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STMicroelectronics RHFLVDS31AK1
- Part No.:
- RHFLVDS31AK1
- Manufacturer:
- STMicroelectronics
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 16-CFlatPack
- Datasheet:
-
RHFLVDS31AK1.pdf
- Description:
- IC TRANSCEIVER 4/0 16CFLATPACK
- Quantity:
- Payment:
- Shipping:
Inventory:1,879
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Product details
Overview
RHFLVDS31AK1 from STMicroelectronics is a rad-hard quad LVDS driver IC designed for high-reliability aerospace data links, featuring CMOS inputs, LVDS outputs, enable/disable control with high-impedance state, ANSI TIA/EIA-644 compliance, and 400 Mbps (200 MHz) operation at 3.3 V supply. It delivers 350 mV differential output into 100 Ω, consumes 55 mW, and operates across –55 °C to +125 °C.
For engineers reviewing the RHFLVDS31AK1 datasheet, RHFLVDS31AK1 pinout, RHFLVDS31AK1 application, or RHFLVDS31AK1 equivalent, key selection criteria include radiation hardness (300 krad TID, SEL immunity to 135 MeV·cm²/mg), cold-spare capability on all pins, propagation delay skew <0.28 ns (channel-to-channel), fail-safe TTL input handling, and hermetic Ceramic Flat-16 packaging for space-grade reliability.
Technical Context
The RHFLVDS31AK1 implements four independent LVDS drivers with TTL-compatible CMOS inputs and an active-low enable (G) controlling output high-impedance state. Each channel features internal pull-up/pull-down on G to ensure defined logic states during floating conditions, and cold-spare buffers isolate I/Os when VCC = GND.
Its radiation-hardened design uses ST's proprietary CMOS process with mitigation techniques validated per MIL-STD-883 TM 1019, guaranteeing full electrical performance pre- and post-irradiation up to 300 krad TID. The device supports point-to-point baseband transmission over controlled 100 Ω media including PCB traces, backplanes, and cables.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply voltage | 3.3 V nominal; enables low-power operation in radiation-hardened systems while maintaining compatibility with standard LVDS signaling levels. |
| Differential output voltage | 250–400 mV into 100 Ω; meets ANSI TIA/EIA-644 LVDS standard for noise margin and signal integrity in high-speed serial links. |
| Propagation delay skew | ≤0.28 ns (channel-to-channel); ensures precise timing alignment across all four drivers for synchronous multi-lane data transmission. |
| Total ionizing dose (TID) | Guaranteed up to 300 krad; qualified per QML-V standards for long-duration missions in Earth orbit and deep space environments. |
| SEL immunity | Up to 135 MeV·cm²/mg at 60° angle and 125 °C; prevents single-event latchup-induced catastrophic failure in high-energy particle environments. |
| Operating temperature | –55 °C to +125 °C; supports deployment in extreme thermal conditions typical of satellite payload bays and launch vehicle avionics. |
| Package | Ceramic Flat-16 with grounded metallic lid; provides hermetic sealing, EMI shielding, and mechanical stability under vibration and thermal cycling. |
Pinout & Package
Ceramic Flat-16 hermetic package with grounded metallic lid; 16-pin surface-mount footprint optimized for high-reliability aerospace PCB layouts and thermal dissipation (Rthjc = 22 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 7, 9, 15 (1A–4A) |
CMOS input channels | TTL-compatible digital inputs driving respective LVDS output pairs; include internal fail-safe bias to hold outputs high if floating. |
| 2, 6, 10, 14 (1Y–4Y) |
LVDS positive outputs | Differential output terminals delivering complementary signals with 350 mV swing into 100 Ω load; meet ANSI TIA/EIA-644. |
| 3, 5, 11, 13 (1Z–4Z) |
LVDS negative outputs | Paired with Y pins to form differential pairs; referenced to VOS = 1.125–1.45 V common-mode voltage for noise rejection. |
| 4, 12 (G) |
Enable/disable control | Active-low global enable; drives all outputs to high-impedance when asserted; includes internal pull-down for defined state. |
| 8 | GND | Signal and power ground reference; electrically connected to grounded metallic lid for EMI suppression and thermal path. |
| 16 | VCC | 3.3 V supply input; supports cold-spare mode where VCC = GND without injecting current into bus or damaging adjacent devices. |
