Renesas RM25C64C-LTAI-B
- Part No.:
- RM25C64C-LTAI-B
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
RM25C64C-LTAI-B.pdf
- Description:
- IC CBRAM 64KBIT SPI 10MHZ 8TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,447
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
RM25C64C-LTAI-B from Adesto Technologies is a 64 Kbit non-volatile serial EEPROM memory IC based on CBRAM® resistive switching technology, operating from 1.65V to 3.6V supply, supporting SPI modes 0 and 3, with 10 MHz fast read capability and 32-byte page write in 1 ms - deployed in low-power IoT sensor nodes for firmware parameter storage.
For engineers reviewing the RM25C64C-LTAI-B datasheet, RM25C64C-LTAI-B pinout, RM25C64C-LTAI-B application, or RM25C64C-LTAI-B equivalent, key selection considerations include its ultra-low 2.2 µA power-down current, 100,000 write-cycle endurance, 10-year data retention, CBRAM-based energy efficiency (50 nJ/byte write), and SOIC-8/TSSOP-8 package compatibility.
Technical Context
The RM25C64C-LTAI-B implements a 4-wire SPI interface (CS, SDO, SDI, SCK) with dual read modes: normal (≤1.6 MHz) and fast (≤10 MHz). It uses self-timed internal erase/write cycles and supports byte-wise and 32-byte page programming with automatic address incrementing within pages.
Its CBRAM® memory array enables direct-write operation without charge pumps, delivering faster page writes (4–6× vs. conventional EEPROM) and lower energy per byte. Protection is implemented via hardware (WP pin + SRWD bit) and software (WEL latch, BP0/BP1 block protection, APDE/LPSE power modes).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 64 Kbit (8 KB), organized as 2048 × 32-byte pages - supports compact firmware configuration storage without external address latches. |
| Supply voltage range | 1.65 V to 3.6 V - compatible with single-supply 1.8 V and 3.3 V microcontroller I/O domains without level shifting. |
| Fast read clock rate | Up to 10 MHz - enables full memory readout in <13 ms, suitable for rapid boot-time parameter loading. |
| Page write time | 1 ms typical for 32 bytes - reduces firmware update latency versus legacy EEPROMs requiring ~5–10 ms per page. |
| Write endurance | 100,000 cycles - sufficient for daily calibration logging over 27 years in industrial monitoring applications. |
| Data retention | 10 years at +85°C - validated for automotive under-hood and industrial control environments with extended thermal stress. |
| Power-down current | 2.2 µA typical at 25°C - extends battery life in coin-cell-powered edge devices beyond 10 years. |
Pinout & Package
RM25C64C-LTAI-B is housed in an 8-lead SOIC package (5.3 mm × 4.4 mm, 1.27 mm pitch), RoHS-compliant and halogen-free, with standard JEDEC MS-012AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: CS | Chip Select | Active-low enable; high-Z SDO and standby entry when deasserted - enables multi-device SPI bus sharing. |
| 2: SDO | Serial Data Output | Tri-state output; data shifted out on SCK falling edge - supports daisy-chaining and shared MISO lines. |
| 3: WP | Write Protect | Hardware lock for Status Register when SRWD=1 - prevents accidental configuration corruption during power transients. |
| 4: GND | Ground Reference | Signal and power return path; decoupling capacitor must be placed ≤5 mm from VCC/GND pins. |
| 5: SDI | Serial Data Input | Command/address/data input latched on SCK rising edge - requires clean setup/hold timing per AC specs. |
| 6: SCK | Serial Clock | Master-generated timing signal; supports polarity modes 0 and 3 - must remain stable during CS assertion. |
| 7: HOLD | Communication Pause | Halts ongoing SPI transfer without resetting state - useful for MCU interrupt servicing without command loss. |
| 8: VCC | Power Supply | 1.65–3.6 V core supply; 75 µs power-up delay required before first command - mandates reset synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| CBRAM® resistive memory technology | Enables direct-write operation without charge pumps - eliminates high-voltage generation circuitry and associated EMI/noise. |
| Ultra-low-energy byte write | 50 nJ per byte - consumes only 10% of energy vs. comparable EEPROMs, critical for energy-harvesting systems. |
| Flexible power management | Three low-power states: Standby (80–120 µA), Power Down (2.2 µA), Ultra-Deep Power Down (1.6 µA) - selectable via status register bits. |
| Hardware + software write protection | Combines WP pin control (SRWD-gated) with WEL latch and BP0/BP1 block locking - prevents unintended firmware overwrite across voltage/frequency corners. |
| Self-timed erase/write cycles | No external timing control needed; WIP bit indicates completion - simplifies host firmware and removes timeout tuning. |
