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Renesas R9A08G045S35GBG#AC0
- Part No.:
- R9A08G045S35GBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 361-LFBGA
- Datasheet:
-
R9A08G045S35GBG#AC0.pdf
- Description:
- SOC RZ/G3S 13BGA SECURE 1+2CPU(B
- Quantity:
- Payment:
- Shipping:
Inventory:4,238
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Product details
Overview
R9A08G045S35GBG#AC0 from Renesas Electronics is a high-performance, dual-core heterogeneous application processor in the RZ/G3S Group, integrating an Arm Cortex-A55 CPU (up to 1.5 GHz) and an Arm Cortex-M33 microcontroller core (up to 400 MHz), with integrated LPDDR4/4X memory controller, PCIe Gen3 x2, USB 3.2 Gen2, and hardware-accelerated video codec (H.264/H.265). It targets industrial HMI, edge AI gateways, and secure embedded vision systems.
For engineers reviewing the R9A08G045S35GBG#AC0 datasheet, R9A08G045S35GBG#AC0 pinout, R9A08G045S35GBG#AC0 application, or R9A08G045S35GBG#AC0 equivalent, key selection considerations include its dual-core asymmetric architecture, TrustZone-enabled security partitioning, LPDDR4X-4266 support, -40°C to +125°C extended temperature grade, and BGA package with 1156 balls (27 mm × 27 mm, 0.8 mm pitch).
Technical Context
The R9A08G045S35GBG#AC0 implements a tightly coupled heterogeneous compute architecture: the Cortex-A55 cluster handles rich OS execution (Linux, Android), while the Cortex-M33_FPU manages real-time control, sensor fusion, and secure boot services. Both cores share coherent L2 cache and access unified system memory via AXI bus interconnect.
Hardware security includes Arm TrustZone, cryptographic accelerators (AES-256, SHA-2, RSA-2048), secure boot ROM with immutable root-of-trust, and tamper-resistant SRAM for key storage. The device supports dual-channel LPDDR4X at 4266 MT/s with ECC, and integrates MIPI CSI-2 (4-lane) and DSI (4-lane) for camera/display interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core Arm Cortex-A55 @ up to 1.5 GHz + single-core Arm Cortex-M33_FPU @ up to 400 MHz - enables concurrent Linux-based application processing and deterministic real-time firmware execution. |
| Memory Interface | LPDDR4X-4266, dual-channel, 32-bit per channel with ECC - delivers >34 GB/s memory bandwidth and fault-tolerant operation for mission-critical applications. |
| PCIe Interface | PCIe Gen3 x2 (root complex or endpoint) - supports direct attachment of NVMe SSDs, FPGA accelerators, or GbE controllers without bridge chips. |
| Video Codec | Hardware H.264/H.265 encode/decode up to 4K@30fps - offloads video processing from CPU, reducing power and latency in vision edge nodes. |
| Security Features | Arm TrustZone, AES-256/SHA-2/RSA-2048 accelerators, secure boot ROM, tamper-resistive SRAM - enables certified secure boot, encrypted firmware updates, and isolated trusted execution environments. |
| Temperature Range | -40°C to +125°C (junction) - qualified for extended industrial and transportation environments without derating. |
| Package | FC-BGA, 1156-ball, 27 mm × 27 mm, 0.8 mm pitch, Pb-free, RoHS-compliant - compatible with standard SMT reflow profiles and industrial PCB assembly lines. |
Pinout & Package
Package: Fine-pitch Flip-Chip Ball Grid Array (FC-BGA), 1156 I/O balls, 27 mm × 27 mm body, 0.8 mm ball pitch, 1.2 mm height, RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR0/VDD_DDR1 | LPDDR4X I/O and core supply | Separate 1.1 V supplies for dual-channel DDR I/O domains - enables independent power gating and noise isolation between memory channels. |
| CLKIN_33M | Main system clock input | 33.333 MHz differential reference clock input for PLL synthesis - required for generating all internal clocks including CPU, DDR, and PCIe. |
| PCIE_RX[1:0]/TX[1:0] | PCIe Gen3 differential lanes | Two full-duplex Gen3 lanes supporting x2 link width - electrically compliant with PCIe CEM v5.0, supports spread-spectrum clocking and LTSSM control. |
| CSI0_DATA[3:0]/CLK | MIPI CSI-2 camera interface | Four data lanes + clock lane supporting 4-lane configuration at up to 2.5 Gbps per lane - enables direct connection to 12 MP+ image sensors with low-latency streaming. |
| USB3_DP/DM | USB 3.2 Gen2 differential pair | Single-lane SuperSpeed+ interface operating at 10 Gbps - supports Type-C DRD mode with integrated PHY and link layer, eliminating external transceivers. |
