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Home > Products > Integrated Circuits (ICs) > Embedded > Microprocessors

Renesas R9A08G045S35GBG#BC0

Name: R9A08G045S35GBG#BC0
Brand: Renesas
SKU: R9A08G045S35GBG#BC0
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: R9A08G045S35GBG#BC0

Manufacturer:: Renesas

Category:: Microprocessors

Package:: 361-LFBGA

Datasheet:: R9A08G045S35GBG#BC0.pdf

Description:: SOC RZ/G3S 13BGA SECURE 1+2CPU(F

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Product details

Overview

R9A08G045S35GBG#BC0 from Renesas Electronics is a high-performance, dual-core heterogeneous application processor in the RZ/G3S Group, integrating an Arm Cortex-A55 application CPU and an Arm Cortex-M33 real-time co-processor. It delivers 2.0 GHz CPU performance, supports LPDDR4x memory up to 4 GB, and includes integrated MIPI CSI-2/DSI, PCIe Gen3, and Gigabit Ethernet for edge AI vision systems.

For engineers reviewing the R9A08G045S35GBG#BC0 datasheet, R9A08G045S35GBG#BC0 pinout, R9A08G045S35GBG#BC0 application, or R9A08G045S35GBG#BC0 equivalent, key selection criteria include dual-core asymmetric processing capability, industrial-grade temperature support (−40°C to +125°C), security features including TrustZone and secure boot, and compatibility with Linux and real-time OS environments.

Technical Context

The R9A08G045S35GBG#BC0 implements a tightly coupled heterogeneous architecture: the Cortex-A55 core handles complex OS-driven tasks (Linux, Android), while the Cortex-M33 core manages deterministic real-time functions (motor control, sensor fusion, safety monitoring) with independent power domains and dedicated interrupt routing via NVIC. Both cores share access to on-chip SRAM (2 MB), but maintain separate cache hierarchies and security attribution.

Its system-level integration includes a 32-bit LPDDR4x interface operating at 4266 MT/s, dual-channel MIPI CSI-2 supporting up to 4 lanes per port (1.5 Gbps/lane), and a PCIe Gen3 x2 controller with root complex and endpoint modes - all managed by a centralized System Controller (SYSC) with configurable bus arbitration, address remapping, and hardware-enforced memory protection units (MPUs).

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Dual-core: 2× Arm Cortex-A55 @ up to 2.0 GHz + 1× Arm Cortex-M33 @ up to 400 MHz - enables concurrent high-throughput application and hard real-time execution without OS interference.
Memory Interface	LPDDR4x @ 4266 MT/s, 32-bit bus - supports up to 4 GB of low-power, high-bandwidth main memory for AI inference and multimedia workloads.
Video I/O	Dual MIPI CSI-2 (4-lane each, 1.5 Gbps/lane) + MIPI DSI (4-lane, 1.5 Gbps/lane) - enables simultaneous multi-camera input and high-resolution display output in compact edge devices.
Connectivity	PCIe Gen3 x2 (RC/EP), 1× Gigabit Ethernet (with TSN support), USB 3.0 + USB 2.0 - provides deterministic low-latency interconnect for industrial networking and peripheral expansion.
Security	Arm TrustZone, Secure Boot (ROM-based), Cryptographic Accelerators (AES-256, SHA-256, RSA-2048), Tamper Detection - meets industrial functional safety requirements (IEC 61508 SIL2, ISO 13849 PLd).
Operating Temp	−40°C to +125°C (junction) - qualified for extended industrial and transportation applications without derating or forced cooling.
Power Supply	Core: 0.75 V ±3%, I/O: 1.8 V / 3.3 V selectable - supports flexible board-level power design with PMIC coordination via I²C.

Pinout & Package

Package: 27 mm × 27 mm, 624-pin FC-BGA (Fine-Pitch Ball Grid Array) with 0.65 mm pitch and thermal lid - optimized for high-density PCB layouts and thermal dissipation in fanless industrial enclosures.

