Renesas R9A09G057H41GBG#BC0

Overview

R9A09G057H41GBG#BC0 from Renesas Electronics is a high-integration vision AI SoC featuring quad Arm® Cortex®-A55 cores (1.8 GHz), dual Arm® Cortex®-R8 real-time cores (800 MHz), and a system-management Arm® Cortex®-M33 core (200 MHz); 6 MB on-chip SRAM with ECC; 2-channel LPDDR4/4X-3200 memory interface; and integrated DRP-AI accelerator delivering up to 8 dense TOPS for edge vision inference in industrial cameras and robotics.

For engineers reviewing the R9A09G057H41GBG#BC0 datasheet, R9A09G057H41GBG#BC0 pinout, R9A09G057H41GBG#BC0 application, or R9A09G057H41GBG#BC0 equivalent, this page provides verified technical context, validated package mapping, confirmed peripheral integration (including MIPI CSI-2 ×4, PCIe Gen3 ×4, CAN-FD ×6), and precise alternative part comparisons - all derived from Renesas R01DS0429EJ0140 Rev.1.40.

Technical Context

This SoC implements a heterogeneous multi-core architecture with strict functional partitioning: Cortex-A55 handles Linux-based application processing and video codec offload (H.264/H.265 up to 4K30), Cortex-R8 manages time-critical motion control and safety monitoring via TCM-backed deterministic execution, and Cortex-M33 coordinates secure boot, power sequencing, and low-level sensor fusion. All three CPU clusters share coherent access to 6 MB on-chip SRAM with ECC and interconnect via Arm CoreLink GIC-600 and MHU message passing.

The DRP-AI engine operates independently of CPU cores, accepting direct input from CRU camera interfaces and feeding processed feature maps to VCD or ISU units; it supports sparse/dense inference at up to 80 sparse TOPS without requiring host CPU intervention. Peripheral subsystems are fully hardware-synchronized via Event Link Controller (ELC), enabling timer-triggered ADC sampling, PDM wake-on-sound activation, and GPT-driven PWM dead-time insertion - critical for real-time motor and imaging systems.

Key Specifications

Pinout & Package

1368-pin Fine-Pitch Chip-Scale Ball Grid Array (FCBGA), 19 mm × 19 mm, 0.50 mm pitch, RoHS-compliant, designed for high-density PCB layouts with controlled impedance routing for DDR, PCIe, and MIPI interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar vision AI SoC applications.

Compared with R9A09G057H41GBG#BC0, the H42 variant adds GPU-accelerated graphics but no ISP, while the H45 variant adds ISP-based image enhancement but no GPU - both retain identical DRP-AI performance, memory bandwidth, and real-time CPU capabilities, making them drop-in alternatives only when those specific accelerators are required.

Availability

R9A09G057H41GBG#BC0 is available at Aetrix Electronics and suitable for industrial vision systems, autonomous mobile robots, and AI edge gateways requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for R9A09G057H41GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/V2H Group - including R9A09G057H41GBG#BC0 - is engineered for vision AI at the edge, integrating heterogeneous compute, hardware-accelerated inference, and industrial-grade I/O to replace FPGA+CPU combinations in smart cameras and robotics.

FAQ

What is the maximum operating frequency of the Cortex-A55 cores in R9A09G057H41GBG#BC0?

The Cortex-A55 cores in R9A09G057H41GBG#BC0 operate at up to 1.8 GHz when supplied at 0.9 V, or 1.1 GHz at 0.8 V. This dual-voltage capability allows dynamic performance scaling based on thermal and power constraints. The L3 cache associated with these cores runs at a maximum of 1.26 GHz. These frequencies are confirmed in Table 1.3-1 and Figure 1.1-1 of the R01DS0429EJ0140 datasheet.

Does R9A09G057H41GBG#BC0 include an integrated image signal processor (ISP)?

No, R9A09G057H41GBG#BC0 does not include the Mali-C55 ISP. As explicitly stated in Table 1.2-1 of the R01DS0429EJ0140 datasheet, the "ISP" column for R9A09G057H41GBG is marked "N/A". Image preprocessing must be implemented in software or via external components. Models like R9A09G057H45GBG#BC0 include the ISP option.

What is the package type and pin count of R9A09G057H41GBG#BC0?

R9A09G057H41GBG#BC0 uses a 1368-pin Fine-Pitch Chip-Scale Ball Grid Array (FCBGA) package, measuring 19 mm × 19 mm with 0.50 mm pitch. This is documented in Table 1.3-16 and Figure 1.4-1 of the R01DS0429EJ0140 datasheet. The "#BC0" suffix indicates full-carton packaging per Note in Section 1.2.

How many MIPI CSI-2 lanes does R9A09G057H41GBG#BC0 support, and what is the maximum throughput per lane?

R9A09G057H41GBG#BC0 supports 4 independent MIPI CSI-2 channels, each configurable for 1, 2, or 4 lanes. Maximum bandwidth is 2.1 Gbps per lane, enabling aggregate throughput sufficient for 4K RAW12 @ 60 fps on a single channel. This is specified in Table 1.3-6 and confirmed in Figure 1.4-1 block diagram under "CRU0 to CRU3".

Is hardware cryptographic acceleration available on R9A09G057H41GBG#BC0?

Yes, hardware cryptographic acceleration is available as an optional feature on R9A09G057H41GBG#BC0. Table 1.3-11 confirms Trusted Secure IP support for AES, RSA, ECC, SHA-1/224/256, and TRNG. However, its inclusion depends on device configuration and fuse settings - the base silicon supports it, but final enablement is determined during manufacturing and boot-time security provisioning.