Renesas RAA2142904GNP#HC0

Overview

RAA2142904GNP#HC0 from Renesas Electronics is a 1A adjustable-output PMOS low-dropout linear regulator operating from 2.5V to 20V input, delivering stable output from 1.224V to 18V with 540mV typical dropout at 1A. It features 3μA shutdown current, 80μA no-load ground current, and integrated UVLO, enable control, short-circuit foldback, and over-temperature shutdown - deployed in battery-powered MCU power supplies and USB devices.

For engineers reviewing the RAA2142904GNP#HC0 datasheet, RAA2142904GNP#HC0 pinout, RAA2142904GNP#HC0 application, or RAA2142904GNP#HC0 equivalent, key selection criteria include input voltage headroom vs. output setting, thermal performance in DFN3×3 package, stability with ≥2.2μF X5R/X7R output capacitor, and EN threshold hysteresis for noise-immune enable sequencing.

Technical Context

The RAA2142904GNP#HC0 implements a PMOS pass transistor architecture with bandgap-referenced error amplifier feedback, enabling precise DC regulation across load (0–1A), input (2.5–20V), and temperature (−40°C to +125°C) extremes. Its internal UVLO (2.1V rising, 200mV hysteresis) and EN control (1.35–1.65V threshold, 125–245mV hysteresis) ensure robust startup and fault-safe disable behavior.

Protection functions are tightly coordinated: short-circuit current limit initiates foldback above ~8V VIN–VOUT differential, while over-temperature shutdown activates at +150°C with 20°C hysteresis. Thermal resistance is 56°C/W (θJA, DFN3×3), and stability requires only 2.2μF minimum output capacitance with X5R/X7R dielectric.

Key Specifications

Pinout & Package

RAA2142904GNP#HC0 is packaged in an 8-lead 3mm × 3mm DFN with exposed thermal pad (EPAD). The EPAD must be soldered to PCB ground plane for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS7A4700RGWR and ADM7172ACPZ-R7, the RAA2142904GNP#HC0 uniquely balances adjustability, ultra-low IQ (3μA shutdown), minimal COUT (2.2μF), and industrial temperature support - making it optimal for compact, battery-aware, multi-voltage embedded systems where layout area and standby power are critical.

Availability

RAA2142904GNP#HC0 is available at Aetrix Electronics and suitable for battery-powered equipment, MCU power supply design, and USB device development requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for RAA2142904GNP#HC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog power, and connectivity solutions for automotive, industrial, and IoT markets.

The RAA214290 series belongs to Renesas' high-performance LDO portfolio, designed specifically for space-constrained, thermally demanding applications needing wide-input, low-IQ, and adjustable-output regulation with robust protection.

FAQ

What is the minimum output capacitor required for stable operation of the RAA2142904GNP#HC0?

The RAA2142904GNP#HC0 is stable with a minimum 2.2μF X5R or X7R ceramic output capacitor. This value is validated across −40°C to +125°C, full input (2.5–20V) and output (1.224–18V) ranges, and 0–1A load. Using smaller capacitors risks instability and poor transient response; larger values improve ripple rejection but are not required for basic stability.

Does the RAA2142904GNP#HC0 support adjustable output voltage, and how is it configured?

Yes, the RAA2142904GNP#HC0 supports adjustable output from 1.224V to 18V via external resistors on the ADJ pin. The ADJ pin is internally referenced to 1.224V, so VOUT = 1.224V × (1 + RF/RG). Table 1 in the datasheet provides standard resistor pairs for common rails (e.g., 3.3V, 5V, 12V) with ≤0.7% error using 0.1% tolerance resistors.

What thermal performance can be expected from the RAA2142904GNP#HC0 in its DFN3×3 package?

In the 3mm × 3mm DFN package, the RAA2142904GNP#HC0 has a junction-to-ambient thermal resistance (θJA) of 56°C/W under standard JEDEC test conditions. With proper EPAD soldering to a 4-layer PCB ground plane, it sustains 1A output at ambient temperatures up to +85°C when VIN–VOUT ≤ 3V. Derating is required above that differential to maintain TJ ≤ +125°C.

How does the enable (EN) pin function on the RAA2142904GNP#HC0, and what are its voltage thresholds?

The EN pin is active-high with a nominal threshold of 1.5V, ±150mV hysteresis (1.35V to 1.65V). Pulling EN <1.35V disables the LDO, reducing ground current to 3μA. Pulling EN >1.65V enables regulation. The pin must never float - tie to VIN for automatic startup or use an MCU GPIO with appropriate pull-up if open-drain control is needed.

What protection features are integrated into the RAA2142904GNP#HC0?

The RAA2142904GNP#HC0 integrates four key protections: (1) Input UVLO (2.1V rising, 200mV hysteresis), (2) Enable-controlled shutdown (3μA IQ), (3) Short-circuit current limit with foldback (1.25A nominal, reduces to 430mA above 8V VIN–VOUT), and (4) Over-temperature shutdown at +150°C with 20°C hysteresis. All operate independently and concurrently without external components.