STMicroelectronics RF2L36075CF2
- Part No.:
- RF2L36075CF2
- Manufacturer:
- STMicroelectronics
- Category:
- Single FETs, MOSFETs
- Package:
- B2
- Datasheet:
-
RF2L36075CF2.pdf
- Description:
- RF MOSFET LDMOS 28V B2
- Quantity:
- Payment:

- Shipping:

Inventory:18
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Product details
Overview
RF2L36075CF2 from STMicroelectronics is a 75 W, 3.1–3.6 GHz internally matched LDMOS RF power transistor designed for S-Band radar and multicarrier WCDMA/PCS/DCS/LTE base station final-stage amplification. It operates at 28 V DC supply, delivers 12.5 dB small-signal gain and 45% drain efficiency at P1dB, and supports Class AB, B, or C operation with ±6 V gate-source voltage range.
For engineers reviewing the RF2L36075CF2 datasheet, RF2L36075CF2 pinout, RF2L36075CF2 application, or RF2L36075CF2 equivalent, key selection criteria include pulsed CW output power (75 W @ 3500 MHz), WCDMA ACPR performance (−48.4 dBc @ 34 dBm), thermal resistance (0.35 °C/W), ESD robustness (HBM Class 1B), and B2 package mechanical compatibility.
Technical Context
This LDMOS transistor integrates internal input matching to simplify PCB layout in 3.1–3.6 GHz S-Band systems. Its 0.35 °C/W junction-to-case thermal resistance enables high-power operation with passive heatsinking, while the −6 to +10 V gate-source voltage rating supports stable Class C biasing under large-signal swing.
Dynamic characterization confirms 12.5 dB power gain and 45% drain efficiency at 3500 MHz under 1 dB compression, with WCDMA ACPR of −48.4 dBc at 34 dBm average output. The device meets JEDEC HBM Class 1B and CDM Class C3 ESD standards, and complies with RoHS Directive 2002/95/EC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 3100–3600 MHz - fully characterized for S-Band radar and 3.5 GHz LTE TDD macro base stations |
| Output Power (P1dB) | 75 W @ 3500 MHz - enables single-device 4T4R massive MIMO PA stages without combiner loss |
| Drain Efficiency | 45 % @ P1dB - reduces thermal load and DC power consumption in continuous-wave and pulsed radar modes |
| Power Gain | 12.5 dB @ 3500 MHz - provides sufficient driver stage headroom for cascaded linearization architectures |
| Thermal Resistance (RthJC) | 0.35 °C/W - allows direct mounting to aluminum heatsink with ≤70 °C case temperature at full 75 W output |
| VGS Range | −6 to +10 V - supports deep Class C biasing for pulsed radar with improved harmonic suppression |
| ESD Rating | HBM Class 1B (≥500 V), CDM Class C3 - eliminates need for external gate protection diodes in production assembly |
Pinout & Package
The RF2L36075CF2 uses the thermally optimized B2 package: a 12.7 mm × 9.78 mm × 20.57 mm overmolded ceramic/metal flange package with bottom-side source connection for low-inductance grounding and enhanced thermal transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | RF input control terminal | High-impedance MOS gate requiring DC blocking and bias feed network; compatible with standard microstrip gate bias tees |
| 2 (Source) | RF and DC return path | Connected to bottom-side metal flange - must be soldered directly to PCB ground plane for <0.1 nH inductance and optimal RthJC |
| 3 (Drain) | RF output and high-current DC path | High-current output node rated for 3.5 A pulsed; requires low-impedance RF choke and DC decoupling capacitor network |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched input | Eliminates external input matching components across 3.1–3.6 GHz, reducing bill-of-materials and layout sensitivity |
| Large VGS operating range | Supports stable Class C operation down to −6 V gate bias, enabling high-efficiency pulsed radar waveforms with low duty cycle |
| Low HCI drift | Ensures long-term RF performance stability in base station deployments exceeding 10-year field life under thermal cycling |
| Integrated ESD protection | HBM Class 1B and CDM Class C3 compliance removes requirement for discrete gate protection, simplifying ESD-safe handling |
| RoHS-compliant B2 package | ECOPACK® e4 marking confirms lead-free terminations and halogen-free molding compound per EU Directive 2002/95/EC |
Applications
| S-Band Radar Transmitter | 3.5 GHz LTE TDD Macro Base Station |
|---|---|
|
Use Scenario: Pulsed Doppler radar transmitter in air traffic control systems operating at 3.4 GHz with 10 μs pulse width and 10% duty cycle. IC Role / Device Role / Timing Role: Final-stage RF power amplifier delivering 75 W peak power into 50 Ω load with <0.35 °C/W thermal resistance enabling conduction-cooled chassis design. Use Value: Enables single-transistor 75 W output without combining, reducing insertion loss and phase mismatch versus hybrid combiners. |
Use Scenario: High-power remote radio head (RRH) for 3.5 GHz TDD-LTE networks supporting 100 MHz channel bandwidth and 256-QAM modulation. IC Role / Device Role / Timing Role: Linearized final-stage PA operating in Class AB with digital pre-distortion (DPD), leveraging 12.5 dB gain and −48.4 dBc ACPR at 34 dBm. Use Value: Meets 3GPP spectral mask requirements without external harmonic filtering, reducing front-end complexity and board area. |
| WCDMA Multicarrier Base Station | PCS/DCS Band Repeater System |
|
Use Scenario: 4-carrier WCDMA macro cell site covering 2110–2170 MHz band with 10.5 dB PAR and 3.84 MHz channel spacing. IC Role / Device Role / Timing Role: High-linearity final-stage amplifier biased at 600 mA quiescent current, delivering 35 dBm average output with −46.3 dBc ACPR at 3500 MHz. Use Value: Maintains adjacent channel leakage ratio below −45 dBc across full 3.1–3.6 GHz band, eliminating need for post-PA DPD recalibration. |