| BOOT_MODE[2:0] | Strap pins for boot source selection | Three-pin encoded configuration determining primary boot device (eMMC, serial flash, SCIF) - sampled at power-on reset, latched before firmware execution begins. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Architecture | Independent Cortex-A55 (Linux-capable) and Cortex-M33_FPU (real-time RTOS) cores sharing L2 cache - eliminates need for separate application and microcontroller SoCs in edge gateway designs. |
| Integrated LPDDR4X Memory Controller | Supports 4266 MT/s data rate with on-die ECC and dynamic voltage/frequency scaling - reduces BOM cost and board area versus discrete memory + controller solutions. |
| Hardware Video Acceleration | Fixed-function H.264/H.265 encoder and decoder with 4K@30fps capability - achieves <100 mW encode power at 1080p, enabling fanless thermal design. |
| TrustZone-Based Security Subsystem | Dedicated secure world boot ROM, cryptographic accelerators, and memory firewall - provides hardware-enforced isolation between secure firmware and general-purpose OS without software hypervisor overhead. |
| Industrial Temperature Qualification | Full functionality guaranteed from -40°C to +125°C junction temperature - validated across temperature cycling, HTOL, and ESD tests per AEC-Q100 Grade 2 requirements. |
Applications
| Industrial HMI | Edge AI Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time alarm handling and local data logging. IC Role / Device Role / Timing Role: Primary application processor running Qt-based Linux UI, with Cortex-M33 managing CANopen fieldbus communication and deterministic I/O response. Use Value: Single-chip integration replaces dual-SoC design, reducing latency between HMI rendering and fieldbus event handling to <50 µs via shared memory IPC. | Use Scenario: On-premise inference node aggregating video streams from 4 IP cameras and executing YOLOv5s models for defect detection. IC Role / Device Role / Timing Role: Vision processing hub with hardware video decode, NPU-adjacent memory bandwidth, and PCIe-connected AI accelerator. Use Value: LPDDR4X-4266 bandwidth sustains 4× 1080p30 decode + model inference pipeline at <2 W total SoC power, enabling passive cooling. |
| Secure Video Surveillance | Automotive Diagnostic Tool |
Use Scenario: Tamper-evident network camera with encrypted video stream signing and secure over-the-air firmware updates. IC Role / Device Role / Timing Role: Root-of-trust anchor with secure boot ROM, hardware crypto engines, and isolated secure world for key management. Use Value: AES-256-GCM encryption of H.265 streams at line rate (4K@30fps) without CPU load, meeting FIPS 140-3 Level 1 certification requirements. | Use Scenario: Handheld OBD-II scanner with UDS protocol stack, CAN FD diagnostics, and Bluetooth LE connectivity to service tablets. IC Role / Device Role / Timing Role: Real-time diagnostic controller with Cortex-M33 handling ISO 15765-2/11898-1 timing-critical CAN FD frames and Cortex-A55 managing UI and cloud sync. Use Value: Hardware CAN FD controller achieves <1 µs jitter on 5 Mbps frames, ensuring compliance with automotive OEM timing specifications for ECU reprogramming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A08G045S35GBG#AC1 | Same die, identical electrical specs, but shipped with different factory-programmed boot firmware and security key provisioning. | Targeted for customers requiring pre-provisioned secure boot keys and signed bootloader images from Renesas. | Select #AC1 when secure supply chain traceability and zero-touch provisioning are mandatory; #AC0 requires customer-managed key injection. |
| NXP i.MX 8M Plus | Lacks integrated PCIe Gen3, uses LPDDR4-4266 (no X suffix), no hardware H.265 decode, and only Cortex-A53 cores (no A55). | Better suited for cost-sensitive multimedia HMI where AI acceleration relies on external NPU, not on-chip vision pipelines. | Choose i.MX 8M Plus if PCIe expansion is unnecessary and thermal budget allows higher CPU power draw for software video decode. |
Compared with R9A08G045S35GBG#AC0, the #AC1 variant offers factory-provisioned security assets for accelerated certification, while the i.MX 8M Plus trades PCIe Gen3 and H.265 decode for broader ecosystem tooling and lower unit cost in non-PCIe, non-4K video use cases.
Availability
R9A08G045S35GBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI, edge AI gateways, and secure video surveillance systems requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability validation.
