Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas R9A09G057H41GBG#AC0

Part No.:
R9A09G057H41GBG#AC0
Manufacturer:
Renesas
Category:
Microprocessors
Package:
1368-BFBGA
Datasheet:
AetrixR9A09G057H41GBG#AC0.pdf
Description:
RZ/V2H CA55 QUAD 19MM BULK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,574

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

R9A09G057H41GBG#AC0 from Renesas Electronics is a high-integration vision AI SoC featuring quad Arm® Cortex®-A55 cores (1.8 GHz), dual Arm® Cortex®-R8 real-time cores (800 MHz), and a system-management Arm® Cortex®-M33 core (200 MHz); includes 6 MB on-chip SRAM with ECC, 2× GbE MAC, 4× MIPI CSI-2 lanes, 1× MIPI DSI lane, PCIe Gen3, USB3.2 Gen2×1, CAN FD (6 ch.), and DRP-AI accelerator delivering up to 8 TOPS dense inference - deployed in industrial vision systems requiring deterministic real-time response and low-latency camera-to-display pipeline.

For engineers reviewing the R9A09G057H41GBG#AC0 datasheet, R9A09G057H41GBG#AC0 pinout, R9A09G057H41GBG#AC0 application, or R9A09G057H41GBG#AC0 equivalent, this page delivers verified CPU cluster configuration, memory interface bandwidth (LPDDR4X-3200 ×2), MIPI CSI-2 throughput (4K RAW12 @60 fps), GE3D/Mali-C55 option status, and industrial-grade thermal range (−40°C to +125°C junction).

Technical Context

This SoC implements a heterogeneous multi-core architecture with strict domain isolation: Cortex-A55 handles Linux-based application processing and video codec (H.264/H.265 up to 4K30 encode/decode), Cortex-R8 manages time-critical control loops and safety-critical functions via TCM-backed execution, and Cortex-M33 coordinates boot, power sequencing, and secure firmware updates. All three domains communicate via Message Handling Unit (MHU) and share access to 6 MB on-chip SRAM protected by ECC.

Hardware acceleration is partitioned across dedicated units: DRP-AI provides sparse/dense AI inference offload (8 TOPS dense, 80 TOPS sparse), CRU enables pixel-accurate camera input processing (RAW12, 4 virtual channels), LCDC supports dual-plane blending for overlay graphics, and VCD implements full H.264/H.265 encode/decode with I/P/B-slice support - all operating under Arm TrustZone®-enforced memory protection and TZC-400 region locking.

Key Specifications

ParameterValue and Actual Design Meaning
CPU ArchitectureQuad Cortex-A55 (1.8 GHz), Dual Cortex-R8 (800 MHz), Cortex-M33 (200 MHz) - enables concurrent Linux OS, real-time control, and secure boot management
On-chip Memory6 MB SRAM with ECC - provides deterministic latency for critical buffers, eliminating external RAM access contention
Memory Interface2× LPDDR4/4X-3200 (32-bit bus, 12.8 GB/s per channel) - supports dual-channel 4K video streaming and AI model loading
Camera Interface4× MIPI CSI-2 channels (1/2/4-lane configurable, 2.1 Gbps/lane) - enables simultaneous 4K@60fps RAW12 input from up to four sensors
Video Output1× MIPI DSI (1/2/4-lane, 1.5 Gbps/lane) - drives 1920×1200 RGB888 @60fps or 1280×1024 @120fps displays directly
AI AccelerationDRP-AI engine (8 TOPS dense, 80 TOPS sparse) - executes quantized CNN models with hardware-managed sparsity without host CPU intervention
SecurityArm TrustZone®, OTP (32 Kbits), TRNG, AES/RSA/ECC crypto engine (option) - enables secure boot, key storage, and runtime attestation
Operating RangeJunction temperature −40°C to +125°C - qualified for uncooled industrial edge deployments including factory automation and robotics

Pinout & Package

1368-pin Fine-Pitch Chip-Scale Ball Grid Array (FCBGA), 19 mm × 19 mm, 0.50 mm pitch, RoHS-compliant, lead-free finish.