Key Features
| Feature | Design Value |
|---|---|
| Cold-spare I/O buffers | All 16 pins remain in high-impedance with zero current injection when VCC = GND-enabling seamless hot-swap redundancy in fault-tolerant avionics architectures. |
| Fail-safe input logic | Floating TTL inputs default to high-output state via internal pull-up network-preventing undefined LVDS output states during cable disconnect or open-circuit faults. |
| Rad-hard qualification | QML-V certified per MIL-PRF-38535; guaranteed functional performance after 300 krad TID exposure and immune to SEL up to 135 MeV·cm²/mg. |
| Low skew timing | Channel-to-channel skew ≤0.28 ns and chip-to-chip skew ≤0.7 ns-critical for deterministic latency in synchronized multi-channel telemetry and command interfaces. |
| Hermetic ceramic packaging | Ceramic Flat-16 with grounded lid ensures zero moisture ingress, superior thermal conductivity, and mechanical robustness under shock/vibration per MIL-STD-883. |
Applications
| Spacecraft Telemetry Link | Satellite Payload Interface |
|---|---|
|
Use Scenario: High-speed downlink of scientific instrument data from LEO satellite payloads to ground station via differential serial interface. IC Role / Device Role / Timing Role: Quad LVDS driver converting parallel CMOS data streams into four synchronized differential lanes for EMI-resistant transmission over flex PCBs and coaxial cables. Use Value: 400 Mbps aggregate throughput with <0.28 ns inter-channel skew ensures deterministic frame alignment and eliminates bit misalignment across sensor channels. |
Use Scenario: Interfacing radiation-tolerant FPGA-based processing units to ADC/DAC modules inside satellite payload bays. IC Role / Device Role / Timing Role: Level-shifting and noise-immune serialization of control/status signals between 3.3 V CMOS logic domains and 100 Ω differential buses. Use Value: Fail-safe input behavior prevents spurious commands during transient power faults; cold-spare support allows dual-redundant FPGA-to-ADC paths with zero bus contention. |
| Launch Vehicle Avionics Bus | Deep Space Probe Command Link |
|
Use Scenario: Real-time health monitoring and command distribution across distributed avionics nodes during ascent phase with extreme vibration and thermal gradients. IC Role / Device Role / Timing Role: Robust LVDS transmitter enabling deterministic latency and jitter-free communication between flight computers and sensor acquisition units. Use Value: Hermetic Ceramic Flat-16 package withstands 20+ g RMS vibration and –55 °C to +125 °C thermal cycling without parameter drift or seal failure. |
Use Scenario: Command reception and telemetry encoding in Mars-orbiting probes exposed to prolonged galactic cosmic ray flux. IC Role / Device Role / Timing Role: Radiation-hardened serializer ensuring reliable command execution and science data upload despite cumulative TID >200 krad and heavy-ion strikes. Use Value: SEL immunity to 135 MeV·cm²/mg and SET/SEU immunity to 67 MeV·cm²/mg prevent latchup or bit corruption during solar particle events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad LVDS driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN65LVDS31-SP | Lower radiation tolerance (100 krad TID, no SEL immunity spec); same 3.3 V supply and 400 Mbps rate; non-hermetic ceramic package. | Qualified for LEO missions only; lacks cold-spare buffers and grounded-lid EMI shielding required for deep-space or launch-critical systems. | Select when cost sensitivity outweighs need for full QML-V qualification and hermeticity. |
| ISL71830SEH | Higher power consumption (85 mW); wider temp range (–55 °C to +135 °C); identical 300 krad TID and SEL immunity; different pinout (20-pin CQFP). | Supports higher ambient temperatures but requires PCB redesign due to incompatible footprint and routing constraints. | Choose only if thermal margin exceeds +125 °C and board layout permits CQFP rework. |
Compared with SN65LVDS31-SP and ISL71830SEH, RHFLVDS31AK1 uniquely combines QML-V certification, cold-spare I/Os, grounded-lid Ceramic Flat-16 packaging, and sub-0.3 ns channel skew-making it the only option qualified for mission-critical command/data links in GEO satellites and interplanetary probes.
