Renesas RMLV1616AGSD-5S2#HA1

Overview

RMLV1616AGSD-5S2 from Renesas Electronics is a 16Mb Advanced LPSRAM organized as 1,048,576-word × 16-bit (or 2,097,152-word × 8-bit), operating from a single 2.7–3.6V supply with 55ns max access time and 0.5µA typical standby current, designed for low-power battery-backed memory applications in industrial control and portable instrumentation.

For engineers reviewing the RMLV1616AGSD-5S2 datasheet, RMLV1616AGSD-5S2 pinout, RMLV1616AGSD-5S2 application, or RMLV1616AGSD-5S2 equivalent, key selection criteria include µTSOP (II) package compatibility, byte/word mode flexibility via BYTE# pin, TTL-level I/O compatibility, and verified data retention down to 1.5V VCC.

Technical Context

The RMLV1616AGSD-5S2 implements dual chip-select architecture (CS1#, CS2) with independent upper/lower byte control (UB#, LB#) and byte-mode enable (BYTE#), supporting both word and byte addressing modes. Its internal decoder and switching circuitry enables seamless 16-bit or 8-bit data bus operation without external logic.

It features three-state output drivers with 22ns OE# propagation delay, 5ns output enable/disable transitions, and high-impedance control timing coordinated across CS, LB/UB, and OE signals - enabling clean bus sharing in multi-device systems.

Key Specifications

Pinout & Package

Package: 52-pin plastic µTSOP (II), 10.79mm × 10.49mm footprint, 0.5mm pitch, JEDEC MO-218AC compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Compared with IS61LV1616AL-10TLI and AS6C1616-55TIN, the RMLV1616AGSD-5S2 uniquely combines 55ns speed, 2.7–3.6V operation, 1.5V data retention, and hardware-selectable byte/word mode in a compact 52-pin µTSOP (II) package - making it optimal for space-constrained, battery-sensitive industrial designs requiring maximum interface flexibility.

Availability

RMLV1616AGSD-5S2 is available at Aetrix Electronics and suitable for industrial PLC data buffering, portable medical monitor memory, and automotive telematics event logging requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for RMLV1616AGSD-5S2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT applications.

The RMLV1616A Series targets low-power, high-reliability embedded systems requiring battery-backed volatile memory with industrial temperature tolerance and flexible bus interfacing - specifically optimized for instrumentation, control, and data acquisition.

FAQ

What is the minimum supply voltage required for data retention in RMLV1616AGSD-5S2?

The RMLV1616AGSD-5S2 maintains valid data down to 1.5V VCC under specified conditions (e.g., CS2 ≤ 0.2V or LB#/UB# ≥ VCC−0.2V). This low retention voltage enables extended operation during brown-out events and supports ultra-low-power backup schemes using small capacitors or primary cells. The device guarantees data integrity across the full −40°C to +85°C temperature range at this voltage.

Does RMLV1616AGSD-5S2 support both 8-bit and 16-bit data bus configurations?

Yes, the RMLV1616AGSD-5S2 supports hardware-selectable 8-bit (byte) and 16-bit (word) operation via the BYTE# pin. When BYTE# = VIL, it operates in byte mode (2M × 8-bit); when BYTE# = VIH, it operates in word mode (1M × 16-bit). This eliminates the need for external multiplexing or address remapping logic, simplifying design reuse across product families with differing bus widths.

What package type is used by RMLV1616AGSD-5S2, and what are its key mechanical dimensions?

The RMLV1616AGSD-5S2 uses a 52-pin plastic µTSOP (II) package per JEDEC MO-218AC, measuring 10.79mm × 10.49mm with 0.5mm lead pitch. Its compact footprint and thin profile (1.0mm max height) make it suitable for space-constrained applications such as handheld instruments and dense industrial modules where thermal and board-area budgets are critical.

How does the dual chip-select architecture (CS1# and CS2) function in RMLV1616AGSD-5S2?

In the RMLV1616AGSD-5S2, CS1# and CS2 operate hierarchically: CS1# acts as primary enable (active low), while CS2 serves as secondary qualifier (active high). Both must be asserted simultaneously for memory access. This architecture allows bank selection in multi-SRAM systems or integration with FPGA/CPLD address decoders that generate complementary chip-select signals without additional logic gates.

Is RMLV1616AGSD-5S2 compatible with standard TTL logic levels?

Yes, the RMLV1616AGSD-5S2 features fully TTL-compatible inputs and outputs: VIH ≥ 2.2V, VIL ≤ 0.6V, VOH ≥ 2.4V (at IOH = −1mA), and VOL ≤ 0.4V (at IOL = 2mA). This ensures direct interfacing with legacy 3.3V microcontrollers, FPGAs, and ASICs without level-shifting components - reducing BOM cost and signal-integrity risk in mixed-voltage systems.