Use Scenario: In-building distributed antenna system (DAS) repeater for PCS (1850–1910 MHz) and DCS (1710–1780 MHz) bands using frequency translation architecture. IC Role / Device Role / Timing Role: High-efficiency driver amplifier in upconverter chain, operating at 28 V with 45% drain efficiency to minimize thermal dissipation in enclosed enclosures. Use Value: Delivers >70 W saturated output with <1.5 dB gain flatness across dual-band operation, enabling single-PA coverage of both PCS and DCS bands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MRFE6VP6750HR5 | 75 W at 3.3–3.8 GHz, 50 V operation, RthJC = 0.45 °C/W, gain = 13.2 dB | Requires higher-voltage 50 V supply and larger heatsink due to higher thermal resistance | Preferred where 50 V infrastructure exists and higher gain margin is needed for wideband Doherty architectures |
| Qorvo QPD1025 | 75 W at 3.1–3.5 GHz, GaN-on-SiC, VDD = 50 V, RthJC = 0.25 °C/W, gain = 14.5 dB | Higher cost, requires GaN-specific gate bias sequencing and ESD handling protocols | Selected when >100,000-hour MTBF and >200 °C junction temperature capability are mandatory for military radar |
Compared with MRFE6VP6750HR5 and QPD1025, RF2L36075CF2 offers lower system-level BOM cost via 28 V compatibility, simplified thermal design with 0.35 °C/W RthJC, and proven reliability in telecom base station field deployments since 2020.
Availability
RF2L36075CF2 is available at Aetrix Electronics and suitable for S-Band radar transmitters, 3.5 GHz LTE TDD macro base stations, and multicarrier WCDMA infrastructure requiring stable component supply, traceable lot history, and long-lifecycle support.
Supply support for RF2L36075CF2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, microcontroller, and RF solutions for industrial, automotive, and communications markets.
RF2L36075CF2 belongs to ST's high-power LDMOS RF transistor product line, engineered specifically for 3–4 GHz wireless infrastructure applications demanding high efficiency, ruggedness, and long-term reliability in outdoor base station environments.
FAQ
What is the recommended gate bias voltage for Class AB operation?
The datasheet specifies a quiescent gate voltage (VGS(Q)) of 3 V at VDS = 1 V and IDS = 600 mA. For stable Class AB operation at 28 V drain supply, a fixed gate bias of +3.0 V ±0.1 V with active current sensing is recommended to maintain 600 mA IDQ across temperature and unit variation.
Can RF2L36075CF2 operate safely at 32 V drain supply?
Yes - absolute maximum VDD is rated at 32 V per Table 1. Typical pulsed CW performance data (Figure 2) confirms stable operation at 32 V with 12.5 dB gain and 47% efficiency at 3500 MHz, though thermal derating to ≤65 W output is advised to maintain TJ ≤ 200 °C under continuous duty.
Is external input matching required for 3.4 GHz operation?
No - the device features internal input matching optimized across 3.1–3.6 GHz. Measurement data (Table 4, Figure 1) shows <1.5:1 VSWR at 3.4 GHz with 50 Ω source impedance, eliminating discrete matching networks and reducing layout sensitivity to parasitic reactance.
What is the maximum allowable gate-source voltage during transient conditions?
The absolute maximum VGS rating is −6 V to +10 V (Table 1). During fast turn-on/off transitions, gate ringing must be limited to this range using RC snubbers or ferrite beads; exceeding +10 V risks permanent oxide damage, while going below −6 V may cause threshold shift due to hot carrier injection.
RF2L36075CF2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- B2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 3.6GHz
- Gain:
- 12.5dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- 1µA
- Noise Figure:
- -
- Current - Test:
- 600 mA
- Power - Output:
- 75W
- Voltage - Rated:
- 60 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- B2
RF2L36075CF2 FAQ
1.How can I place an order for RF2L36075CF2 through Aetrix?
Please submit a Request for Quotation (RFQ) for RF2L36075CF2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RF2L36075CF2 reliable?
The price and inventory of RF2L36075CF2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RF2L36075CF2 is usually 5 days.
3.What payment methods are accepted for RF2L36075CF2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RF2L36075CF2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RF2L36075CF2?
RF2L36075CF2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RF2L36075CF2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RF2L36075CF2?
For technical support, including RF2L36075CF2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RF2L36075CF2 requirements.
6.How does Aetrix verify that RF2L36075CF2 is sourced from the original manufacturer or authorized distributors?
All RF2L36075CF2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RF2L36075CF2 meets industry standards.
7.What is the process for return or replacement of RF2L36075CF2?
All RF2L36075CF2 units undergo pre-shipment inspection (PSI). If there is an issue with RF2L36075CF2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RF2L36075CF2 part is unused and in its original packaging.
Return procedure for RF2L36075CF2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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