Pin/TerminalCircuit RoleDesign Meaning
VDD_CA55Cortex-A55 Core Power Supply0.8 V or 0.9 V supply - voltage selection determines max clock (1.1 GHz or 1.8 GHz) and power envelope
VDD_DDRLPDDR4/4X I/O Power1.1 V (LPDDR4) or 0.6 V (LPDDR4X) - sets memory interface signaling standard and timing margin
MIPI_CSI0_P/NMIPI CSI-2 Differential Pair 0Supports 1–4 lane configurations at 2.1 Gbps/lane - enables direct connection to image sensors without bridge IC
MIPI_DSI_P/NMIPI DSI Differential PairConfigurable 1/2/4-lane output - drives display panels with embedded timing controllers or external DSI-to-LVDS bridges
PCIe_RX0_P/NPCIe Gen3 Differential ReceivePart of 4-lane or 2×2-lane configurable interface - supports root complex or endpoint mode with hot-plug detection
USB3_TX_P/NUSB3.2 Gen2 Differential Transmit10 Gbps signaling - requires controlled impedance routing (85 Ω differential) and SS termination
GPIO_00–85General-Purpose I/O86 pins with 3.3-V tolerance (75 pins), programmable pull-up/down, Schmitt trigger - usable for status LEDs, button inputs, or sensor enable signals

Key Features

FeatureDesign Value
Heterogeneous Multi-Core IsolationCortex-A55, -R8, and -M33 operate on independent buses with MHU-mediated messaging - prevents RTOS task starvation by Linux scheduler
Dual LPDDR4/4X ChannelsTwo independent 32-bit controllers supporting LPDDR4-3200 and LPDDR4X-3200 - enables simultaneous 4K decode + AI inference + display output without memory bandwidth contention
DRP-AI Sparse Inference EngineHardware-accelerated sparse matrix multiplication (80 TOPS) - reduces AI model latency by >5× vs. CPU-only execution for pruned neural networks
CRU Camera Processing Pipeline4-channel MIPI CSI-2 receiver with RAW12 support and 4 virtual channels - allows synchronized multi-sensor capture with per-channel format flexibility
TrustZone-Protected BootSecure boot flow enforced by Cortex-M33 and OTP-stored keys - prevents unauthorized firmware execution and ensures chain-of-trust integrity
Industrial Thermal Rating−40°C to +125°C junction operation - eliminates need for active cooling in sealed enclosures used in factory floor vision systems

Applications

Smart Factory Vision InspectionAutonomous Mobile Robot (AMR) Navigation

Use Scenario: Real-time PCB defect detection using high-resolution line-scan cameras and CNN-based anomaly classification.

IC Role / Device Role / Timing Role: R9A09G057H41GBG#AC0 acts as vision processing unit - ingests 4K@60fps MIPI CSI-2 streams, runs DRP-AI inference, and outputs pass/fail overlay via MIPI DSI to HMI.

Use Value: On-chip 6 MB SRAM buffers full-frame RAW12 data; DRP-AI delivers <15 ms inference latency enabling sub-50 ms total inspection cycle time.

Use Scenario: Simultaneous SLAM mapping, obstacle avoidance, and human detection on compact warehouse AMRs.

IC Role / Device Role / Timing Role: R9A09G057H41GBG#AC0 serves as central perception SoC - fuses stereo camera, IMU, and LiDAR data via Cortex-R8 real-time control and runs multi-model AI inference on Cortex-A55.

Use Value: Dual LPDDR4X channels sustain concurrent 4K video decode, point-cloud rendering, and sparse AI inference without external memory bottleneck.

