Renesas R9A09G057H42GBG#AC0

Overview

R9A09G057H42GBG#AC0 from Renesas Electronics is a high-integration vision AI SoC featuring quad-core Arm® Cortex®-A55 (1.8 GHz), dual-core Arm® Cortex®-R8 (800 MHz), and a Cortex®-M33 (200 MHz) for heterogeneous processing; includes Mali™-G31 GPU, DRP-AI accelerator delivering up to 8 dense TOPS, 6 MB on-chip SRAM with ECC, and dual GbE MACs - deployed in industrial smart cameras requiring real-time inference, multi-sensor fusion, and deterministic control.

For engineers reviewing the R9A09G057H42GBG#AC0 datasheet, R9A09G057H42GBG#AC0 pinout, R9A09G057H42GBG#AC0 application, or R9A09G057H42GBG#AC0 equivalent, this page delivers verified CPU cluster configuration, MIPI CSI-2/DSI interface bandwidth, PCIe Gen3 lane flexibility, CAN FD channel count, and thermal operating range - all confirmed for the exact R9A09G057H42GBG#AC0 variant.

Technical Context

This SoC implements a three-tier CPU architecture: application-layer A55 cores handle Linux-based vision pipelines and network stacks; real-time R8 cores manage time-critical motion control and safety monitoring; M33 core executes secure boot and low-level system management. All clusters share coherent interconnect and TrustZone-enabled memory protection.

The DRP-AI engine operates independently of CPU cores, accepting quantized INT8/INT16 tensors via dedicated DMA channels and delivering inference results to shared SRAM or DDR. Mali-G31 GPU supports OpenGL ES 3.2 and OpenCL 2.0 full profile for offloading graphics and compute workloads - both IP blocks are enabled and validated for R9A09G057H42GBG#AC0 per Table 1.2-1.

Key Specifications

Pinout & Package

1368-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package, 19 mm × 19 mm body, 0.50 mm ball pitch, RoHS-compliant, lead-free finish. Thermal pad on underside for heatsink attachment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar vision AI SoC applications.

Compared with R9A09G057H42GBG#AC0, the H41GBG variant removes GPU and AI acceleration for cost-sensitive control-centric roles, while the H45GBG replaces GPU with ISP for sensor-quality-critical imaging - all share identical package, pinout, and CPU subsystems.

Availability

R9A09G057H42GBG#AC0 is available at Aetrix Electronics and suitable for industrial smart cameras, autonomous mobile robots, medical endoscopy systems, and intelligent traffic monitoring requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R9A09G057H42GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/V2H Group - including R9A09G057H42GBG#AC0 - is designed for vision AI edge applications demanding integrated CPU, GPU, ISP, and AI acceleration in a single industrial-grade package with functional safety readiness.

FAQ

What CPU cores are integrated into the R9A09G057H42GBG#AC0?

R9A09G057H42GBG#AC0 integrates quad-core Arm® Cortex®-A55 (1.8 GHz), dual-core Arm® Cortex®-R8 (800 MHz), and a single Arm® Cortex®-M33 (200 MHz). The A55 handles Linux-based application workloads, R8 manages real-time deterministic tasks, and M33 executes secure boot and system management - all coherently interconnected with TrustZone memory protection. This exact configuration is confirmed for R9A09G057H42GBG#AC0 in Section 1.3-1.

Does the R9A09G057H42GBG#AC0 include the Mali-G31 GPU?

Yes, R9A09G057H42GBG#AC0 includes the Mali-G31 GPU as confirmed in Table 1.2-1 of the datasheet, which explicitly lists "Available (Mali-G31)" for this part number. It supports OpenGL ES 1.1/2.0/3.2 and OpenCL 2.0 full profile, with a single-pixel shader core and 8 KB L2 cache - enabling UI rendering and compute offload without external graphics hardware.

What is the maximum MIPI CSI-2 bandwidth supported by the R9A09G057H42GBG#AC0?

R9A09G057H42GBG#AC0 supports four MIPI CSI-2 channels, each configurable for 1, 2, or 4 lanes at up to 2.1 Gbps per lane (Table 1.3-6). At full 4-lane × 4-channel configuration, aggregate bandwidth reaches 33.6 Gbps - sufficient for simultaneous ingestion of four 4K RAW12@60fps video streams, as validated in the CRU unit specification.

Is the DRP-AI accelerator enabled on the R9A09G057H42GBG#AC0?

Yes, the DRP-AI accelerator is enabled on R9A09G057H42GBG#AC0 and delivers up to 8 dense TOPS and 80 sparse TOPS (Table 1.3-2). It operates as a dedicated AI inference engine independent of CPU cores, accepting INT8/INT16 tensors via DMA and writing results to shared SRAM - a feature confirmed for this exact part number in the product lineup table.

What is the operating temperature range for the R9A09G057H42GBG#AC0?

R9A09G057H42GBG#AC0 is rated for industrial operation from −40°C to +125°C junction temperature (Table 1.3-14). This range is validated for continuous operation under full CPU, GPU, and DRP-AI load, making it suitable for uncooled outdoor deployments and high-ambient factory environments - a key differentiator from commercial-grade vision SoCs.