Renesas RM25C32DS-LSNI-B
- Part No.:
- RM25C32DS-LSNI-B
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
RM25C32DS-LSNI-B.pdf
- Description:
- IC CBRAM 32KBIT SPI 20MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,460
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Product details
Overview
RM25C32DS-LSNI-B from Adesto Technologies is a 32Kbit non-volatile serial EEPROM memory IC using CBRAM® resistive technology, operating from 1.65V to 3.6V supply, supporting SPI modes 0 and 3, with 10 MHz fast read capability and 1.5 ms page write time - deployed in industrial sensor nodes for firmware parameter storage.
For engineers reviewing the RM25C32DS-LSNI-B datasheet, RM25C32DS-LSNI-B pinout, RM25C32DS-LSNI-B application, or RM25C32DS-LSNI-B equivalent, key selection criteria include ultra-low energy byte write (50 nJ), 100,000 write cycles at full temperature range, OTP security register, auto ultra-deep power-down, and SOIC-8/TSSOP-8/UDFN-8 package compatibility.
Technical Context
The RM25C32DS-LSNI-B implements a 4-wire SPI interface (CS, SCK, SDI, SDO) with HOLD and WP pins, supporting direct-write architecture that eliminates pre-erase and enables true byte-level writes without page-level overhead. Its CBRAM® core delivers uniform endurance across byte and page operations, unlike floating-gate EEPROMs.
It features dual-status registers (non-volatile Byte 1 and volatile Byte 2), programmable protection (BP0/BP1 block lock, SRWD+WP hardware lock), and three low-power states: Standby, Power-Down, and Ultra-Deep Power-Down - with automatic entry into Ultra-Deep mode post-write when AUDPD bit is set.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 32 Kbit (4 KB) non-volatile array, sufficient for configuration tables and calibration data in space-constrained embedded systems. |
| Supply voltage | 1.65V–3.6V single supply - compatible with 1.8V and 3.3V logic domains without level shifters. |
| Read speed | Up to 10 MHz fast read (FREAD command) - reduces firmware boot latency vs. standard 1.6 MHz SPI read mode. |
| Write performance | 60 µs byte write / 1.5 ms 32-byte page write - 4–6× faster than comparable EEPROMs, enabling real-time logging. |
| Endurance & retention | 100,000 write cycles at -40°C to +85°C; >40 years data retention at 125°C - validated for automotive under-hood and industrial control applications. |
| Power consumption | 0.5 µA ultra-deep power-down current - extends battery life in always-on IoT edge sensors. |
| Security register | 64-byte OTP area: 32 bytes factory-programmed unique ID + 32 bytes user-programmable - supports device authentication and secure provisioning. |
Pinout & Package
RM25C32DS-LSNI-B is packaged in an 8-lead SOIC (Small Outline Integrated Circuit) with 150 mil body width, RoHS-compliant and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: CS | Chip Select | Active-low enable; high-Z SDO and standby current (77 µA typ) when deasserted - critical for multi-device SPI bus arbitration. |
| 2: SDO | Serial Data Output | Push-pull output; data shifted on SCK falling edge - requires external pull-up only in Ultra-Deep Power-Down mode. |
| 3: WP | Write Protect | Hardware lock for Status Register when SRWD=1 - prevents accidental configuration corruption during field updates. |
| 4: GND | Ground Reference | Primary return path for VCC and I/O; must be low-impedance to maintain <1.6 ns tOV timing margin. |
| 5: SDI | Serial Data Input | Accepts commands, addresses, and data on SCK rising edge - input leakage ≤1 µA ensures reliable operation with weak microcontroller drivers. |
| 6: SCK | Serial Clock | Master-generated timing signal; supports 0–10 MHz (fast read) with 7.5 ns min pulse width - defines maximum system throughput. |
| 7: HOLD | Communication Pause | Halts ongoing SPI transfer without resetting internal state - enables priority interrupt handling in real-time firmware. |
| 8: VCC | Power Supply | 1.65–3.6V input; requires 100 nF decoupling capacitor per datasheet - ensures stable CBRAM® cell programming voltage. |
Key Features
| Feature | Design Value |
|---|---|
| CBRAM® direct-write architecture | Enables true byte-level writes without erase overhead - eliminates page-read-modify-write delays and extends effective endurance in partial-update scenarios. |
