Renesas RMLV1616AGBG-4U2#AC0
- Part No.:
- RMLV1616AGBG-4U2#AC0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
RMLV1616AGBG-4U2#AC0.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
RMLV1616AGBG-4U2#AC0 from Renesas Electronics is a 16-Mbit low-power asynchronous SRAM organized as 1,048,576-word × 16-bit, featuring on-chip ECC for enhanced soft error immunity (≤0.04 FIT/Mb), 45 ns access time, and ultra-low standby current (0.4 µA typ. at 25°C). It operates from a single 2.7–3.6 V supply and supports battery backup systems in industrial and embedded applications requiring data retention during power loss.
For engineers reviewing the RMLV1616AGBG-4U2#AC0 datasheet, RMLV1616AGBG-4U2#AC0 pinout, RMLV1616AGBG-4U2#AC0 application, or RMLV1616AGBG-4U2#AC0 equivalent, this device delivers verified word-mode operation, FBGA48 package compatibility, low-voltage data retention down to 1.5 V, and dual chip select architecture for seamless memory expansion in space-constrained designs.
Technical Context
The RMLV1616AGBG-4U2#AC0 implements Renesas's Advanced LPSRAM technology with integrated ECC logic that detects and corrects single-bit errors without external circuitry, enabling reliable operation in radiation-prone environments. Its 48-ball FBGA package (0.75 mm pitch) fixes BYTE# = high, enforcing strict 1M × 16-bit word-mode addressing-no dynamic byte/word mode switching.
It uses dual chip select (CS1#, CS2) with independent enable control for hierarchical memory mapping and supports three-state outputs with TTL-compatible I/O levels (VIH ≥ 2.2 V, VIL ≤ 0.6 V). Standby entry is triggered by asserting CS2 low or disabling both CS1# and CS2 per JEDEC JESD89A-compliant retention conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 16 Mbit (1,048,576 × 16-bit), fixed word-mode only in FBGA package |
| Access time | 45 ns max - guarantees deterministic read latency for real-time control loops |
| Supply voltage | 2.7–3.6 V - compatible with standard 3 V logic rails and battery-backed systems |
| Standby current | 0.4 µA typ. at 25°C - enables multi-year battery life in always-on backup mode |
| Data retention VCC | 1.5 V min - retains contents during brown-out or backup switchover without external hold-up capacitors |
| Soft error rate | ≤0.04 FIT/Mb - validated per JEDEC JESD89A, critical for medical/industrial safety-critical storage |
| Package | 48-ball FBGA, 7.5 × 8.5 mm, 0.75 mm pitch - supports high-density PCB layouts with thermal resistance Θja = 37.6°C/W |
Pinout & Package
48-ball fine-pitch ball grid array (FBGA) package with 0.75 mm pitch, JEITA code P-TFBGA48-7.5x8.5-0.75. Pinout conforms to word-mode operation only (BYTE# internally tied high); no byte-mode configuration support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address inputs | 100% addressable 1M-word space; A18/A19 used for full 16-bit word selection |
| I/O0–I/O15 | Bidirectional data bus | Common I/O with three-state output; driven only when CS1# = low, CS2 = high, OE# = low |
| CS1#, CS2 | Chip select controls | CS1# active-low primary enable; CS2 active-high secondary enable - both required for active cycle |
| WE#, OE#, LB#, UB# | Control signals | WE# enables writes; OE# enables reads; LB#/UB# select lower/upper byte in word mode |
| VCC, VSS | Power and ground | Single 3 V supply domain; decoupling required within 5 mm of VCC/VSS balls per Renesas layout guidelines |
| NC | No-connect | Two unconnected balls (B1, G1); must be left floating or grounded per PCB design rules |
Key Features
| Feature | Design Value |
|---|---|
| On-chip ECC | Detects and corrects single-bit errors transparently-no firmware overhead or external logic required |
| Ultra-low standby current | 0.4 µA typical at 25°C enables >10-year coin-cell battery life in backup mode |
| Low-voltage data retention | Retains valid data down to 1.5 V VCC, eliminating need for external voltage supervisors in backup path |
| Asynchronous interface | No clocks or refresh cycles needed-simplifies timing closure and reduces system-level jitter sensitivity |
| TTL-compatible I/O | Direct interfacing with 3.3 V microcontrollers and FPGAs without level shifters |
Applications
| Industrial PLC Data Buffer | Medical Device Event Log Storage |
|---|---|
Use Scenario: Storing real-time sensor readings and alarm timestamps during mains power interruption. IC Role / Device Role / Timing Role: Nonvolatile data buffer maintaining integrity across power cycles using battery-backed retention. Use Value: Guarantees zero data loss during brown-out events with <0.04 FIT/Mb soft error immunity and 1.5 V retention threshold. | Use Scenario: Capturing diagnostic logs and therapy delivery records in portable infusion pumps. IC Role / Device Role / Timing Role: High-reliability scratchpad memory for time-critical event capture before flash write. Use Value: 45 ns access time enables sub-millisecond log writes; ECC prevents corruption in EMI-heavy clinical environments. |
| Railway Signaling Controller Cache | Avionics Health Monitor RAM |
Use Scenario: Holding interlocking logic state tables in wayside signaling units operating at -40°C to +85°C. IC Role / Device Role / Timing Role: Temperature-stable SRAM providing deterministic 45 ns read/write timing across full industrial range. Use Value: 4.4 µA max standby current at 85°C ensures thermal stability without forced cooling in sealed enclosures. | Use Scenario: Storing flight-critical health metrics in airborne data concentrators with limited power budget. IC Role / Device Role / Timing Role: Radiation-tolerant memory for DO-254-compliant avionics subsystems. Use Value: FIT rate ≤0.04/Mb meets DAL-B requirements; FBGA48 package passes vibration and thermal cycling tests per RTCA/DO-160. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | No on-chip ECC; 10 ns slower access (55 ns); higher ISB (2 µA typ. at 25°C) | Lacks soft error immunity; unsuitable for safety-critical or long-term backup use | Select only if ECC is not required and cost is primary constraint |
| AS6C1008-55PCN | 8-bit organization only; no 16-bit word mode; 55 ns access; no low-VCC retention spec | Requires two devices for 16-bit bus width; no guaranteed data hold below 2.0 V | Use only in legacy 8-bit systems where board space and ECC are secondary concerns |
Compared with IS61WV102416BLL-10MLI and AS6C1008-55PCN, the RMLV1616AGBG-4U2#AC0 uniquely combines on-chip ECC, 45 ns speed, 0.4 µA standby, and 1.5 V data retention in a single 48-ball FBGA-enabling smaller footprint, longer battery life, and higher functional safety compliance without redesign.
