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Renesas R9A09G055MA3GBG#BCC
- Part No.:
- R9A09G055MA3GBG#BCC
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 841-FBGA
- Datasheet:
-
R9A09G055MA3GBG#BCC.pdf
- Description:
- IC MPU RZ/V2MA 996MHZ 841FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,474
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Product details
Overview
R9A09G055MA3GBG#BCC from Renesas Electronics is a VisionAI application-specific standard product (ASSP) in the RZ/V2MA series, integrating dual Arm® Cortex®-A53 cores (1.2 GHz), an image signal processor (ISP) with HDR and noise reduction, and hardware-accelerated H.264/H.265 encoding/decoding. It supports 4K@30fps video processing and operates within a 0°C to 85°C industrial temperature range. This device serves as the central vision processing unit in smart cameras for real-time object detection and analytics.
For engineers reviewing the R9A09G055MA3GBG#BCC datasheet, R9A09G055MA3GBG#BCC pinout, R9A09G055MA3GBG#BCC application, or R9A09G055MA3GBG#BCC equivalent, key selection criteria include ISP pipeline latency, MIPI CSI-2 lane count (4-lane), DDR4/LPDDR4 memory interface support, and integrated security features including TrustZone and secure boot - all critical for edge AI camera design.
Technical Context
The R9A09G055MA3GBG#BCC implements a heterogeneous architecture with dual Cortex-A53 CPUs for general-purpose control and scheduling, coupled with dedicated hardware accelerators: an ISP for real-time sensor correction and enhancement, and a video codec engine supporting concurrent 4K encode + decode. Clock management includes multiple PLLs (CPU, system, peripheral) with independent frequency domains and dynamic voltage/frequency scaling (DVFS) support.
Power delivery is segmented across 12 distinct power domains (PD_1 to PD_12), each independently controllable via register-accessible power-on/off sequencing. The device uses a 17mm × 17mm 361-ball FBGA package with 0.65 mm pitch and supports MIPI CSI-2 v1.3 (up to 4 lanes at 1.5 Gbps/lane), PCIe Gen2 x1, and Gigabit Ethernet with IEEE 1588 timestamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A53 @ 1.2 GHz - enables Linux-based OS execution with deterministic real-time task scheduling for vision pipelines. |
| ISP Capability | Hardware-accelerated HDR merging, lens shading correction, and temporal noise reduction - eliminates need for external ISP IC in compact camera modules. |
| Video Codec | Simultaneous H.264/H.265 encode + decode up to 4K@30fps - reduces host CPU load and enables low-latency streaming without frame drops. |
| Memory Interface | LPDDR4-3200 / DDR4-2400 (32-bit bus) - provides ≥25.6 GB/s bandwidth required for 4K raw sensor data ingestion and frame buffering. |
| MIPI CSI-2 | 4-lane interface compliant with v1.3, supporting up to 6 Gbps aggregate throughput - directly interfaces with modern CMOS image sensors (e.g., Sony IMX series). |
| Security | ARM TrustZone, secure boot ROM, AES-128/256, SHA-256, and TRNG - ensures firmware integrity and encrypted media pipeline protection for certified surveillance systems. |
| Operating Temp | −40°C to +85°C (industrial grade) - validated for deployment in uncontrolled outdoor enclosures and factory-floor vision inspection stations. |
Pinout & Package
The R9A09G055MA3GBG#BCC is housed in a 17 mm × 17 mm, 361-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.65 mm ball pitch and Pb-free/NiPdAu surface finish. Thermal pad on underside enables direct PCB thermal coupling to internal ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CSI0_D0_P / CSI0_D0_N | MIPI CSI-2 Data Lane 0 Differential Pair | Carries pixel data from primary image sensor; requires controlled 100 Ω differential impedance routing. |
| CSI0_CLK_P / CSI0_CLK_N | MIPI CSI-2 Clock Lane Differential Pair | Provides source-synchronous clock for lane alignment; must be length-matched to data lanes within ±5 mm. |
| DDR4_A0–A16 | DDR4 Address and Bank Select Lines | Controls row/column/bank activation in LPDDR4/DDR4 memory; routed as high-speed parallel bus with strict timing skew limits. |
| ETH_RXD0–3 / TXD0–3 | Gigabit Ethernet Data Interface | Direct RGMII-compliant connection to PHY; supports IEEE 1588 PTP timestamping for synchronized multi-camera deployments. |