Applications
| Industrial Sensor Calibration Storage | Medical Wearable Device Configuration |
|---|---|
Use Scenario: Storing factory-calibrated sensor offsets and temperature compensation coefficients in wireless vibration sensors deployed in predictive maintenance systems. IC Role / Device Role / Timing Role: Non-volatile parameter store accessed at boot and during field recalibration; SPI fast-read mode loads coefficients in <100 µs for real-time correction. Use Value: 10-year retention ensures calibration integrity across equipment lifecycle; 2.2 µA power-down current extends 2xAA battery life to >5 years. |
Use Scenario: Holding patient-specific therapy settings and device pairing keys in Bluetooth-enabled insulin pumps and ECG patches. IC Role / Device Role / Timing Role: Secure configuration vault with hardware write protection (WP + SRWD); page-erase capability enables safe over-the-air updates. Use Value: CBRAM's 100,000-cycle endurance supports daily dose adjustments; RoHS/halogen-free packaging meets ISO 10993 biocompatibility requirements. |
| Smart Meter Firmware Parameter Table | Automotive Body Control Module NVM |
Use Scenario: Storing tariff schedules, demand-response thresholds, and metering calibration constants in ANSI C12.22-compliant smart electricity meters. IC Role / Device Role / Timing Role: SPI slave memory interfaced to ARM Cortex-M4 host; fast read mode enables sub-millisecond parameter fetch during billing cycle transitions. Use Value: 10 MHz read speed avoids CPU polling delays; -40°C to +85°C operating range ensures reliability in outdoor meter enclosures. |
Use Scenario: Retaining seat position presets, mirror angles, and lighting profiles in automotive door modules subjected to thermal cycling and ESD events. IC Role / Device Role / Timing Role: Robust NVM with >2 kV HBM ESD rating and auto-power-down mode activated during vehicle sleep states. Use Value: 2.2 µA power-down current minimizes parasitic drain on 12 V battery; page-erase capability allows selective profile updates without full chip reprogramming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial EEPROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF041A-SSH-T | 4 Mbit NOR flash; requires sector erase (4 KB min), no byte-write; 3.0 V only; lacks HOLD pin. | Higher density but slower random access; unsuitable for frequent small-parameter updates due to erase granularity. | Choose only if >64 Kbit capacity and execute-in-place code storage are required; not drop-in for RM25C64C-LTAI-B's byte-write use cases. |
| M95M04-DRMN6TP/K | 4 Mbit SPI EEPROM; 1.7–5.5 V supply; 5 MHz max clock; 1 mA write current; SOIC-8 package. | Higher voltage range and density, but 5× higher write energy (250 nJ/byte) and 4× slower page write (4 ms). | Select when broader supply tolerance or larger capacity is mandatory; accept trade-offs in power efficiency and write latency. |
Compared with AT25DF041A-SSH-T and M95M04-DRMN6TP/K, RM25C64C-LTAI-B delivers superior energy efficiency per write operation, faster page programming, and native support for true byte-level updates - making it optimal for battery-constrained, high-write-frequency embedded systems where endurance and low quiescent current are design-critical.
Availability
RM25C64C-LTAI-B is available at Aetrix Electronics and suitable for industrial sensor nodes, medical wearables, smart metering systems, and automotive body control modules requiring stable component supply across long production lifecycles.
Supply support for RM25C64C-LTAI-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Adesto Technologies (acquired by Dialog Semiconductor in 2020, now part of Renesas Electronics) specialized in ultra-low-power non-volatile memory solutions for resource-constrained IoT endpoints.
The RM25C-Series was designed specifically for energy-sensitive embedded applications requiring high endurance, fast write performance, and minimal active/standby current - leveraging CBRAM® to replace legacy EEPROM in next-generation sensor and wearable platforms.
FAQ
What is the maximum SPI clock frequency supported by RM25C64C-LTAI-B in fast read mode?
The RM25C64C-LTAI-B supports up to 10 MHz SCK frequency in fast read mode, enabling high-speed parameter retrieval. This is double the 1.6 MHz limit of normal read mode and requires CL = 10 pF loading. The device maintains valid timing margins (tOV = 6.5 ns, tSCKH/tSCKL = 7.5 ns) across the full -40°C to +85°C temperature range, ensuring reliable operation in thermally demanding environments. RM25C64C-LTAI-B must be configured for fast read using the 0BH opcode with a dummy byte.