Medical Endoscopy Imaging SystemIntelligent Traffic Monitoring Camera

Use Scenario: High-fidelity 4K endoscopic video acquisition with real-time noise reduction and dynamic range enhancement.

IC Role / Device Role / Timing Role: R9A09G057H41GBG#AC0 functions as imaging subsystem controller - processes RAW12 sensor data through CRU and ISP pipeline (when enabled), encodes H.265, and transmits over GbE.

Use Value: Hardware VCD supports 4K30 H.265 encode at <1.5 W - meets medical device thermal limits while preserving diagnostic image fidelity.

Use Scenario: Edge-based vehicle classification and license plate recognition in outdoor traffic intersections.

IC Role / Device Role / Timing Role: R9A09G057H41GBG#AC0 operates as intelligent edge node - captures 4K@30fps from dual MIPI CSI-2 cameras, runs DRP-AI object detection, and logs metadata via CAN FD to fleet management gateway.

Use Value: 6-channel CAN FD (8 Mbps payload) enables deterministic communication with vehicle OBD-II modules and roadside infrastructure without protocol translation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar vision AI SoC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R9A09G057H42GBG#AC0Includes Mali-G31 GPU (GE3D) - adds OpenGL ES 3.2 and OpenCL 2.0 support; same CPU, memory, and I/O configurationRequired when UI rendering, 3D visualization, or compute-shader acceleration is needed beyond DRP-AI inferenceSelect if display composition, AR overlays, or GPU-accelerated post-processing are part of the system architecture
R9A09G057H45GBG#AC0Includes Mali-C55 ISP - adds hardware-accelerated 4K image signal processing (HDR, demosaic, noise reduction); no GE3DNecessary for high-dynamic-range multi-exposure capture and real-time pixel-level correction in low-light vision systemsChoose when raw sensor data quality must be enhanced before AI inference - e.g., automotive surround-view or night-vision surveillance

Compared with R9A09G057H41GBG#AC0, the H42GBG variant adds GPU compute capability for UI/compute workloads, while the H45GBG variant replaces GPU with ISP for superior image preprocessing - both retain identical CPU clusters, memory bandwidth, and DRP-AI performance, allowing board-level reuse where only vision pipeline requirements differ.

Availability

R9A09G057H41GBG#AC0 is available at Aetrix Electronics and suitable for industrial vision inspection, autonomous mobile robot navigation, and intelligent traffic monitoring requiring stable component supply across extended product lifecycles.

Supply support for R9A09G057H41GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RZ/V2H Group, including R9A09G057H41GBG#AC0, is engineered for vision AI edge inference with integrated DRP-AI, real-time Cortex-R8 control, and industrial-grade reliability - targeting zero-compromise performance in factory automation, robotics, and smart infrastructure.

FAQ

What CPU cores are integrated in the R9A09G057H41GBG#AC0?

R9A09G057H41GBG#AC0 integrates quad Arm® Cortex®-A55 application cores (1.8 GHz), dual Arm® Cortex®-R8 real-time cores (800 MHz), and one Arm® Cortex®-M33 system management core (200 MHz). These operate in isolated domains with dedicated caches (L1/L3 for A55, TCM for R8, FPU/DSP for M33) and communicate via Message Handling Unit (MHU). The R9A09G057H41GBG#AC0 datasheet confirms no Mali-G31 GPU or Mali-C55 ISP is included in this specific variant.

Does the R9A09G057H41GBG#AC0 support LPDDR4X memory?

Yes, R9A09G057H41GBG#AC0 supports LPDDR4X-3200 across two independent 32-bit channels, delivering up to 12.8 GB/s per channel. The memory controller includes inline ECC, auto-refresh, self-refresh, and IO retention modes. Voltage for DDR I/O is configurable at 0.6 V (LPDDR4X) or 1.1 V (LPDDR4), and memory size scales up to 16 GB (8 GB per channel). This capability is explicitly confirmed in Table 1.3-3 of the R9A09G057H41GBG#AC0 datasheet.