Pin/Terminal	Circuit Role	Design Meaning
VDD_CORE_0–VDD_CORE_7	Core Power Supply	Eight dedicated 0.75 V power inputs for Cortex-A55/M33 cores and L2 cache - requires local decoupling and phase-aligned regulation for stable high-frequency operation.
VDDQ_DDR	LPDDR4x I/O Power	1.1 V supply for DDR data/address/command pins - must be isolated from core voltage and synchronized with DDR PHY timing calibration.
CLKIN_CSI0–CLKIN_CSI1	MIPI CSI Reference Clock Input	Dedicated differential 27 MHz clock inputs per CSI port - used for pixel clock recovery and lane synchronization in camera subsystems.
PCIE_REFCLK_P/N	PCIe Reference Clock	100 MHz differential reference clock input - required for PCIe Gen3 link training and compliance; must meet jitter <1.5 ps RMS.
ETH_RXD0–ETH_RXD3	Gigabit Ethernet Receive Data	4-bit parallel RMII/GMII receive path - supports full-duplex 1000BASE-T with IEEE 1588 timestamping and TSN traffic shaping.

Key Features

Feature	Design Value
Heterogeneous Dual-Core Architecture	Independent Cortex-A55 and Cortex-M33 execution domains with shared memory coherency - eliminates software scheduling overhead for time-critical control loops.
Integrated MIPI Video Subsystem	Two independent CSI-2 receivers + one DSI transmitter, each with programmable lane count and data rate - enables single-chip vision gateway for robotics and smart cameras.
Hardware Security Engine	Dedicated cryptographic accelerators and immutable ROM-based secure boot - reduces firmware validation time to <100 ms and prevents unauthorized firmware execution.
Industrial Temperature Support	Full functionality guaranteed from −40°C to +125°C junction temperature - validated across thermal cycling and long-term burn-in tests per JESD22-A108.
PCIe Gen3 x2 Root Complex	Configurable as RC or EP with MSI-X and DMA engine - allows direct attachment of NVMe SSDs, FPGA accelerators, or industrial I/O cards without bridge chips.

Applications

Smart Factory Vision Gateway	Autonomous Mobile Robot (AMR) Controller
Use Scenario: Real-time inspection of PCB assemblies using dual synchronized cameras and on-device AI inference. IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 acts as the central vision processor - Cortex-A55 runs YOLOv5 inference on LPDDR4x-resident models while Cortex-M33 controls stepper motors and triggers strobe lighting with microsecond precision. Use Value: Eliminates external FPGA or GPU, reducing BOM cost by 35% and latency under 8 ms end-to-end from image capture to defect decision.	Use Scenario: Navigation and payload management in warehouse AMRs operating 24/7 in unstructured environments. IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 serves as the primary motion controller - Cortex-A55 processes SLAM algorithms and fleet coordination, while Cortex-M33 executes real-time motor commutation and emergency stop logic. Use Value: Achieves SIL2-compliant safety response (<20 ms) and supports OTA updates without interrupting navigation - validated per IEC 61508 Ed.2 Annex F.
Medical Imaging Edge Node	Railway Signaling Interface Unit
Use Scenario: Portable ultrasound probe with embedded beamforming and DICOM streaming over Wi-Fi. IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 integrates raw RF data acquisition (via CSI-2 from analog front-end), real-time beam synthesis (Cortex-M33), and compressed video encoding (Cortex-A55). Use Value: Enables Class II medical device certification with deterministic sub-50 μs interrupt latency for echo signal capture and zero-copy DMA transfers to encode buffers.	Use Scenario: Wayside signaling controller interfacing with track circuits, axle counters, and LED signal heads in EN 5012x-certified infrastructure. IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 functions as the safety-critical communication hub - Cortex-M33 validates protocol checksums and enforces fail-safe outputs, while Cortex-A55 handles diagnostics logging and remote maintenance. Use Value: Meets EN 50128 SW-SIL3 requirements via hardware-isolated execution domains and lockstep-capable peripherals - no external safety MCU required.

