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Renesas RM25C64C-BTAC-B

Part No.:
RM25C64C-BTAC-B
Manufacturer:
Renesas
Category:
Memory
Package:
8-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixRM25C64C-BTAC-B.pdf
Description:
IC CBRAM 64KBIT SPI 5MHZ 8TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,499

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Product details

Overview

RM25C64C-BTAC-B from Adesto Technologies is a 64 Kbit non-volatile serial EEPROM memory IC based on CBRAM® resistive switching technology, operating from 1.65V to 3.6V supply, supporting SPI modes 0 and 3, with 10 MHz fast read capability and 32-byte page write in 1 ms - deployed in ultra-low-power IoT sensor nodes and battery-backed industrial controllers.

For engineers reviewing the RM25C64C-BTAC-B datasheet, RM25C64C-BTAC-B pinout, RM25C64C-BTAC-B application, or RM25C64C-BTAC-B equivalent, key selection criteria include its 2.2 µA power-down current, 100,000 write endurance, 10-year data retention, hardware/software write protection via WP pin and Status Register bits (SRWD, BP0/BP1), and dual low-power modes (Power Down and Ultra-Deep Power Down).

Technical Context

This device implements a 4-wire SPI interface (CS, SDO, SDI, SCK) with HOLD and WP control lines, enabling seamless integration into microcontroller-based systems requiring deterministic non-volatile storage. Its CBRAM® core eliminates charge-pump circuitry, enabling true single-supply operation and eliminating high-voltage programming requirements.

Internal architecture includes a 32-byte page buffer, status register with WIP/WEL flags, and configurable protection modes (block, status register, hardware via WP). Timing-critical operations - including fast read (10 MHz), byte write (25 µs), and page erase - are fully self-timed with no external wait-state management needed.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density64 Kbit (8 KB), organized as 2,048 × 32-byte pages - supports fine-grained updates without full-chip erase.
Supply voltage range1.65V–3.6V - enables direct interfacing with 1.8V and 3.3V logic without level shifters.
Fast read clock rateUp to 10 MHz - reduces firmware latency for configuration/data logging reads in real-time systems.
Page write time1 ms per 32-byte page - 4–6× faster than conventional EEPROM, minimizing bus occupancy during writes.
Power-down current2.2 µA at 25°C - extends battery life in always-on edge sensors and wearables.
Data retention10 years at +85°C - validated for automotive under-hood and industrial control environments.
Write endurance100,000 cycles per address - meets JEDEC JESD22-A117B for CBRAM-based memories.
Energy per byte write50 nJ - consumes only 10% of energy vs. comparable EEPROM, critical for energy-harvesting designs.

Pinout & Package

RM25C64C-BTAC-B is housed in an 8-lead SOIC package (3.9 mm × 4.9 mm, 1.27 mm pitch), RoHS-compliant and halogen-free.

Pin/Terminal Circuit Role Design Meaning
CS (Pin 1)Chip SelectActive-low enable; drives device into standby when high, reducing current to ≤2.2 µA.
SDO (Pin 2)Serial Data OutputTri-state output; delivers read data on SCK falling edge - compatible with standard SPI master timing.
WP (Pin 3)Write ProtectHardware lock for Status Register when SRWD=1; prevents accidental configuration changes.
GND (Pin 4)GroundReference return path for VCC and all I/O; must be low-impedance for stable CBRAM® switching.
SDI (Pin 5)Serial Data InputAccepts opcodes, addresses, and data on SCK rising edge - supports MSB-first 8-bit transfers.
SCK (Pin 6)Serial ClockMaster-generated clock; supports 0–10 MHz (fast read) with 7.5 ns min pulse width.
HOLD (Pin 7)HoldPauses ongoing SPI transaction without resetting state - enables priority interrupt handling in MCU firmware.
VCC (Pin 8)Power SupplySingle 1.65–3.6V rail; internal regulation ensures consistent CBRAM® programming voltage across range.