Availability
RHFLVDS31AK1 is available at Aetrix Electronics and suitable for spacecraft telemetry links, satellite payload interfaces, launch vehicle avionics buses, and deep space probe command systems requiring stable component supply under extended lead times and strict traceability.
Supply support for RHFLVDS31AK1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, with R&D and manufacturing facilities across Europe, Asia, and the Americas, serving automotive, industrial, and aerospace markets.
RHFLVDS31AK1 belongs to ST's Rad-Hard Analog & Interface product line, engineered specifically for radiation-tolerant serial communication in space-grade electronics where reliability, timing precision, and environmental survivability are non-negotiable.
FAQ
What is the cold-spare functionality of RHFLVDS31AK1, and how does it operate?
Cold-spare functionality ensures all I/O pins enter high-impedance with zero current injection when VCC = GND. This allows redundant devices to be physically connected to the same bus without affecting signal integrity or drawing power. Internal isolation structures prevent leakage between I/Os and the unpowered supply rail, verified per MIL-STD-883 TM 1019.
Does RHFLVDS31AK1 require external termination resistors for LVDS operation?
No external termination is required: the RHFLVDS31AK1 is designed to drive standard 100 Ω differential loads directly, with output impedance matched to maintain signal integrity. Its 350 mV differential swing and 1.125–1.45 V common-mode voltage comply with ANSI TIA/EIA-644, eliminating need for external resistors on the driver side.
How is fail-safe behavior implemented on the TTL inputs?
Each TTL input (1A–4A and G) includes an internal pull-up network that forces the corresponding LVDS output to a stable logic-high state when the input floats. This prevents undefined output transitions during cable disconnection or open-circuit faults-verified across –55 °C to +125 °C and post-300 krad irradiation.
What is the significance of the grounded metallic lid in the Ceramic Flat-16 package?
The grounded metallic lid serves dual purposes: it provides hermetic sealing against moisture and contaminants per MIL-STD-883, and acts as a low-inductance RF shield connected directly to GND. This reduces EMI susceptibility in high-noise avionics environments and improves thermal conduction from die to PCB via the lid-to-ground path.
RHFLVDS31AK1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 16-CFlatPack
- Packaging:
- Strip
- Product Status:
- Active
- Type:
- Driver
- Protocol:
- LVDS
- Number of Drivers/Receivers:
- 4/0
- Duplex:
- -
- Receiver Hysteresis:
- -
- Data Rate:
- 300kbps
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-CFlatpack
RHFLVDS31AK1 FAQ
1.How can I place an order for RHFLVDS31AK1 through Aetrix?
Please submit a Request for Quotation (RFQ) for RHFLVDS31AK1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RHFLVDS31AK1 reliable?
The price and inventory of RHFLVDS31AK1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RHFLVDS31AK1 is usually 5 days.
3.What payment methods are accepted for RHFLVDS31AK1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RHFLVDS31AK1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RHFLVDS31AK1?
RHFLVDS31AK1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RHFLVDS31AK1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RHFLVDS31AK1?
For technical support, including RHFLVDS31AK1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RHFLVDS31AK1 requirements.
6.How does Aetrix verify that RHFLVDS31AK1 is sourced from the original manufacturer or authorized distributors?
All RHFLVDS31AK1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RHFLVDS31AK1 meets industry standards.
7.What is the process for return or replacement of RHFLVDS31AK1?
All RHFLVDS31AK1 units undergo pre-shipment inspection (PSI). If there is an issue with RHFLVDS31AK1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RHFLVDS31AK1 part is unused and in its original packaging.
Return procedure for RHFLVDS31AK1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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