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Renesas RAA207703GBM#HC0
- Part No.:
- RAA207703GBM#HC0
- Manufacturer:
- Renesas
- Package:
- 35-WFBGA, CSPBGA
- Datasheet:
-
RAA207703GBM#HC0.pdf
- Description:
- IC REG BUCK ADJ 15A 35CSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,037
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Product details
Overview
RAA207703GBM from Renesas Electronics is a monolithic synchronous buck regulator with integrated high- and low-side power MOSFETs in a 35-ball CSP package (2.67 mm × 3.87 mm). It delivers up to 15 A continuous output current, supports 0.8 V–5.0 V adjustable output voltage, operates from 3.0 V–16 V input, and uses Constant-On-Time control for fast transient response in PC and server VR applications.
For engineers reviewing the RAA207703GBM datasheet, RAA207703GBM pinout, RAA207703GBM application, or RAA207703GBM equivalent, this page provides verified technical context, validated pin functions, confirmed efficiency curves at 12 V input/1.2 V output, real-world soft-start and light-load ELL mode behavior, and two rigorously cross-checked alternative parts for multi-supply or thermal-limited designs.
Technical Context
The RAA207703GBM implements a voltage-ripple–based Constant-On-Time (COT) control architecture where switching frequency varies inversely with input voltage to maintain near-constant frequency across line changes. Its 1-shot timer sets high-side on-time (typ. 210 ns at 12 V), while zero-current detection governs low-side conduction in light-load diode-emulation mode.
It integrates an internal 5 V LDO for single-supply operation, with LDO_EN# enabling external 5 V biasing; PGOOD monitors FB against 0.72 V with 30% soft-start delay; overcurrent protection triggers hiccup mode at 20 A (typ.), and thermal shutdown activates at 150°C with 15°C hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output current | 15 A continuous - supports CPU core rail in compact server modules without external MOSFETs |
| Input voltage range | 3.0 V–16 V - accommodates wide-input industrial supplies and 12 V server rails |
| Output voltage range | 0.8 V–5.0 V - programmable via resistor divider for DDR, GPU, or SoC core domains |
| Switching frequency | Adjustable up to 2 MHz - enables small inductors (e.g., 0.42 µH) and tight layout |
| Control architecture | Constant-On-Time - delivers <1 µs load-step response without loop compensation |
| Efficiency peak | 98% at 12 VIN/1.2 VOUT/10 A - achieved via low-RDS(on) integrated FETs and ELL mode |
| Thermal resistance θj-a | 27 °C/W - measured on Renesas reference board, guides heatsink-free PCB thermal design |
Pinout & Package
RAA207703GBM uses a 35-ball CSP (Chip Scale Package) with 0.4 mm pitch, dimensions 2.67 mm × 3.87 mm × 0.33 mm, Pb-Free/Halogen-Free compliant. Ball grid follows standard top-view labeling (A1–G5), with SW, VIN, and PGND distributed across multiple balls for low-inductance power routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| V5_OUT | Controller supply output | 5 V LDO output; powers internal logic and can bias external circuits when LDO_EN# = L |
| SGND | Analog ground reference | Must be connected to PGND on PCB; separates analog sensing from high-dI/dt power return |
| FB | Feedback voltage input | Monitors output via resistor divider; compares to 0.8 V reference for regulation |
| LDO_EN# | Internal 5 V LDO enable | Active-low; "L" enables internal LDO, "H" disables it for external 5 V supply |
| AVIN | Analog input voltage | Bias source for internal circuitry; must tie to VIN on PCB per datasheet layout guidance |
| BOOT | Bootstrap voltage node | Supplies gate drive for high-side FET; integrated SBD eliminates external diode |
| SET | Constant-on-time programming | Tie resistor between SW and SET sets on-time (e.g., 30 kΩ → 210 ns at 12 V) |
| PGOOD | Power-good indicator | Open-drain output pulled low during UVLO/OVP/OCP/TSD; delays 30% of soft-start time |
| SS | Soft-start timing | 2.5 µA current charges external capacitor; sets ramp time (e.g., 0.1 µF → 32 ms) |
| ON/OFF | Operation enable/disable | Active-high; "H" enables regulation, "L" forces shutdown with fast slew-rate requirement |
Key Features
| Feature | Design Value |
|---|---|
| Integrated power MOSFETs | Eliminates external high- and low-side FETs and drivers-reduces BOM count and layout area by >40% |
| Enhanced Light Load (ELL) mode | Reduces quiescent current to 400 µA (typ.) and enables diode emulation-boosts efficiency below 1 A |
| Single-supply operation | Internal 5 V LDO allows full functionality from one input rail-no auxiliary bias needed |
| Programmable soft start | External capacitor on SS pin sets precise ramp time-prevents inrush and enables sequencing |
| Robust protection suite | OCP (20 A typ.), OVP (1.00 V on FB), TSD (150°C), and UVLO ensure safe operation under fault conditions |
Applications
| Server CPU Core Rail | AI Accelerator Board Power |
|---|---|
|
Use Scenario: Delivering 1.2 V/12 A to high-performance x86 CPU cores in 1U rack servers with strict thermal envelope. IC Role / Device Role / Timing Role: Primary synchronous buck regulator with integrated FETs, handling dynamic load steps up to 8 A/µs. Use Value: 98% peak efficiency and COT control reduce heat sink requirements and improve transient margin vs. voltage-mode controllers. |
Use Scenario: Supplying 0.85 V/10 A to FPGA-based AI inference accelerators requiring tight voltage tolerance (<±1%) and low noise. IC Role / Device Role / Timing Role: Core VR controller with programmable FB divider and ripple-injection support for MLCC output caps. Use Value: Adjustable soft start and PGOOD sequencing enable safe power-up of multi-rail accelerator subsystems. |
| Industrial Edge Compute Module | High-Density Storage Controller |
|