Key Features

Feature Design Value
CBRAM® resistive memory technologyEliminates charge pumps and high-voltage generators - enables true single-supply 1.65V operation and reduces layout complexity.
Ultra-low-energy byte write50 nJ per byte - cuts energy use by 90% vs. EEPROM, extending runtime in coin-cell-powered devices.
Dual low-power modesPower Down (2.2 µA) and Ultra-Deep Power Down (1.6 µA) - selectable via Status Register (APDE/LPSE bits) or command.
Flexible write protectionHardware (WP pin + SRWD bit) and software (BP0/BP1 block bits) - enables secure firmware parameter storage.
Self-timed erase/writeNo external timing control required - simplifies driver development and guarantees completion before next CS assertion.
Unlimited read cyclesNo wear-out mechanism for read operations - supports continuous telemetry polling without degradation.

Applications

Smart Meter Firmware Storage Medical Sensor Calibration Data

Use Scenario: Storing firmware update images and configuration tables in utility-grade smart meters with 10+ year field life.

IC Role / Device Role / Timing Role: Non-volatile boot code and calibration parameter storage with guaranteed 10-year retention at +85°C ambient.

Use Value: Eliminates need for external voltage supervisors or backup capacitors due to 1.65V operation and robust power-down recovery.

Use Scenario: Retaining factory-calibrated sensor offsets and linearization coefficients in portable ECG/SpO₂ monitors.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage of medical-grade calibration data with hardware write lock (WP + SRWD).

Use Value: Enables FDA-compliant audit trails via Status Register monitoring (WEL/WIP) and page-level erase for field recalibration.

Industrial PLC Configuration Memory Wireless Edge Node State Backup

Use Scenario: Holding user-defined I/O mapping and alarm thresholds in DIN-rail programmable logic controllers.

IC Role / Device Role / Timing Role: High-reliability configuration store with 100,000-cycle endurance and -40°C to +85°C operation.

Use Value: Supports frequent reconfiguration in factory automation without premature wear-out - verified per JEDEC A117B.

Use Scenario: Preserving last-known sensor state and network credentials during intermittent battery charging in LoRaWAN endpoints.

IC Role / Device Role / Timing Role: Ultra-low-leakage (1.6 µA ULPD mode) non-volatile scratchpad for graceful power-loss recovery.

Use Value: Reduces average system current by >50% vs. standard EEPROM, extending time-between-charges in solar-harvested nodes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial EEPROM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AT25DF041A-SSHN-B4 Mbit NOR flash; requires 3.3V only; no 1.65V support; sector erase only (no page erase); 100,000 cycles.Higher density but lacks byte-write granularity and ultra-low-voltage operation - unsuitable for 1.8V battery systems.Select only if >64 Kbit capacity and NOR-compatible command set are required; verify voltage compatibility and erase granularity.
M95M02-DRMN6TP2 Mbit SPI EEPROM; 1.8–5.5V supply; 5 ms page write; 1 mA write current; 40 µA standby.Higher voltage range and density, but 200× higher write energy (10 µJ vs. 50 nJ) and slower page write - increases power budget and latency.Prefer for legacy 5V systems or where AEC-Q100 qualification is mandatory; avoid in energy-constrained 1.8V designs.

Compared with AT25DF041A-SSHN-B and M95M02-DRMN6TP, RM25C64C-BTAC-B uniquely delivers sub-2 µA power-down current, 1.65V operation, and 50 nJ byte-write energy - making it the only option for long-life, single-cell battery or energy-harvesting applications requiring true low-voltage EEPROM functionality.

Availability

RM25C64C-BTAC-B is available at Aetrix Electronics and suitable for smart meter firmware storage, medical sensor calibration data, industrial PLC configuration memory, wireless edge node state backup, and battery-backed real-time clock backup requiring stable component supply across extended temperature and lifecycle requirements.

Supply support for RM25C64C-BTAC-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Adesto Technologies (acquired by Dialog Semiconductor in 2020, now part of Renesas Electronics) specialized in ultra-low-power non-volatile memory solutions using proprietary CBRAM® technology.

