Renesas R9A09G057H45GBG#BC0

Overview

R9A09G057H45GBG#BC0 from Renesas Electronics is a high-integration vision AI SoC featuring quad-core Arm® Cortex®-A55 (1.8 GHz), dual-core Arm® Cortex®-R8 (800 MHz), and a system-management Arm® Cortex®-M33 (200 MHz); includes DRP-AI accelerator delivering up to 8 dense TOPS, 6 MB on-chip SRAM with ECC, and MIPI CSI-2/DSI interfaces - deployed in industrial smart cameras requiring real-time inference and multi-sensor image processing.

For engineers reviewing the R9A09G057H45GBG#BC0 datasheet, R9A09G057H45GBG#BC0 pinout, R9A09G057H45GBG#BC0 application, or R9A09G057H45GBG#BC0 equivalent, this page delivers verified CPU cluster configuration, ISP-enabled camera interface timing, PCIe Gen3 lane flexibility, CAN FD channel count, and thermal operating range for embedded vision design validation.

Technical Context

The R9A09G057H45GBG#BC0 implements a heterogeneous multi-core architecture: application processing is handled by four Cortex-A55 cores with L1/L3 caches and Neon/FPU support; real-time control is offloaded to two lock-step–disabled Cortex-R8 cores with TCM and VFPv3; system initialization and safety-critical tasks run on the Cortex-M33 with DSP extension and TrustZone security. All clusters communicate via MHU and share access to 6 MB on-chip SRAM with ECC protection.

Its vision subsystem integrates four MIPI CSI-2 receivers (up to 4K RAW12 @ 60 fps) and one MIPI DSI transmitter (up to 1920×1200 @ 60 fps), with optional Mali-C55 ISP enabled per Table 1.2-1 - supporting black level correction, 2-exposure HDR, and RAW10/12 input - while DRP-AI provides reconfigurable AI acceleration without external memory dependency.

Key Specifications

Pinout & Package

1368-pin Fine-Pitch Chip-Scale Ball Grid Array (FCBGA), 19 mm × 19 mm, 0.50 mm pitch - optimized for high-density PCB layouts with controlled impedance routing for DDR4X, PCIe Gen3, and MIPI differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar vision AI SoC applications.

Compared with R9A09G057H45GBG#BC0, the H46GBG variant trades ISP for GPU resources - making it unfit for RAW-domain image enhancement - while the H44GBG extends both GPU and ISP, increasing BOM cost and power but enabling display-integrated vision systems.

Availability

R9A09G057H45GBG#BC0 is available at Aetrix Electronics and suitable for industrial smart cameras, automotive ADAS ECUs, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for R9A09G057H45GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/V2H Group - including R9A09G057H45GBG#BC0 - is engineered for vision AI edge inference with integrated ISP, DRP-AI, and industrial-grade reliability, targeting applications where real-time image analysis must occur without cloud dependency.

FAQ

What is the maximum supported resolution and frame rate for MIPI CSI-2 input on the R9A09G057H45GBG#BC0?

The R9A09G057H45GBG#BC0 supports up to 4K RAW12 at 60 fps across its four MIPI CSI-2 channels, with each channel configurable for 1, 2, or 4 lanes and bandwidth up to 2.1 Gbps per lane. This capability is enabled by the CRU (Camera Receive Unit) and validated in the RZ/V2H datasheet Section 1.3-6. The R9A09G057H45GBG#BC0's Mali-C55 ISP further processes this data with HDR and defect correction before DRP-AI inference.

Does the R9A09G057H45GBG#BC0 include an integrated image signal processor (ISP), and if so, which one?

Yes, the R9A09G057H45GBG#BC0 includes the Arm Mali-C55 ISP as confirmed in Table 1.2-1 of the RZ/V2H datasheet - marked "Available" for this part number. It supports 4K imaging, 630 Mpixels/s throughput, RAW8–RAW20 input formats, and features such as 2-exposure HDR, black level correction, and gamma correction - all implemented in dedicated hardware without CPU intervention.

What AI acceleration capability does the R9A09G057H45GBG#BC0 provide, and how is it architected?

The R9A09G057H45GBG#BC0 integrates the DRP-AI (Dynamically Reconfigurable Processor for AI), delivering up to 8 dense TOPS and 80 sparse TOPS. Unlike fixed-architecture NPUs, DRP-AI uses a reconfigurable fabric (AI-MAC + DRP0) that loads custom compute kernels at runtime - enabling efficient execution of diverse neural network topologies directly from on-chip SRAM without DDR bandwidth constraints.

What is the package type and pin count of the R9A09G057H45GBG#BC0, and what are its thermal characteristics?

The R9A09G057H45GBG#BC0 uses a 1368-pin FCBGA package, 19 mm × 19 mm with 0.50 mm pitch. Its junction temperature rating is −40°C to +125°C (Table 1.3-14), qualifying it for industrial and automotive under-hood applications. Thermal design requires adherence to Renesas' recommended PCB pad layout, thermal vias under the die, and airflow ≥1 m/s for sustained 1.8 GHz A55 operation.

How many CAN FD interfaces does the R9A09G057H45GBG#BC0 support, and what standard compliance do they meet?

The R9A09G057H45GBG#BC0 integrates six independent CAN FD controllers compliant with ISO 11898-1:2015. Each supports data rates up to 8 Mbps with payload lengths up to 64 bytes, 64 transmit message buffers, and 256 shared RX/FIFO buffers - enabling robust communication with automotive ECUs, industrial PLCs, and sensor networks without external transceivers beyond physical layer interfacing.