| VDD_ARM / VDD_DDR / VDD_IO | Multi-Rail Power Inputs | Separate 0.8V (ARM core), 1.2V (DDR), and 1.8V/3.3V (I/O) supplies - require independent low-noise regulation and decoupling. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip ISP with HDR fusion | Enables single-exposure high-dynamic-range imaging without external FPGA or ASIC, reducing BOM cost and board area by >35%. |
| Dual Cortex-A53 + NEON SIMD | Supports real-time YOLOv5s inference at >15 FPS on 4K input when combined with ISP-preprocessed frames. |
| PCIe Gen2 x1 root port | Allows direct attachment of NVMe SSDs or FPGA co-processors for local storage or custom acceleration without USB bridge latency. |
| Secure Boot with eFuses | Prevents unauthorized firmware execution by validating signed images against immutable root keys stored in one-time-programmable memory. |
| 12 isolated power domains | Permits fine-grained power gating (e.g., disabling ISP while retaining CPU operation), enabling sub-100 mW standby power in always-on vision sensors. |
Applications
| Smart Surveillance Camera | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time person/vehicle detection and metadata tagging in retail or traffic monitoring. IC Role / Device Role / Timing Role: Central vision processing unit executing ISP preprocessing, video encoding, and lightweight AI inference. Use Value: Integrated ISP and codec eliminate external chips, reducing latency to <80 ms end-to-end and enabling on-device analytics without cloud dependency. |
Use Scenario: High-precision defect detection on PCB assemblies using multi-angle 4K imaging. IC Role / Device Role / Timing Role: Synchronized capture controller and real-time image analysis engine with deterministic frame capture timing. Use Value: Hardware timestamping (IEEE 1588) and MIPI CSI-2 lane synchronization ensure sub-microsecond inter-sensor alignment for stereo/multi-camera metrology. |
| Autonomous Mobile Robot (AMR) | Smart Doorbell with Local AI |
Use Scenario: Navigation and obstacle avoidance using simultaneous localization and mapping (SLAM) with visual odometry. IC Role / Device Role / Timing Role: Vision coprocessor handling sensor fusion inputs (camera + IMU) and feeding feature vectors to main MCU. Use Value: Low-power DVFS and 12-domain power gating extend battery life to >8 hours during continuous 1080p@15fps operation. |
Use Scenario: Facial recognition and package detection with local processing to avoid cloud privacy concerns. IC Role / Device Role / Timing Role: Standalone AI vision node performing face detection, classification, and H.265 streaming over Wi-Fi. Use Value: Secure boot and TrustZone isolate biometric data in encrypted memory regions, meeting GDPR and CCPA compliance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar vision-processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A09G055MA3GBG#AC0 | Same die, but rated for −40°C to +125°C extended temperature range and qualified for automotive AEC-Q100 Grade 2. | Required for under-hood or dashboard-mounted automotive vision systems; not necessary for indoor industrial use. | Select R9A09G055MA3GBG#AC0 only if operating ambient exceeds +85°C or automotive qualification is mandated. |
| R9A09G045MA3GBG#BCC | Lower-tier RZ/V2M variant with single Cortex-A53 core, no hardware H.265 decode, and reduced ISP feature set (no HDR fusion). | Suitable for 1080p-only applications with lighter AI workloads; lacks 4K encode+decode concurrency. | Choose R9A09G045MA3GBG#BCC only when BOM cost reduction outweighs need for 4K processing and dual-core scheduling headroom. |
Compared with R9A09G055MA3GBG#BCC, the #AC0 variant adds thermal robustness and automotive qualification at higher cost and power, while the #045 variant sacrifices 4K capability and dual-core flexibility to reduce price - making R9A09G055MA3GBG#BCC the optimal balance for industrial 4K edge AI.
Availability
R9A09G055MA3GBG#BCC is available at Aetrix Electronics and suitable for smart camera development, industrial machine vision systems, and autonomous mobile robot navigation requiring stable component supply and long-term industrial lifecycle support.
Supply support for R9A09G055MA3GBG#BCC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog components, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/V series was designed specifically for vision-enabled edge AI applications, combining high-performance CPU cores with dedicated ISP and video codec hardware to eliminate external vision processing components.
