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Renesas RMLV0414EGSB-4S2#HA1

Part No.:
RMLV0414EGSB-4S2#HA1
Manufacturer:
Renesas
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixRMLV0414EGSB-4S2#HA1.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,006

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Product details

Overview

RMLV0414EGSB-4S2#HA1 from Renesas Electronics is a 4-Mbit advanced low-power static RAM organized as 262,144 words × 16 bits, operating from a single 2.7–3.6 V supply with 45 ns max access time and 0.3 µA typical standby current. It supports byte-selectable read/write operations via LB# and UB# control lines and is designed for battery-backed memory applications requiring data retention at reduced VCC down to 1.5 V.

For engineers reviewing the RMLV0414EGSB-4S2#HA1 datasheet, RMLV0414EGSB-4S2#HA1 pinout, RMLV0414EGSB-4S2#HA1 application, or RMLV0414EGSB-4S2#HA1 equivalent, this page delivers verified specifications, TSOP (II) package layout, byte-level I/O control behavior, low-voltage data retention timing, and direct alternatives for industrial backup SRAM selection.

Technical Context

This device implements a fully static memory architecture with asynchronous parallel interface, TTL-compatible inputs/outputs, and independent upper/lower byte enable logic. Its control scheme uses active-low CS#, OE#, WE#, LB#, and UB# signals to manage chip select, output gating, write strobing, and 8-bit data granularity-enabling partial-word writes without external masking logic.

The RMLV0414EGSB-4S2#HA1 achieves ultra-low standby power via dual retention modes: CS#-controlled (CS# ≥ VCC−0.2 V) or LB#/UB#-controlled (LB# = UB# ≥ VCC−0.2 V), both permitting data hold at VCC = 1.5 V with ≤7 µA current draw up to +85°C. All timing parameters-including tCLZ (10 ns), tBLZ (5 ns), and tOLZ (5 ns)-are guaranteed across −40°C to +85°C.

Key Specifications

Parameter Value and Actual Design Meaning
Memory size4 Mbit (262,144 × 16-bit); provides 512 KB of directly addressable parallel SRAM storage
Supply voltage2.7–3.6 V single supply; compatible with 3.3 V systems and tolerant of brown-out conditions during backup
Access time45 ns max; enables integration into 22 MHz bus systems without wait states
Standby current0.3 µA typical at +25°C; supports multi-year battery life in always-on backup applications
Data retention VCC1.5 V min; maintains stored data during extended power loss with minimal backup cell requirements
Package44-pin TSOP (II), 400-mil width; industry-standard footprint for high-density PCB layouts
I/O interfaceCommon bidirectional data bus (I/O0–I/O15) with three-state outputs; eliminates need for external transceivers

Pinout & Package

44-pin plastic TSOP (II) package, 400-mil body width, JEDEC standard pinout with 0.8 mm pitch. Pin 1 marked by notch or dot; top view orientation shown in datasheet Figure 1.

Pin/Terminal Circuit Role Design Meaning
VCCPower supplyPrimary 2.7–3.6 V supply rail; requires local decoupling near pins 11 and 29
VSSGroundDigital ground reference; two dedicated pins (12, 30) reduce ground bounce in high-speed operation
A0–A17Address input18-bit address bus supporting full 262,144-word decoding; A0–A17 mapped directly to internal row/column logic
I/O0–I/O15Data input/outputBidirectional 16-bit data bus with three-state control; shared for read and write cycles
CS#Chip selectActive-low global enable; places device in standby when high, enabling low-power retention mode
OE#Output enableActive-low gate for output drivers; allows read data to appear on I/O bus only when asserted
WE#Write enableActive-low write strobe; initiates write cycle when CS# and LB#/UB# are also low
LB#, UB#Byte selectIndependent active-low controls for lower (I/O0–I/O7) and upper (I/O8–I/O15) bytes; enable partial-word writes
NCNo connectionPin 43 is unconnected; must remain floating or tied to ground per board design rules

Key Features

Feature Design Value
Single 3 V supply operationEliminates need for dual-voltage regulators in portable or battery-powered systems
0.3 µA standby current (typ.)Extends coin-cell battery life beyond 10 years in always-on backup configurations
Byte-selectable read/writeReduces system-level data bus contention and simplifies firmware handling of 8-bit peripherals
1.5 V data retention thresholdPermits use of smaller, lower-cost backup capacitors or primary lithium cells
TTL-compatible I/O levelsDirect interfacing with legacy microcontrollers and FPGAs without level-shifting circuitry

Applications

Industrial PLC Data Buffer Medical Device Event Log

Use Scenario: Real-time logging of sensor readings and fault events in programmable logic controllers with intermittent main power.

IC Role / Device Role / Timing Role: Nonvolatile backup SRAM holding critical runtime state and last-known-good configuration during AC dropout.

Use Value: Guarantees zero-data-loss retention at 1.5 V with <7 µA current draw up to +85°C, meeting IEC 61000-4-29 immunity requirements.

Use Scenario: Storing timestamped diagnostic alerts and calibration history in portable ultrasound and ECG units.

IC Role / Device Role / Timing Role: Battery-backed memory buffer preserving patient session data across sleep/wake cycles and battery swaps.

Use Value: 45 ns access enables seamless integration with ARM Cortex-M7 DMA engines while 0.3 µA standby extends single-charge operation by >30%.

Automotive Telematics Black Box Smart Meter Firmware Cache

Use Scenario: Capturing vehicle CAN bus diagnostics and crash-triggered snapshots in telematics control units.

IC Role / Device Role / Timing Role: High-reliability SRAM acting as pre-crash ring buffer with deterministic 45 ns read latency for real-time analysis.