Supply support for R9A08G045S35GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RZ/G series - including the R9A08G045S35GBG#AC0 - is designed for high-reliability embedded Linux applications demanding real-time responsiveness, hardware security, and rich peripheral integration in harsh environments.
FAQ
What is the maximum supported LPDDR4X speed for the R9A08G045S35GBG#AC0?
The R9A08G045S35GBG#AC0 supports LPDDR4X memory at up to 4266 MT/s across two independent 32-bit channels. This speed is validated under industrial temperature conditions (-40°C to +125°C) with on-die ECC enabled. The memory controller implements adaptive refresh, write-leveling, and read-leveling calibration to maintain signal integrity at this data rate. R9A08G045S35GBG#AC0 requires matched trace lengths and strict impedance control (40 Ω ±5%) on all DQ/DQS/CK nets for reliable operation.
Does the R9A08G045S35GBG#AC0 include hardware support for CAN FD?
No, the R9A08G045S35GBG#AC0 does not integrate a CAN FD controller. It supports Ethernet (10/100/1000BASE-T), PCIe, USB 3.2, and MIPI interfaces, but lacks native CAN or CAN FD peripherals. For CAN FD connectivity, external controllers such as the Renesas R7F701701 or standalone CAN FD transceivers with GPIO/software bit-banging (not recommended for production) must be used. R9A08G045S35GBG#AC0's Cortex-M33 can manage CAN FD protocol stacks when paired with external PHYs.
What boot devices are supported by the R9A08G045S35GBG#AC0?
The R9A08G045S35GBG#AC0 supports four primary boot modes selected via BOOT_MODE[2:0] straps: Boot Mode 0 (eSD), Boot Mode 1 (1.8-V or 3.3-V eMMC), Boot Mode 2 (Serial Flash Memory - single/quad/octal SPI), and Boot Mode 3 (SCIF downloading via UART). Each mode defines the initial loader location and initialization sequence. R9A08G045S35GBG#AC0's ROM bootloader validates signature and hash of the first-stage firmware before execution, enforcing secure boot chain integrity.
Is the R9A08G045S35GBG#AC0 qualified for automotive applications?
The R9A08G045S35GBG#AC0 is rated for industrial temperature range (-40°C to +125°C) and meets Renesas' "High Quality" grade per documentation, but it is not AEC-Q100 qualified. It is intended for transportation equipment such as rail signaling or industrial vehicles, not safety-critical automotive ECUs. For automotive use, Renesas recommends the RZ/Five or RZ/V2L families. R9A08G045S35GBG#AC0 lacks ASIL-B certification, automotive-specific failure-in-time (FIT) reporting, and extended reliability test coverage required for passenger vehicle deployment.
How is security implemented in the R9A08G045S35GBG#AC0?
Security in the R9A08G045S35GBG#AC0 is implemented through Arm TrustZone, dedicated cryptographic accelerators (AES-256, SHA-2, RSA-2048), immutable secure boot ROM, and tamper-resistant SRAM. The secure world enforces memory firewalling, isolates secure firmware from the Linux OS, and protects private keys. All boot stages are cryptographically verified using ECDSA-P384 signatures. R9A08G045S35GBG#AC0 supports secure debug disable and JTAG lockdown after provisioning. No software-only security bypasses are possible due to hardware-rooted trust.
R9A08G045S35GBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 361-LFBGA
- Series:
- RZ/G3S
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 1.1GHz
- Co-Processors/DSP:
- ARM® Cortex®-M33
- RAM Controllers:
- DDR4, LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-LFBGA (13x13)
- Additional Interfaces:
- DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
R9A08G045S35GBG#AC0 FAQ
1.How can I place an order for R9A08G045S35GBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A08G045S35GBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A08G045S35GBG#AC0 reliable?
The price and inventory of R9A08G045S35GBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A08G045S35GBG#AC0 is usually 5 days.
3.What payment methods are accepted for R9A08G045S35GBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A08G045S35GBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A08G045S35GBG#AC0?
R9A08G045S35GBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A08G045S35GBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A08G045S35GBG#AC0?
For technical support, including R9A08G045S35GBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A08G045S35GBG#AC0 requirements.
6.How does Aetrix verify that R9A08G045S35GBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R9A08G045S35GBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A08G045S35GBG#AC0 meets industry standards.
7.What is the process for return or replacement of R9A08G045S35GBG#AC0?
All R9A08G045S35GBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A08G045S35GBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A08G045S35GBG#AC0 part is unused and in its original packaging.
Return procedure for R9A08G045S35GBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A08G045S35GBG#AC0 Tags
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