How does the CBRAM® technology in RM25C64C-LTAI-B improve write energy efficiency compared to standard EEPROM?
RM25C64C-LTAI-B achieves 50 nJ per byte write energy - just 10% of typical EEPROM consumption - because its CBRAM® cell operates via low-current resistive switching without charge pumps or Fowler-Nordheim tunneling. This eliminates high-voltage generation overhead and reduces both dynamic power and thermal dissipation. In practice, RM25C64C-LTAI-B enables 10,000+ daily writes on a CR2032 coin cell for over 3 years, whereas equivalent EEPROMs would deplete the same battery in <1 year. The technology is intrinsic to RM25C64C-LTAI-B's architecture and requires no host-side firmware changes.
Can RM25C64C-LTAI-B be used in systems with a 1.8 V supply rail?
Yes, RM25C64C-LTAI-B is fully specified for operation from 1.65 V to 3.6 V, making it compatible with standard 1.8 V logic interfaces without level shifters. At 1.8 V, DC characteristics include ICC2 = 0.25 mA (typical read current), ICC5 = 2.2 µA (power-down current), and VIH = 1.26 V (70% of VCC). All AC timing parameters (including 10 MHz fast read) remain valid down to 1.65 V, and the device guarantees full functionality across the entire industrial temperature range (-40°C to +85°C) at 1.8 V. RM25C64C-LTAI-B's low VCCmin eliminates need for auxiliary voltage regulation in 1.8 V SoC designs.
What protection mechanisms prevent accidental writes to RM25C64C-LTAI-B during power-up or brown-out conditions?
RM25C64C-LTAI-B incorporates three layered protections: (1) VCC inhibit threshold (VVccI = 1.55 V) blocks all commands below this voltage; (2) Write Enable Latch (WEL) resets automatically after each non-read instruction and must be set via WREN before every write/erase; (3) Hardware write protect via WP pin, which locks the Status Register when SRWD = 1. These features ensure RM25C64C-LTAI-B remains immune to spurious writes during power ramp-up, dropout, or noise events - critical for fail-safe operation in medical and industrial systems.
Does RM25C64C-LTAI-B support page erase, and how is it initiated?
Yes, RM25C64C-LTAI-B supports 32-byte page erase using the PERS (0x42) instruction. After issuing WREN to set the Write Enable Latch, the host sends the 0x42 opcode followed by any 2-byte address within the target page (bits A5–A0 are ignored). Bringing CS high initiates the self-timed erase; completion is signaled by WIP = 0 in the Status Register. Page erase sets all bits in the 32-byte block to '1', enabling selective reprogramming without chip-wide erasure. This capability is integral to RM25C64C-LTAI-B's firmware update architecture and is validated for 100,000 cycles.
RM25C64C-LTAI-B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Mavriq™
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- CBRAM®
- Technology:
- CBRAM
- Memory Size:
- 64Kbit
- Memory Organization:
- 32 Bytes Page Size
- Memory Interface:
- SPI
- Clock Frequency:
- 10 MHz
- Write Cycle Time - Word, Page:
- 100µs, 5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
RM25C64C-LTAI-B FAQ
1.How can I place an order for RM25C64C-LTAI-B through Aetrix?
Please submit a Request for Quotation (RFQ) for RM25C64C-LTAI-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RM25C64C-LTAI-B reliable?
The price and inventory of RM25C64C-LTAI-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RM25C64C-LTAI-B is usually 5 days.
3.What payment methods are accepted for RM25C64C-LTAI-B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RM25C64C-LTAI-B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RM25C64C-LTAI-B?
RM25C64C-LTAI-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RM25C64C-LTAI-B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RM25C64C-LTAI-B?
For technical support, including RM25C64C-LTAI-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RM25C64C-LTAI-B requirements.
6.How does Aetrix verify that RM25C64C-LTAI-B is sourced from the original manufacturer or authorized distributors?
All RM25C64C-LTAI-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RM25C64C-LTAI-B meets industry standards.
7.What is the process for return or replacement of RM25C64C-LTAI-B?
All RM25C64C-LTAI-B units undergo pre-shipment inspection (PSI). If there is an issue with RM25C64C-LTAI-B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RM25C64C-LTAI-B part is unused and in its original packaging.
Return procedure for RM25C64C-LTAI-B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
RM25C64C-LTAI-B Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