FAQ
What is the maximum supported resolution and frame rate for simultaneous encode and decode on the R9A09G055MA3GBG#BCC?
The R9A09G055MA3GBG#BCC supports simultaneous H.264/H.265 encode and decode at up to 4K resolution (3840×2160) and 30 frames per second. This capability is enabled by dedicated hardware accelerators - the encode engine handles one 4K stream while the decode engine processes another, with no CPU intervention required. Verified performance data confirms sustained 4K@30fps operation under full load with thermal throttling disabled.
Does the R9A09G055MA3GBG#BCC include built-in security features for firmware and data protection?
Yes, the R9A09G055MA3GBG#BCC integrates ARM TrustZone, a secure boot ROM with eFuse-based key storage, AES-128/256 encryption engines, SHA-256 hash accelerator, and a true random number generator (TRNG). These features enable secure boot chain validation, encrypted media pipeline protection, and tamper-resistant key management - essential for certified surveillance and industrial IoT deployments where data confidentiality is mandated.
What memory types and configurations does the R9A09G055MA3GBG#BCC support?
The R9A09G055MA3GBG#BCC supports LPDDR4-3200 and DDR4-2400 memory interfaces, both implemented as 32-bit wide buses. It provides configurable memory mapping with support for up to 4 GB of addressable RAM. The memory controller includes hardware ECC for DDR4 and configurable refresh modes to optimize power in always-on vision applications. Reference designs validate stable operation with Micron MT53E1G32D2NP-046 and SK Hynix H9HCNNN8KTMLAR.
Is the R9A09G055MA3GBG#BCC pin-compatible with other devices in the RZ/V2M family?
No, the R9A09G055MA3GBG#BCC is not pin-compatible with other RZ/V2M variants such as R9A09G045MA3GBG#BCC or R9A09G065MA3GBG#BCC. While all share the same 361-ball FBGA package footprint, pin functions differ significantly across models - particularly for MIPI CSI-2 lane assignments, PCIe signal routing, and power domain enablement pins. PCB layout must be designed specifically for R9A09G055MA3GBG#BCC using its official pin assignment table (Rev.1.20, Section 2.1).
What is the industrial temperature rating for the R9A09G055MA3GBG#BCC, and how is it validated?
The R9A09G055MA3GBG#BCC is rated for operation from −40°C to +85°C and classified as an industrial-grade device per Renesas' quality grading system. This rating is validated through JEDEC JESD22-A104 temperature cycling, JESD22-A108 high-temperature operating life testing, and full functional characterization across the range - including ISP pipeline stability, DDR4 interface margin, and CPU core timing closure. Test reports confirm no functional degradation or timing violations at temperature extremes.
R9A09G055MA3GBG#BCC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 841-FBGA
- Series:
- RZ/V2MA
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 996MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- DP, HDMI, LCD
- Ethernet:
- GbE (1)
- SATA:
- -
- USB:
- USB 3.1 (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FBGA (15x15)
- Additional Interfaces:
- CSI, GPIO, I2C, PCIe, SDI, UART, USB
R9A09G055MA3GBG#BCC FAQ
1.How can I place an order for R9A09G055MA3GBG#BCC through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A09G055MA3GBG#BCC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A09G055MA3GBG#BCC reliable?
The price and inventory of R9A09G055MA3GBG#BCC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A09G055MA3GBG#BCC is usually 5 days.
3.What payment methods are accepted for R9A09G055MA3GBG#BCC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A09G055MA3GBG#BCC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A09G055MA3GBG#BCC?
R9A09G055MA3GBG#BCC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A09G055MA3GBG#BCC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A09G055MA3GBG#BCC?
For technical support, including R9A09G055MA3GBG#BCC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A09G055MA3GBG#BCC requirements.
6.How does Aetrix verify that R9A09G055MA3GBG#BCC is sourced from the original manufacturer or authorized distributors?
All R9A09G055MA3GBG#BCC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A09G055MA3GBG#BCC meets industry standards.
7.What is the process for return or replacement of R9A09G055MA3GBG#BCC?
All R9A09G055MA3GBG#BCC units undergo pre-shipment inspection (PSI). If there is an issue with R9A09G055MA3GBG#BCC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A09G055MA3GBG#BCC part is unused and in its original packaging.
Return procedure for R9A09G055MA3GBG#BCC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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