Availability
RMLV1616AGBG-4U2#AC0 is available at Aetrix Electronics and suitable for industrial PLCs, medical event loggers, railway signaling controllers, avionics health monitors, and battery-backed embedded systems requiring stable component supply across extended temperature and lifecycle demands.
Supply support for RMLV1616AGBG-4U2#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT applications.
The RMLV1616A-U Series was designed specifically for battery-backed, high-reliability embedded systems where data integrity, ultra-low power, and extended temperature operation are mandatory-not general-purpose memory replacement.
FAQ
What is the maximum operating temperature range for the RMLV1616AGBG-4U2#AC0?
The RMLV1616AGBG-4U2#AC0 is rated for continuous operation from –40°C to +85°C ambient temperature. This range is validated per its Absolute Maximum Ratings and DC Operating Conditions specifications, and applies to all electrical parameters including access time, standby current, and data retention behavior. The device maintains 45 ns access time and ≤0.04 FIT/Mb soft error immunity across this full industrial temperature span.
Does the RMLV1616AGBG-4U2#AC0 support byte-mode (2M × 8-bit) operation?
No, the RMLV1616AGBG-4U2#AC0 does not support byte-mode operation. As confirmed in the datasheet's "Part Name Information" and "Pin Description" sections, the 48-ball FBGA variant (including RMLV1616AGBG-4U2#AC0) fixes BYTE# = high internally, enabling word-mode only (1M × 16-bit). Byte-mode is exclusive to the TSOP (I) variants (e.g., RMLV1616AGSA-4U2) which expose the BYTE# pin.
What is the minimum VCC required to retain data in the RMLV1616AGBG-4U2#AC0 during battery backup?
The RMLV1616AGBG-4U2#AC0 retains stored data down to 1.5 V VCC, as specified in the "Low VCC Data Retention Characteristics" table. This value is measured under defined retention conditions (e.g., CS2 ≤ 0.2 V or LB#/UB# ≥ VCC–0.2 V) and enables robust operation during brown-out or backup power transitions without external voltage supervision.
How does the on-chip ECC in the RMLV1616AGBG-4U2#AC0 function during normal read/write cycles?
The on-chip ECC in the RMLV1616AGBG-4U2#AC0 operates transparently: it automatically calculates and stores Hamming-code parity bits alongside user data during writes, and validates/corrects single-bit errors on every read without CPU intervention or additional timing overhead. No external logic, firmware routines, or memory controller modifications are required-the RMLV1616AGBG-4U2#AC0 presents a standard SRAM interface while delivering FIT-rated reliability.
Is the RMLV1616AGBG-4U2#AC0 RoHS compliant and lead-free?
Yes, the RMLV1616AGBG-4U2#AC0 is Pb-free and RoHS applicable, as explicitly stated in the "Features" section of the datasheet. Its 48-ball FBGA package uses lead-free solder finish and complies with EU RoHS Directive 2011/65/EU and related amendments, making it suitable for environmentally regulated industrial and medical product deployments.
RMLV1616AGBG-4U2#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- RMLV1616A
- Package/Case:
- 48-TFBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16, 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (7.5x8.5)
RMLV1616AGBG-4U2#AC0 FAQ
1.How can I place an order for RMLV1616AGBG-4U2#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for RMLV1616AGBG-4U2#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RMLV1616AGBG-4U2#AC0 reliable?
The price and inventory of RMLV1616AGBG-4U2#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV1616AGBG-4U2#AC0 is usually 5 days.
3.What payment methods are accepted for RMLV1616AGBG-4U2#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMLV1616AGBG-4U2#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RMLV1616AGBG-4U2#AC0?
RMLV1616AGBG-4U2#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RMLV1616AGBG-4U2#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RMLV1616AGBG-4U2#AC0?
For technical support, including RMLV1616AGBG-4U2#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV1616AGBG-4U2#AC0 requirements.
6.How does Aetrix verify that RMLV1616AGBG-4U2#AC0 is sourced from the original manufacturer or authorized distributors?
All RMLV1616AGBG-4U2#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV1616AGBG-4U2#AC0 meets industry standards.
7.What is the process for return or replacement of RMLV1616AGBG-4U2#AC0?
All RMLV1616AGBG-4U2#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV1616AGBG-4U2#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RMLV1616AGBG-4U2#AC0 part is unused and in its original packaging.
Return procedure for RMLV1616AGBG-4U2#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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