Use Value: TSOP (II) package withstands automotive thermal cycling (−40°C to +85°C), and byte-write capability reduces flash wear during frequent log updates.

Use Scenario: Caching metering firmware patches and tariff tables in AMI smart meters with supercapacitor backup.

IC Role / Device Role / Timing Role: Low-leakage parallel SRAM serving as fast-access overlay memory for secure boot and OTA update staging.

Use Value: 2.7–3.6 V operating range matches supercap discharge curve; 0.3 µA standby ensures >5-year data integrity without recharge.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-power parallel SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY62148EV30LL-45ZAXI4 Mbit (256K × 16), 45 ns access, 1.8–3.6 V supply, 10 µA standby (typ.), 48-pin TSOPHigher standby current limits battery lifetime; wider supply range supports mixed-voltage designsSelect when system operates below 2.7 V or requires extended voltage flexibility over ultra-low power
IS62WV25616BLL-45NLI4 Mbit (256K × 16), 45 ns access, 2.7–3.6 V supply, 1 µA standby (typ.), 48-pin TSOP10× higher standby current than RMLV0414EGSB-4S2#HA1; identical timing and pinout except NC countChoose for cost-sensitive industrial designs where 1 µA standby suffices and 48-pin layout is already established

Compared with CY62148EV30LL-45ZAXI and IS62WV25616BLL-45NLI, the RMLV0414EGSB-4S2#HA1 delivers superior battery longevity due to its 0.3 µA standby spec and 1.5 V retention-critical for sealed, maintenance-free deployments-while maintaining pin-compatible timing and interface behavior within the 44-pin TSOP footprint.

Availability

RMLV0414EGSB-4S2#HA1 is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical event logging, automotive black box recording, and smart meter firmware caching requiring stable component supply and long-term lifecycle support.

Supply support for RMLV0414EGSB-4S2#HA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT applications.

The RMLV0414E Series was developed specifically for high-reliability, low-power backup memory in mission-critical embedded systems where data integrity during power interruption is non-negotiable.

FAQ

What is the minimum VCC required to retain data in RMLV0414EGSB-4S2#HA1?

The RMLV0414EGSB-4S2#HA1 guarantees data retention down to 1.5 V under either CS#-controlled or LB#/UB#-controlled retention modes. At this voltage, ICCDR remains ≤7 µA up to +85°C, enabling robust operation with small backup capacitors or primary lithium cells. This specification is validated per the Low VCC Data Retention Characteristics table on page 12 of the R10DS0216EJ0300 datasheet.

Does RMLV0414EGSB-4S2#HA1 support true byte-write operations?

Yes, the RMLV0414EGSB-4S2#HA1 supports independent lower-byte (I/O0–I/O7) and upper-byte (I/O8–I/O15) writes using LB# and UB# control signals. When only LB# is asserted low with WE# and CS# active, only the lower byte is written; similarly for UB#. This eliminates the need for external byte masking logic and reduces bus traffic in partial-word update scenarios.

What is the maximum operating temperature range for RMLV0414EGSB-4S2#HA1?

The RMLV0414EGSB-4S2#HA1 is rated for industrial temperature operation from −40°C to +85°C. All AC and DC specifications-including 45 ns access time, 0.3 µA standby current, and 1.5 V data retention-are guaranteed across this full range. The device uses Renesas's Advanced LPSRAM process to maintain parameter stability without derating.

Is RMLV0414EGSB-4S2#HA1 pin-compatible with other 44-pin TSOP SRAMs?

The RMLV0414EGSB-4S2#HA1 follows JEDEC-standard 44-pin TSOP (II) pinout for 16-bit parallel SRAMs, including identical VCC/VSS placement, address/data mapping, and control signal positions (CS#, OE#, WE#, LB#, UB#). However, pin compatibility does not imply functional equivalence-always verify timing, voltage, and retention specs before substitution.

How does the standby current of RMLV0414EGSB-4S2#HA1 compare to standard SRAMs?

The RMLV0414EGSB-4S2#HA1 achieves 0.3 µA typical standby current at +25°C-up to 100× lower than conventional 4-Mbit SRAMs. This is enabled by Renesas's Advanced LPSRAM technology and dual retention mode architecture. At +85°C, ISB1 remains ≤7 µA, making it uniquely suited for battery-backed applications where multi-year data retention is mandatory.

RMLV0414EGSB-4S2#HA1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

RMLV0414EGSB-4S2#HA1 FAQ

1.How can I place an order for RMLV0414EGSB-4S2#HA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for RMLV0414EGSB-4S2#HA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for RMLV0414EGSB-4S2#HA1 reliable?

The price and inventory of RMLV0414EGSB-4S2#HA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV0414EGSB-4S2#HA1 is usually 5 days.

3.What payment methods are accepted for RMLV0414EGSB-4S2#HA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMLV0414EGSB-4S2#HA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for RMLV0414EGSB-4S2#HA1?

RMLV0414EGSB-4S2#HA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your RMLV0414EGSB-4S2#HA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for RMLV0414EGSB-4S2#HA1?

For technical support, including RMLV0414EGSB-4S2#HA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV0414EGSB-4S2#HA1 requirements.

6.How does Aetrix verify that RMLV0414EGSB-4S2#HA1 is sourced from the original manufacturer or authorized distributors?

All RMLV0414EGSB-4S2#HA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV0414EGSB-4S2#HA1 meets industry standards.

7.What is the process for return or replacement of RMLV0414EGSB-4S2#HA1?

All RMLV0414EGSB-4S2#HA1 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV0414EGSB-4S2#HA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The RMLV0414EGSB-4S2#HA1 part is unused and in its original packaging.

Return procedure for RMLV0414EGSB-4S2#HA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

RMLV0414EGSB-4S2#HA1 Tags

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