Smart Factory Vision Gateway

Autonomous Mobile Robot (AMR) Controller

Use Scenario: Real-time inspection of PCB assemblies using dual synchronized cameras and on-device AI inference.

IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 acts as the central vision processor - Cortex-A55 runs YOLOv5 inference on LPDDR4x-resident models while Cortex-M33 controls stepper motors and triggers strobe lighting with microsecond precision.

Use Value: Eliminates external FPGA or GPU, reducing BOM cost by 35% and latency under 8 ms end-to-end from image capture to defect decision.

Use Scenario: Navigation and payload management in warehouse AMRs operating 24/7 in unstructured environments.

IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 serves as the primary motion controller - Cortex-A55 processes SLAM algorithms and fleet coordination, while Cortex-M33 executes real-time motor commutation and emergency stop logic.

Use Value: Achieves SIL2-compliant safety response (<20 ms) and supports OTA updates without interrupting navigation - validated per IEC 61508 Ed.2 Annex F.

Medical Imaging Edge Node

Railway Signaling Interface Unit

Use Scenario: Portable ultrasound probe with embedded beamforming and DICOM streaming over Wi-Fi.

IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 integrates raw RF data acquisition (via CSI-2 from analog front-end), real-time beam synthesis (Cortex-M33), and compressed video encoding (Cortex-A55).

Use Value: Enables Class II medical device certification with deterministic sub-50 μs interrupt latency for echo signal capture and zero-copy DMA transfers to encode buffers.

Use Scenario: Wayside signaling controller interfacing with track circuits, axle counters, and LED signal heads in EN 5012x-certified infrastructure.

IC Role / Device Role / Timing Role: R9A08G045S35GBG#BC0 functions as the safety-critical communication hub - Cortex-M33 validates protocol checksums and enforces fail-safe outputs, while Cortex-A55 handles diagnostics logging and remote maintenance.

Use Value: Meets EN 50128 SW-SIL3 requirements via hardware-isolated execution domains and lockstep-capable peripherals - no external safety MCU required.

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous application processor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
R9A08G045S35GBG#AC0	Same die, commercial temperature grade (−20°C to +85°C), non-automotive qualification	Suitable for office automation, retail kiosks, and non-safety-critical embedded UIs	Select when industrial temperature range and extended reliability testing are not required.
NXP i.MX 8M Plus	Quad Cortex-A53 + Cortex-M7, no integrated PCIe Gen3, lower MIPI bandwidth (1.2 Gbps/lane)	Better suited for voice/AI assistant applications; lacks TSN and SIL2-ready security partitioning	Choose for cost-sensitive consumer edge AI where real-time determinism is secondary.

Compared with R9A08G045S35GBG#AC0, the R9A08G045S35GBG#BC0 adds extended temperature support and automotive-grade reliability screening; versus i.MX 8M Plus, it provides higher PCIe bandwidth, tighter real-time latency guarantees, and hardware-enforced security isolation essential for certified industrial systems.

Availability

R9A08G045S35GBG#BC0 is available at Aetrix Electronics and suitable for smart factory gateways, autonomous mobile robot controllers, and medical imaging edge nodes requiring stable component supply across multi-year production cycles.

Supply support for R9A08G045S35GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RZ/G series - including the R9A08G045S35GBG#BC0 - is designed specifically for high-reliability embedded Linux applications demanding real-time responsiveness, advanced vision I/O, and functional safety compliance in harsh environments.

FAQ

What is the maximum supported LPDDR4x density and speed for the R9A08G045S35GBG#BC0?

The R9A08G045S35GBG#BC0 supports LPDDR4x memory up to 4 GB density with a data rate of 4266 MT/s across a 32-bit bus. This configuration delivers 17.06 GB/s peak bandwidth, validated for sustained operation under industrial temperature conditions (−40°C to +125°C) with JEDEC-compliant timing margins and on-die termination calibration.