The RM25C-Series was designed specifically for energy-constrained, battery-operated IoT endpoints and industrial sensors requiring reliable, low-voltage, high-endurance serial memory with minimal system-level power overhead.

FAQ

What is the minimum supply voltage required for reliable operation of the RM25C64C-BTAC-B?

The RM25C64C-BTAC-B operates reliably down to 1.65V across its full temperature range (-40°C to +85°C). Below this threshold, the VVccI parameter (1.55V) triggers automatic inhibition of all write/erase commands - ensuring data integrity even during brown-out conditions. This makes RM25C64C-BTAC-B suitable for direct connection to 1.8V LDO outputs or partially discharged lithium coin cells.

How does the RM25C64C-BTAC-B implement write protection, and can it be configured per memory block?

The RM25C64C-BTAC-B supports both hardware and software write protection. Hardware protection uses the WP pin in conjunction with the SRWD bit in the Status Register to lock the Status Register itself. Software protection uses BP0/BP1 bits to define protected memory regions - including top ¼ (4 KB), top ½ (8 KB), or full array (64 Kbit). These settings are non-volatile and persist through power cycles.

What is the actual page size and maximum write speed for the RM25C64C-BTAC-B?

The RM25C64C-BTAC-B has a fixed 32-byte page size, and a typical page write time of 1 ms (max 5 ms). This is 4–6× faster than conventional EEPROMs of similar density. The device also supports single-byte writes completing in 25 µs (max 100 µs), enabled by its CBRAM® technology's direct-write mechanism without charge-pump delays.

Does the RM25C64C-BTAC-B support both SPI Mode 0 and Mode 3, and how does that affect MCU compatibility?

Yes, RM25C64C-BTAC-B explicitly supports SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1). This dual-mode support ensures interoperability with virtually all microcontrollers - including ARM Cortex-M, RISC-V, and legacy 8-bit MCUs - without requiring custom SPI peripheral configuration or bit-banging workarounds.

What are the power consumption differences between Standby, Power Down, and Ultra-Deep Power Down modes on the RM25C64C-BTAC-B?

In Standby mode (CS high), RM25C64C-BTAC-B draws 80–120 µA depending on temperature. In Power Down mode (PD command), current drops to 2.2–17 µA. In Ultra-Deep Power Down (UDPD command), it further reduces to 1.6–17 µA - the lowest among serial EEPROM alternatives. All modes retain memory contents and resume instantly upon wake-up command.

RM25C64C-BTAC-B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
Mavriq™
Package/Case:
8-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
CBRAM®
Technology:
CBRAM
Memory Size:
64Kbit
Memory Organization:
32 Bytes Page Size
Memory Interface:
SPI
Clock Frequency:
5 MHz
Write Cycle Time - Word, Page:
100µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSSOP

RM25C64C-BTAC-B FAQ

1.How can I place an order for RM25C64C-BTAC-B through Aetrix?

Please submit a Request for Quotation (RFQ) for RM25C64C-BTAC-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for RM25C64C-BTAC-B reliable?

The price and inventory of RM25C64C-BTAC-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RM25C64C-BTAC-B is usually 5 days.

3.What payment methods are accepted for RM25C64C-BTAC-B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RM25C64C-BTAC-B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for RM25C64C-BTAC-B?

RM25C64C-BTAC-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your RM25C64C-BTAC-B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for RM25C64C-BTAC-B?

For technical support, including RM25C64C-BTAC-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RM25C64C-BTAC-B requirements.

6.How does Aetrix verify that RM25C64C-BTAC-B is sourced from the original manufacturer or authorized distributors?

All RM25C64C-BTAC-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RM25C64C-BTAC-B meets industry standards.

7.What is the process for return or replacement of RM25C64C-BTAC-B?

All RM25C64C-BTAC-B units undergo pre-shipment inspection (PSI). If there is an issue with RM25C64C-BTAC-B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The RM25C64C-BTAC-B part is unused and in its original packaging.

Return procedure for RM25C64C-BTAC-B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

RM25C64C-BTAC-B Tags

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