08G045S17GBG#AC0 optimal for video-centric, security-critical industrial edge systems.

Availability

R9A08G045S17GBG#AC0 is available at Aetrix Electronics and suitable for industrial HMIs, edge AI gateways, and secure IoT edge nodes requiring stable component supply across extended product lifecycles and rigorous environmental qualification.

Supply support for R9A08G045S17GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/G series - including the R9A08G045S17GBG#AC0 - is designed specifically for high-reliability industrial and embedded Linux applications demanding real-time responsiveness, hardware security, and long-term availability.

FAQ

What is the maximum operating frequency of each CPU core in the R9A08G045S17GBG#AC0?

The R9A08G045S17GBG#AC0 features two independently clocked CPU clusters: the dual-core Arm Cortex-A55 operates up to 1.9 GHz, while the single-core Arm Cortex-M33_FPU runs up to 400 MHz. These frequencies are guaranteed across the full industrial temperature range (−40°C to +105°C) under specified voltage and cooling conditions per the Renesas RZ/G3S Hardware User's Manual Rev.1.10.

Does the R9A08G045S17GBG#AC0 include on-die SRAM, and how is it allocated between cores?

Yes, the R9A08G045S17GBG#AC0 integrates 4 MB of on-chip SRAM, partitioned as 2 MB tightly coupled memory (TCM) for the Cortex-A55 cluster and 2 MB TCM for the Cortex-M33_FPU. This allocation enables zero-wait-state access for time-critical code and data, eliminating dependency on external memory for real-time tasks and secure boot routines in the R9A08G045S17GBG#AC0.

What video decode capabilities does the R9A08G045S17GBG#AC0 support, and are there any encode functions?

The R9A08G045S17GBG#AC0 supports hardware-accelerated decode only: H.265 (HEVC) and H.264 (AVC) up to 4K resolution at 60 fps. It does not include video encoding capability. This dedicated decode engine offloads the Cortex-A55 cores, enabling efficient video playback in digital signage and surveillance applications without consuming CPU cycles in the R9A08G045S17GBG#AC0.

How is security implemented in the R9A08G045S17GBG#AC0, and does it support secure boot?

Security in the R9A08G045S17GBG#AC0 is implemented via Arm TrustZone for hardware-enforced memory isolation, a dedicated Cryptographic Acceleration Engine (AES-256-GCM, SHA-256, RSA-2048), and a one-time-programmable (OTP) secure boot ROM with immutable root-of-trust. Secure boot is fully supported and verified in the R9A08G045S17GBG#AC0, enforcing signature validation of all bootloader stages before execution.

What is the package type and pin count of the R9A08G045S17GBG#AC0, and is it RoHS compliant?

The R9A08G045S17GBG#AC0 uses a 484-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 17 mm × 17 mm with 0.5 mm ball pitch. It is RoHS-compliant with matte tin surface finish and qualified for lead-free reflow soldering per J-STD-020. Full mechanical drawings and land pattern recommendations are provided in the RZ/G3S Hardware User's Manual for the R9A08G045S17GBG#AC0.