Use Scenario: Providing 3.3 V/5 A to ARM-based edge compute SoCs operating in extended temperature (-40°C to +85°C) environments. IC Role / Device Role / Timing Role: Main DC-DC converter with thermal shutdown (150°C) and wide-input capability (3.0–16 V). Use Value: Internal LDO and LDO_EN# flexibility allow either single-rail or dual-rail (VIN + 5 V) supply configurations. |
Use Scenario: Generating 1.8 V/8 A for NVMe SSD controller ASICs in space-constrained storage enclosures. IC Role / Device Role / Timing Role: High-current buck regulator with 35-ball CSP footprint minimizing PCB area vs. QFN alternatives. Use Value: 2.67 mm × 3.87 mm package enables dense power delivery in multi-layer storage PCBs with minimal thermal via count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTQ2132BGQW | 3 A max output, 20 V max input, 16-pin WQFN; no integrated LDO; requires external bootstrap cap | Targeted at lower-current peripheral rails-not suitable for CPU core replacement | Select when output current ≤3 A and board space permits larger package with external components |
| MP2315GJ-Z | 6 A max output, 24 V max input, 10-pin QFN; fixed 500 kHz freq; no ELL mode or PGOOD | Lacks light-load efficiency optimization and sequencing support-unsuitable for multi-rail systems | Choose only for cost-sensitive, non-sequenced 5 V or 3.3 V rails where 6 A suffices |
Compared with RAA207703GBM, RTQ2132BGQW offers higher input voltage but lacks integrated LDO and current capability, while MP2315GJ-Z provides wider input range but omits critical features like PGOOD and ELL mode-making RAA207703GBM uniquely suited for high-density, thermally constrained server and AI power delivery.
Availability
RAA207703GBM is available at Aetrix Electronics and suitable for server motherboard development, AI accelerator board production, and industrial edge compute module manufacturing requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for RAA207703GBM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and datacenter applications.
The RAA20770x family was designed specifically for high-efficiency, high-current point-of-load regulation in space-constrained computing platforms-emphasizing integration, thermal performance, and seamless system-level power sequencing.
FAQ
What is the maximum continuous output current supported by the RAA207703GBM?
The RAA207703GBM supports up to 15 A continuous output current under recommended operating conditions (Ta ≤ 85°C, proper PCB thermal design). This rating is validated per the datasheet's Recommended Operating Conditions table and confirmed by thermal testing on Renesas' reference board with θj-a = 27 °C/W. Derating applies above 85°C ambient.
Does the RAA207703GBM require an external bootstrap diode?
No, the RAA207703GBM integrates a bootstrap diode (SBD) internally-eliminating the need for an external component on the BOOT pin. This simplifies layout, reduces BOM count, and improves reliability in high-frequency switching applications where external diode parasitics could degrade gate drive performance.
How is the switching frequency set on the RAA207703GBM?
The RAA207703GBM uses Constant-On-Time (COT) control, where frequency is determined by input voltage, output voltage, and programmed on-time. On-time is set via a resistor between SW and SET pins (e.g., 30 kΩ yields ~210 ns at 12 V), and fSW ≈ (VOUT/VIN) × (1/ton). Frequency adjusts dynamically with line and load to maintain stability without compensation networks.
Can the RAA207703GBM operate without its internal 5 V LDO?
Yes-the RAA207703GBM supports external 5 V biasing via the V5_OUT pin when LDO_EN# is driven high. In this mode, the internal LDO is disabled, and AVIN must be supplied externally at 4.5–16 V. This configuration is used when system-level power sequencing requires independent control of the controller supply.
What protection features does the RAA207703GBM include?
The RAA207703GBM includes overcurrent protection (OCP) triggering hiccup mode at 20 A (typ.), overvoltage protection (OVP) at 1.00 V on FB, thermal shutdown (TSD) at 150°C with 15°C hysteresis, undervoltage lockout (UVLO), and power-good (PGOOD) monitoring with fault reporting. All protections are fully integrated and require no external components.
RAA207703GBM#HC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 35-WFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 3V
- Voltage - Input (Max):
- 16V
- Voltage - Output (Min/Fixed):
- 0.8V
- Voltage - Output (Max):
- 5V
- Current - Output:
- 15A
- Frequency - Switching:
- Up to 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 35-CSP (2.67x3.87)
RAA207703GBM#HC0 FAQ
1.How can I place an order for RAA207703GBM#HC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for RAA207703GBM#HC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RAA207703GBM#HC0 reliable?
The price and inventory of RAA207703GBM#HC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RAA207703GBM#HC0 is usually 5 days.
3.What payment methods are accepted for RAA207703GBM#HC0?
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4.How is shipping managed for RAA207703GBM#HC0?
RAA207703GBM#HC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RAA207703GBM#HC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RAA207703GBM#HC0?
For technical support, including RAA207703GBM#HC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RAA207703GBM#HC0 requirements.
6.How does Aetrix verify that RAA207703GBM#HC0 is sourced from the original manufacturer or authorized distributors?
All RAA207703GBM#HC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RAA207703GBM#HC0 meets industry standards.
7.What is the process for return or replacement of RAA207703GBM#HC0?
All RAA207703GBM#HC0 units undergo pre-shipment inspection (PSI). If there is an issue with RAA207703GBM#HC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RAA207703GBM#HC0 part is unused and in its original packaging.
Return procedure for RAA207703GBM#HC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
RAA207703GBM#HC0 Tags
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