| Auto Ultra-Deep Power-Down | Enters 0.04 µA sleep state automatically after write completion - removes need for explicit power-state management in firmware. |
| 64-byte OTP Security Register | Factory-assigned unique ID + user-writable zone - provides root-of-trust foundation for secure boot and firmware signing verification. |
| Flexible protection scheme | Combines hardware (WP pin + SRWD) and software (BP0/BP1 block lock) mechanisms - allows granular, field-upgradable memory partitioning. |
| Low-energy byte write | 50 nJ per byte - reduces average current in battery-powered telemetry devices by >90% vs. legacy EEPROMs. |
Applications
| Industrial Sensor Calibration | Medical Device Configuration |
|---|---|
Use Scenario: Storing temperature-compensated offset/gain coefficients in smart pressure transmitters deployed in oil & gas pipelines. IC Role / Device Role / Timing Role: Non-volatile parameter storage IC interfaced via SPI to ARM Cortex-M4 MCU; accessed during power-up and periodic self-calibration. Use Value: 100,000-cycle endurance ensures 10+ years of daily recalibration without wear-out; 0.5 µA deep-sleep current minimizes quiescent drain on Li-SOCl₂ primary cells. | Use Scenario: Holding patient-specific therapy parameters and audit logs in portable insulin pumps with strict battery life requirements. IC Role / Device Role / Timing Role: Secure configuration store with OTP-locked device ID; accessed during startup and dose adjustment events via SPI at 10 MHz fast read. Use Value: Factory-programmed unique ID enables cryptographic binding to cloud services; 50 nJ byte write extends 3-year battery life by reducing write-induced voltage sag. |
| Automotive Body Control Module | Smart Energy Meter Firmware Patch Storage |
Use Scenario: Retaining seat/mirror position presets and lighting profiles across ignition cycles in Class 4 BCMs operating at 125°C junction temperature. IC Role / Device Role / Timing Role: High-reliability EEPROM replacement for infotainment-linked comfort functions; written during user setup, read at power-on reset. Use Value: >40-year data retention at 125°C guarantees parameter integrity over vehicle lifetime; SOIC-8 package fits legacy PCB footprints. | Use Scenario: Storing signed firmware delta patches in utility-grade meters requiring field-upgradable code without full flash reprogramming. IC Role / Device Role / Timing Role: Secure patch buffer with 64-byte OTP for public key verification; accessed via SPI during scheduled OTA update windows. Use Value: Direct-write capability enables atomic patch application without erasing main program flash; page-erase support allows safe rollback to prior versions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial EEPROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF041A-SSH-T | 4 Mbit NOR flash with SPI interface; requires sector erase before write; 100,000 cycles; no OTP register. | Higher density but slower random write (ms vs. µs); lacks hardware write protect and unique ID - unsuitable for secure parameter storage. | Select only if >4 KB capacity needed and firmware can manage erase-before-write overhead. |
| MB85RS32B-DSK-E1 | 32 Kbit FRAM with 10^12 endurance, 1.8–3.6V supply, same SOIC-8 pinout; no OTP; 10 MHz read, 100 ns write. | Superior write speed and cycle count, but no integrated security register or auto power-down - requires external crypto IC for secure use cases. | Prefer for high-frequency logging; avoid when device identity binding or ultra-low-power sleep is mandatory. |
Compared with AT25DF041A-SSH-T and MB85RS32B-DSK-E1, RM25C32DS-LSNI-B uniquely balances 100K-cycle endurance, 64-byte OTP security, and sub-µA auto power-down - making it optimal for cost-sensitive, security-aware, battery-operated edge nodes where write efficiency and data integrity are co-critical.
Availability
RM25C32DS-LSNI-B is available at Aetrix Electronics and suitable for industrial sensor calibration, medical device configuration, automotive body control modules, and smart energy meter firmware patch storage requiring stable component supply across extended product lifecycles.
Supply support for RM25C32DS-LSNI-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Adesto Technologies (acquired by Dialog Semiconductor in 2020, now part of Renesas Electronics) specialized in ultra-low-power, high-endurance non-volatile memory solutions for IoT and industrial edge applications.
