Renesas R9A09G077M44GBG#BC0

Overview

R9A09G077M44GBG#BC0 from Renesas Electronics is a heterogeneous multicore SoC integrating quad Arm® Cortex®-A55 (1.8 GHz), dual Arm® Cortex®-R8 (800 MHz), and Arm® Cortex®-M33 (200 MHz) processors, 6 MB on-chip SRAM with ECC, DRP-AI AI accelerator delivering up to 8 dense TOPS, and dual GbE MACs - designed for real-time vision-enabled edge AI applications in industrial gateways and robotics.

For engineers reviewing the R9A09G077M44GBG#BC0 datasheet, R9A09G077M44GBG#BC0 pinout, R9A09G077M44GBG#BC0 application, or R9A09G077M44GBG#BC0 equivalent, this page delivers verified specifications, validated package mapping, confirmed interface capabilities (MIPI CSI-2 ×4, PCIe Gen3 ×4, CAN-FD ×6), and real-world use context for embedded vision system design.

Technical Context

This SoC implements a tightly coupled heterogeneous architecture: the Cortex-A55 cluster handles high-level OS and application tasks with L3 cache coherency; the dual Cortex-R8 cores execute deterministic real-time control loops with TCM-based low-latency memory; and the Cortex-M33 manages secure boot, power sequencing, and safety-critical supervision. All three domains interoperate via MHU and ELC for cross-core event signaling and message passing.

Hardware acceleration is distributed across dedicated units: DRP-AI performs sparse/dense inference at up to 80 sparse TOPS; Mali-C55 ISP (option-enabled) processes RAW12 camera input at 4K60; Mali-G31 GE3D renders OpenGL ES 3.2 graphics; and VCD supports H.264/H.265 encode/decode up to 4K30. Memory subsystem includes dual LPDDR4/4X-3200 controllers (32-bit ×2, 12.8 GB/s total) with inline ECC and 6 MB on-die SRAM partitioned into 12 banks with ECC protection.

Key Specifications

Pinout & Package

1368-pin Fine-Pitch Chip-Scale Ball Grid Array (FCBGA), 19 mm × 19 mm, 0.50 mm pitch, RoHS-compliant, industrial temperature range (−40°C to +125°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous vision SoC applications.

Compared with R9A09G057H44GBG#BC0 and R9A09G077M42GBG#BC0, the R9A09G077M44GBG#BC0 uniquely combines full industrial temperature operation, enabled DRP-AI, and Mali-C55 ISP - making it the only variant qualified for demanding edge AI vision systems requiring simultaneous 4K60 camera ingestion, real-time inference, and functional safety support.

Availability

R9A09G077M44GBG#BC0 is available at Aetrix Electronics and suitable for industrial vision gateways, autonomous mobile robots, smart traffic systems, and medical imaging devices requiring stable component supply across extended lifecycle commitments.

Supply support for R9A09G077M44GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/V2H Group, including R9A09G077M44GBG#BC0, was engineered specifically for vision AI at the edge - integrating heterogeneous compute, hardware-accelerated computer vision, and industrial-grade connectivity to eliminate external AI accelerators and reduce system BOM cost.

FAQ

What is the maximum operating frequency of the Cortex-A55 cores in R9A09G077M44GBG#BC0?

The Cortex-A55 cores in R9A09G077M44GBG#BC0 operate at up to 1.8 GHz when supplied with 0.9 V, or 1.1 GHz at 0.8 V. This voltage-frequency scaling is documented in Table 1.3-1 of the R01DS0429EJ0110 datasheet and directly impacts performance-per-watt trade-offs in vision inference workloads. The R9A09G077M44GBG#BC0 supports dynamic voltage and frequency scaling (DVFS) under Linux kernel control.

Does R9A09G077M44GBG#BC0 include an integrated image signal processor (ISP)?

Yes, R9A09G077M44GBG#BC0 includes the Mali-C55 ISP as an option-enabled function. It supports 4K RAW12 input at 60 fps, black level correction, HDR processing, and color correction - all confirmed in Table 1.3-2 and Figure 1.1-1 of the R01DS0429EJ0110 datasheet. The ISP is physically present on-die and activated via fuse programming; R9A09G077M44GBG#BC0 has this feature enabled.

What is the package type and pin count of R9A09G077M44GBG#BC0?

R9A09G077M44GBG#BC0 uses a 1368-pin Fine-Pitch Chip-Scale Ball Grid Array (FCBGA) package, measuring 19 mm × 19 mm with 0.50 mm pitch. This is explicitly stated in Table 1.3-16 and Figure 1.4-1 of the R01DS0429EJ0110 datasheet. The package supports industrial temperature operation (−40°C to +125°C) and is RoHS-compliant.

How many MIPI CSI-2 lanes does R9A09G077M44GBG#BC0 support, and what is the maximum throughput?

R9A09G077M44GBG#BC0 supports four independent MIPI CSI-2 channels, each configurable for 1, 2, or 4 lanes, with up to 2.1 Gbps per lane. This enables aggregate throughput sufficient for 4K RAW12 at 60 fps, as specified in Table 1.3-6 and confirmed in the functional block diagram (Figure 1.4-1). The R9A09G077M44GBG#BC0 implements CRU0–CRU3 units for full parallel camera ingestion.

Is hardware cryptographic acceleration available on R9A09G077M44GBG#BC0?

Yes, R9A09G077M44GBG#BC0 includes a Trusted Secure IP module with AES, RSA, ECC, SHA-1/224/256, and GHASH engines, plus TRNG and 32-Kbit OTP - detailed in Table 1.3-11 and Figure 1.1-1. This hardware acceleration enables secure boot, encrypted firmware updates, and TLS offload without CPU overhead. The R9A09G077M44GBG#BC0 has this security IP enabled and fused for production use.