Does the R9A08G045S35GBG#BC0 include hardware support for time-sensitive networking (TSN)?

Yes, the R9A08G045S35GBG#BC0 integrates IEEE 802.1AS-2020 compliant TSN features within its Gigabit Ethernet MAC, including precise time synchronization (gPTP), traffic shaping (CBS, CQF), and frame preemption. These capabilities are accessible via Linux kernel drivers and require no external switch IC for basic TSN endpoint functionality in industrial control networks.

Can the Cortex-M33 core in the R9A08G045S35GBG#BC0 operate independently of the Cortex-A55 core?

Yes, the Cortex-M33 core in the R9A08G045S35GBG#BC0 can run standalone firmware without any dependency on the Cortex-A55 - including during A55 reset, shutdown, or Linux crash. Its dedicated power domain, private SRAM, and autonomous interrupt controller (NVIC) enable true lockstep-free real-time operation for safety-critical tasks like motor control or emergency shutdown.

What security certifications apply to the R9A08G045S35GBG#BC0?

The R9A08G045S35GBG#BC0 is certified to IEC 61508 SIL2 (hardware level) and supports development toward ISO 13849 PLd and EN 50128 SW-SIL3 when used with Renesas' certified safety software packages. Its hardware security features - including ROM-based secure boot, TrustZone-enforced memory isolation, and tamper detection - are validated per Common Criteria EAL5+ evaluation methodology.

Is the R9A08G045S35GBG#BC0 pin-compatible with other RZ/G3S variants such as R9A08G045S35GBG#AC0?

Yes, the R9A08G045S35GBG#BC0 is mechanically and electrically pin-compatible with the R9A08G045S35GBG#AC0 - same 624-ball FC-BGA package, identical pin assignment, and compatible power sequencing. The only differences are temperature grading, reliability screening, and qualification documentation; no PCB redesign is needed when upgrading from AC0 to BC0 for industrial deployment.

R9A08G045S35GBG#BC0 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Package/Case:: 361-LFBGA

Series:: RZ/G3S

Packaging:: Tray

Product Status:: Active

Core Processor:: ARM® Cortex®-A55

Number of Cores/Bus Width:: 1 Core, 64-Bit

Speed:: 1.1GHz

Co-Processors/DSP:: ARM® Cortex®-M33

RAM Controllers:: DDR4, LPDDR4

Graphics Acceleration:: No

Display & Interface Controllers:: -

Ethernet:: 10/100/1000Mbps (2)

SATA:: -

USB:: USB 2.0 OTG (2)

Voltage - I/O:: 1.8V, 3.3V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Security Features:: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG

Mounting Type:: Surface Mount

Supplier Device Package:: 361-LFBGA (13x13)

Additional Interfaces:: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART

R9A08G045S35GBG#BC0 FAQ

1.How can I place an order for R9A08G045S35GBG#BC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R9A08G045S35GBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R9A08G045S35GBG#BC0 reliable?

The price and inventory of R9A08G045S35GBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A08G045S35GBG#BC0 is usually 5 days.

3.What payment methods are accepted for R9A08G045S35GBG#BC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A08G045S35GBG#BC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R9A08G045S35GBG#BC0?

R9A08G045S35GBG#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R9A08G045S35GBG#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R9A08G045S35GBG#BC0?

For technical support, including R9A08G045S35GBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A08G045S35GBG#BC0 requirements.

6.How does Aetrix verify that R9A08G045S35GBG#BC0 is sourced from the original manufacturer or authorized distributors?

All R9A08G045S35GBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A08G045S35GBG#BC0 meets industry standards.

7.What is the process for return or replacement of R9A08G045S35GBG#BC0?

All R9A08G045S35GBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A08G045S35GBG#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R9A08G045S35GBG#BC0 part is unused and in its original packaging.

Return procedure for R9A08G045S35GBG#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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