STMicroelectronics RHFLVDSR2D2K1
- Part No.:
- RHFLVDSR2D2K1
- Manufacturer:
- STMicroelectronics
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 18-CFlatpack
- Datasheet:
-
RHFLVDSR2D2K1.pdf
- Description:
- RAD-HARD DUAL LVDS TRANSCEIVER
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
RHFLVDSR2D2K1 from STMicroelectronics is a rad-hard dual LVDS driver-receiver IC designed for aerospace data links, featuring two independent TTL-to-LVDS drivers and two LVDS-to-TTL receivers, 3.3 V operation, 400 Mbps data rate, -55 °C to +125 °C temperature range, and hermetic Ceramic Flat-18 packaging. It supports fail-safe outputs, cold-spare I/O buffers, and radiation tolerance up to 300 krad TID.
For engineers reviewing the RHFLVDSR2D2K1 datasheet, RHFLVDSR2D2K1 pinout, RHFLVDSR2D2K1 application, or RHFLVDSR2D2K1 equivalent, key selection criteria include radiation hardness (300 krad TID, SEL immunity to 135 MeV·cm²/mg), LVDS timing skew (≤0.25 ns channel-to-channel), fail-safe receiver behavior, and cold-spare capability across all pins under VCC = GND.
Technical Context
The RHFLVDSR2D2K1 integrates two fully independent LVDS transceivers on a single die: each driver accepts TTL-level inputs and delivers differential LVDS outputs compliant with ANSI TIA/EIA-644; each receiver accepts LVDS inputs over -4 V to +5 V common-mode range and produces TTL-compatible outputs. All I/Os feature cold-spare buffers enabling high-impedance state when VCC = GND.
Fail-safe logic ensures stable high-level TTL outputs during floating or shorted LVDS inputs; propagation delays are tightly controlled (tPHLD/tPLHD ≤ 2.5 ns), with channel-to-channel skew ≤ 0.25 ns and differential skew ≤ 0.3 ns. Radiation hardening is achieved via full CMOS process qualification per MIL-STD-883 TM 1019 at dose rates of 50–300 rad/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 400 Mbps - Enables high-speed serial communication in space-grade avionics backplanes and inter-board links. |
| Supply Voltage | 3.3 V (3.0–3.6 V) - Matches standard low-voltage aerospace power rails; absolute max 4.8 V ensures robustness against transient overvoltage. |
| Temperature Range | -55 °C to +125 °C - Qualified for extreme thermal environments in satellite payload electronics and launch vehicle control systems. |
| Radiation Tolerance | 300 krad TID - Guaranteed functional integrity after total ionizing dose exposure typical of LEO/MEO orbits over mission lifetime. |
| SEL Immunity | 135 MeV·cm²/mg - Withstands single-event latchup in high-energy proton and heavy-ion environments without destructive failure. |
| Common-Mode Range | -4 V to +5 V - Accommodates wide signal swing on long PCB traces or cables, supporting noise-resilient differential signaling in noisy spacecraft bays. |
| Power Consumption | 19 mA typical supply current - Enables low-power, thermally constrained designs in radiation-hardened FPGAs and microcontrollers. |
Pinout & Package
Package: Hermetic Ceramic Flat-18 with grounded metallic lid, qualified per MIL-PRF-38535 QML-V standards. Dimensions: 11.81 mm × 7.11 mm × 2.46 mm (L × W × A), mass 0.65 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7 | DIN1, DEN1, RIN1−, RIN1+, REN1, DOUT1−, DOUT1+ | Channel 1 driver input/enable and receiver input/enable plus differential outputs - Fully isolated signal path with independent enable control. |
| 8, 9, 10, 11, 12, 13, 14 | RIN2−, RIN2+, DIN2, DEN2, REN2, DOUT2−, DOUT2+ | Channel 2 driver/receiver pair - Identical functionality to Channel 1, enabling dual-link redundancy or parallel data transmission. |
| 15, 16, 17, 18 | VCC, GND, ROUT1, ROUT2 | Single 3.3 V supply rail, ground reference, and TTL output buffers - ROUT1/ROUT2 deliver logic-level signals compatible with FPGA I/O banks and ASIC control interfaces. |
Key Features
| Feature | Design Value |
|---|---|
| Fully independent dual-channel architecture | Enables simultaneous bidirectional LVDS communication on two separate buses without crosstalk or shared timing constraints. |
| Cold-spare I/O buffers on all pins | Allows redundant units to remain powered off (VCC = GND) while connected to live data buses-no bus contention or leakage injection. |
| Fail-safe receiver logic | Guarantees TTL-high output when LVDS inputs are open, shorted, or terminated-prevents undefined states in fault conditions. |
| Low skew performance | Channel-to-channel skew ≤ 0.25 ns ensures deterministic timing alignment critical for synchronous multi-lane protocols like SpaceWire or custom telemetry links. |
| Hermetic ceramic packaging | Provides long-term reliability in vacuum, humidity, and thermal cycling environments typical of orbital and deep-space missions. |
Applications
| Onboard Telemetry Link | Satellite Payload Interface |
|---|---|
|
Use Scenario: High-reliability serial link between star tracker sensor and flight computer in LEO satellite. IC Role / Device Role / Timing Role: Dual LVDS transceiver providing isolated, radiation-tolerant data transport with fail-safe receiver behavior during solar particle events. Use Value: Ensures continuous telemetry stream even under single-event upsets or partial power loss, leveraging cold-spare capability for hot-swappable redundancy. |
Use Scenario: Interfacing radiation-hardened FPGA to ADC/DAC modules in scientific instrument payload. IC Role / Device Role / Timing Role: LVDS level-shifter and signal conditioner enabling 400 Mbps data transfer across 15 cm PCB trace with <0.25 ns skew. Use Value: Maintains signal integrity over extended routing while meeting strict timing budgets for real-time sensor data acquisition. |
| Launch Vehicle Avionics Bus | Deep-Space Probe Command Link |
|
Use Scenario: Bidirectional command/data interface between guidance computer and inertial measurement unit during ascent phase. IC Role / Device Role / Timing Role: Dual-channel driver-receiver handling time-critical attitude control feedback with guaranteed <2.5 ns propagation delay. Use Value: Supports deterministic loop closure under high-G vibration and EMI, with SEL immunity preventing latchup during engine ignition transients. |
Use Scenario: Low-power, radiation-hardened interface between onboard processor and RF modem in Mars orbiter mission. IC Role / Device Role / Timing Role: LVDS transceiver operating at -55 °C to +125 °C with 300 krad TID tolerance for multi-year deep-space exposure. Use Value: Eliminates need for shielding or derating, reducing system mass and power while ensuring end-of-mission data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar rad-hard LVDS transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SNJ54LVDS31FK | Non-rad-hard, commercial temperature range (-55 °C to +125 °C not guaranteed), no TID/SEL characterization, lower skew (0.15 ns) but unqualified for space. | Limited to ground-test equipment or non-flight subsystems where radiation is not a concern. | Select only for prototyping or non-flight hardware; lacks QML-V certification and radiation test reports. |
| RHFLVDSR2D2K01V | Same die, QML-V flight model with full SMD 5962F06202 compliance, certified screening (PIND, SEM, X-ray), and complete documentation package (CD-ROM). | Required for flight hardware integration where traceability, lot-level radiation data, and MIL-PRF-38535 Group C/D testing are mandatory. | Use RHFLVDSR2D2K01V for production flight units; RHFLVDSR2D2K1 is engineering model for design validation only. |
Compared with RHFLVDSR2D2K1, SNJ54LVDS31FK offers tighter timing but zero radiation assurance, while RHFLVDSR2D2K01V provides identical electrical performance with full flight qualification-making it the only drop-in replacement for mission-critical deployments.
Availability
RHFLVDSR2D2K1 is available at Aetrix Electronics and suitable for aerospace telemetry links, satellite payload interfaces, launch vehicle avionics buses, and deep-space probe command systems requiring stable component supply under extended lead times and rigorous traceability.
Supply support for RHFLVDSR2D2K1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and aerospace-grade ICs with vertical manufacturing and radiation-hardened process expertise.
RHFLVDSR2D2K1 belongs to ST's RHFL (Rad-Hard Fast Logic) product line, engineered specifically for high-reliability space data communication where radiation tolerance, thermal resilience, and deterministic timing are non-negotiable.
FAQ
Is RHFLVDSR2D2K1 pin-compatible with RHFLVDSR2D2K01V?
Yes-both share identical Ceramic Flat-18 pinout, electrical specifications, and functional behavior. The K1 suffix denotes an engineering model with full electrical and thermal characterization but without full QML-V screening documentation; K01V adds MIL-PRF-38535 Group C/D testing, PIND, SEM, and traceable radiation reports required for flight use.
What is the purpose of cold-spare buffering on all pins?
Cold-spare buffering places all I/Os in high-impedance state when VCC = GND, allowing redundant RHFLVDSR2D2K1 units to remain physically connected to live data buses without injecting current, loading signals, or causing contention-critical for hot-swap-capable avionics architectures.
Does RHFLVDSR2D2K1 support fail-safe operation on both drivers and receivers?
Fail-safe logic is implemented only on the receivers: when RIN+ and RIN− are floating or shorted, ROUT1/ROUT2 default to TTL-high. Drivers do not have fail-safe outputs; their TTL inputs require defined logic levels, but cold-spare mode ensures safe high-Z state if VCC is removed.
Can RHFLVDSR2D2K1 operate with a 2.5 V supply?
No-RHFLVDSR2D2K1 is specified only for 3.0–3.6 V operation. At 2.5 V, internal biasing fails, LVDS output voltage swing collapses below 250 mV, and receiver thresholds become undefined. Operation outside this range voids radiation and timing guarantees.
RHFLVDSR2D2K1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 18-CFlatpack
- Packaging:
- Strip
- Product Status:
- Active
- Type:
- Transceiver
- Protocol:
- LVDS
- Number of Drivers/Receivers:
- 2/2
- Duplex:
- Full
- Receiver Hysteresis:
- -
- Data Rate:
- 400Mbps
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-CFlatpack
RHFLVDSR2D2K1 FAQ
1.How can I place an order for RHFLVDSR2D2K1 through Aetrix?
Please submit a Request for Quotation (RFQ) for RHFLVDSR2D2K1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RHFLVDSR2D2K1 reliable?
The price and inventory of RHFLVDSR2D2K1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RHFLVDSR2D2K1 is usually 5 days.
3.What payment methods are accepted for RHFLVDSR2D2K1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RHFLVDSR2D2K1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RHFLVDSR2D2K1?
RHFLVDSR2D2K1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RHFLVDSR2D2K1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RHFLVDSR2D2K1?
For technical support, including RHFLVDSR2D2K1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RHFLVDSR2D2K1 requirements.
6.How does Aetrix verify that RHFLVDSR2D2K1 is sourced from the original manufacturer or authorized distributors?
All RHFLVDSR2D2K1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RHFLVDSR2D2K1 meets industry standards.
7.What is the process for return or replacement of RHFLVDSR2D2K1?
All RHFLVDSR2D2K1 units undergo pre-shipment inspection (PSI). If there is an issue with RHFLVDSR2D2K1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RHFLVDSR2D2K1 part is unused and in its original packaging.
Return procedure for RHFLVDSR2D2K1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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