The RM25C32DS-LSNI-B belongs to Adesto's CBRAM®-based serial EEPROM product line, designed specifically for energy-constrained, security-sensitive embedded systems needing reliable byte-write capability without flash-like erase constraints.
FAQ
What is the guaranteed data retention period for RM25C32DS-LSNI-B at elevated temperature?
RM25C32DS-LSNI-B guarantees >40 years of data retention at 125°C junction temperature, validated per JEDEC standards. This exceeds typical EEPROM specifications and ensures long-term reliability in automotive under-hood and industrial control environments where thermal stress is severe. The CBRAM® technology underlying RM25C32DS-LSNI-B exhibits superior charge retention stability versus floating-gate alternatives.
Does RM25C32DS-LSNI-B support true byte-level writes without page erase?
Yes, RM25C32DS-LSNI-B supports true byte-level writes without pre-erase due to its CBRAM® resistive memory architecture. Unlike conventional EEPROMs that require read-modify-write on full pages, RM25C32DS-LSNI-B allows individual byte programming in 60 µs with no erase step - delivering consistent 100,000-cycle endurance whether writing one byte or a full 32-byte page.
How does the OTP Security Register in RM25C32DS-LSNI-B function?
The RM25C32DS-LSNI-B includes a 64-byte One-Time Programmable Security Register: 32 bytes are factory-programmed with a unique device identifier, and 32 bytes are user-programmable once. Access uses ROTPSR (77H) and POTPSR (9BH) commands. This structure enables secure device authentication and firmware binding - a capability absent in standard serial EEPROMs and critical for anti-counterfeiting in medical and industrial deployments.
Can RM25C32DS-LSNI-B enter ultra-deep power-down automatically?
Yes, RM25C32DS-LSNI-B can enter Ultra-Deep Power-Down automatically after completing a write operation when the AUDPD bit (Status Register Byte 2, bit 0) is set to '1'. In this mode, supply current drops to 0.04 µA at 25°C, eliminating firmware polling overhead. Exit requires a specific hardware sequence (VCC ramp + CS/SCK timing), not a simple command - ensuring robust protection against spurious wakeups.
What SPI modes and clock frequencies does RM25C32DS-LSNI-B support?
RM25C32DS-LSNI-B supports SPI modes 0 (CPOL=0, CPHA=0) and 3 (CPOL=1, CPHA=1) with maximum clock frequencies of 1.6 MHz in normal read mode and 10 MHz in fast read mode. The device also supports Auto Power-Down mode at up to 1.0 MHz. All timing parameters - including tSCKH/tSCKL (7.5 ns min), tOV (6.5 ns), and tDS/tDH (4 ns) - are fully characterized across -40°C to +85°C.
RM25C32DS-LSNI-B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Mavriq™
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- CBRAM®
- Technology:
- CBRAM
- Memory Size:
- 32Kbit
- Memory Organization:
- 32 Bytes Page Size
- Memory Interface:
- SPI
- Clock Frequency:
- 20 MHz
- Write Cycle Time - Word, Page:
- 100µs, 2.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
RM25C32DS-LSNI-B FAQ
1.How can I place an order for RM25C32DS-LSNI-B through Aetrix?
Please submit a Request for Quotation (RFQ) for RM25C32DS-LSNI-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RM25C32DS-LSNI-B reliable?
The price and inventory of RM25C32DS-LSNI-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RM25C32DS-LSNI-B is usually 5 days.
3.What payment methods are accepted for RM25C32DS-LSNI-B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RM25C32DS-LSNI-B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RM25C32DS-LSNI-B?
RM25C32DS-LSNI-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RM25C32DS-LSNI-B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RM25C32DS-LSNI-B?
For technical support, including RM25C32DS-LSNI-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RM25C32DS-LSNI-B requirements.
6.How does Aetrix verify that RM25C32DS-LSNI-B is sourced from the original manufacturer or authorized distributors?
All RM25C32DS-LSNI-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RM25C32DS-LSNI-B meets industry standards.
7.What is the process for return or replacement of RM25C32DS-LSNI-B?
All RM25C32DS-LSNI-B units undergo pre-shipment inspection (PSI). If there is an issue with RM25C32DS-LSNI-B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RM25C32DS-LSNI-B part is unused and in its original packaging.
Return procedure for RM25C32DS-LSNI-B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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