What is the maximum MIPI CSI-2 bandwidth supported by the R9A09G057H41GBG#AC0?

R9A09G057H41GBG#AC0 supports up to 2.1 Gbps per MIPI CSI-2 lane across four configurable channels (CRU0–CRU3), enabling aggregate bandwidth of 33.6 Gbps for 4-lane × 4-channel operation. It handles 4K RAW12 video at 60 fps per channel and supports virtual channels VC0–VC15. Input formats include RAW6–RAW20, YUV422, RGB, and user-defined byte-based data - all verified in Table 1.3-6 and Figure 1.4-1 of the R9A09G057H41GBG#AC0 datasheet.

Is the DRP-AI accelerator included in the R9A09G057H41GBG#AC0?

Yes, the R9A09G057H41GBG#AC0 includes the DRP-AI accelerator as a standard feature - delivering up to 8 TOPS dense and 80 TOPS sparse inference performance. This is confirmed in Section 1.1 Features and Table 1.3-2 of the R9A09G057H41GBG#AC0 datasheet. Unlike variants H42GBG (GPU-enabled) or H45GBG (ISP-enabled), the R9A09G057H41GBG#AC0 prioritizes AI inference throughput without adding optional graphics or imaging IP blocks.

What is the operating temperature range for the R9A09G057H41GBG#AC0?

R9A09G057H41GBG#AC0 is rated for industrial junction temperature operation from −40°C to +125°C, as specified in Table 1.3-14 of its datasheet. This rating applies to the full 1368-pin FCBGA package (19 mm × 19 mm, 0.50 mm pitch) and validates suitability for fanless enclosures in factory automation, outdoor traffic systems, and robotics - no derating or thermal throttling is required within this range.

R9A09G057H41GBG#AC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
1368-BFBGA
Series:
RL78/G13
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
ARM® Cortex®-M33, Cortex®-R8
RAM Controllers:
LPDDR4, LPDDR4x
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, MIPI-CSI2, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
USB 2.0 (2), USB 3.2 (2)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1368-HFBGA (19x19)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART

R9A09G057H41GBG#AC0 FAQ

1.How can I place an order for R9A09G057H41GBG#AC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R9A09G057H41GBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R9A09G057H41GBG#AC0 reliable?

The price and inventory of R9A09G057H41GBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A09G057H41GBG#AC0 is usually 5 days.

3.What payment methods are accepted for R9A09G057H41GBG#AC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A09G057H41GBG#AC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R9A09G057H41GBG#AC0?

R9A09G057H41GBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R9A09G057H41GBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R9A09G057H41GBG#AC0?

For technical support, including R9A09G057H41GBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A09G057H41GBG#AC0 requirements.

6.How does Aetrix verify that R9A09G057H41GBG#AC0 is sourced from the original manufacturer or authorized distributors?

All R9A09G057H41GBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A09G057H41GBG#AC0 meets industry standards.

7.What is the process for return or replacement of R9A09G057H41GBG#AC0?

All R9A09G057H41GBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A09G057H41GBG#AC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R9A09G057H41GBG#AC0 part is unused and in its original packaging.

Return procedure for R9A09G057H41GBG#AC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R9A09G057H41GBG#AC0 Tags

  • R9A09G057H41GBG#AC0
  • R9A09G057H41GBG#AC0 PDF
  • R9A09G057H41GBG#AC0 Datasheet
  • R9A09G057H41GBG#AC0 Specifications
  • R9A09G057H41GBG#AC0 Images
  • Renesas
  • Renesas R9A09G057H41GBG#AC0
  • Buy R9A09G057H41GBG#AC0
  • R9A09G057H41GBG#AC0 Price
  • R9A09G057H41GBG#AC0 Distributor
  • R9A09G057H41GBG#AC0 Supplier
  • R9A09G057H41GBG#AC0 Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER