Renesas RMLV1616AGSD-5S2#HC0
- Part No.:
- RMLV1616AGSD-5S2#HC0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 52-TFSOP (0.350", 8.89mm Width)
- Datasheet:
-
RMLV1616AGSD-5S2#HC0.pdf
- Description:
- IC SRAM 16MBIT PAR 52TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
RMLV1616AGSD-5S2 from Renesas Electronics is a 16Mb advanced low-power static RAM (LPSRAM), organized as 1,048,576 words × 16 bits or 2,097,152 words × 8 bits, operating from a single 2.7–3.6V supply with 55ns max access time and 0.5µA typical standby current. It supports byte/word mode operation via BYTE#, UB#, and LB# controls and is designed for battery-backed memory systems in industrial and embedded controllers.
For engineers reviewing the RMLV1616AGSD-5S2 datasheet, RMLV1616AGSD-5S2 pinout, RMLV1616AGSD-5S2 application, or RMLV1616AGSD-5S2 equivalent, key selection criteria include µTSOP (II) package compatibility, low-voltage data retention down to 1.5V, TTL-level I/O compatibility, and dual chip-select architecture enabling multi-bank memory mapping.
Technical Context
The RMLV1616AGSD-5S2 implements a dual-chip-select interface (CS1# active-low, CS2 active-high) with independent byte enable (LB#/UB#) and byte-mode control (BYTE#), allowing flexible 8-bit or 16-bit data bus interfacing without external logic. Its address buffer and sense amplifier architecture supports simultaneous word- and byte-access modes, with BYTE# pin functional only in TSOP (I) and µTSOP (II) packages.
It features three-state output drivers compatible with TTL voltage thresholds (VIH ≥ 2.2V, VIL ≤ 0.6V), low-noise output timing (tOE ≤ 22ns, tOLZ ≤ 5ns), and multiple data retention entry paths-via CS2 ≤ 0.2V, CS1# ≥ VCC−0.2V, or LB#/UB# ≥ VCC−0.2V-enabling robust power-loss recovery in backup systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 16 Mbit (1M × 16 or 2M × 8), enabling compact code/data storage in space-constrained embedded designs |
| Supply voltage | 2.7–3.6V single supply, eliminating need for dual-rail regulators and simplifying power design |
| Access time | 55 ns max, supporting 18.2 MHz synchronous read cycles in microcontroller or FPGA-based systems |
| Standby current | 0.5 µA typical at +25°C, extending battery life to years in always-on backup applications |
| Data retention voltage | 1.5V min, permitting operation during brown-out conditions without data loss |
| Operating temperature | −40°C to +85°C, qualified for industrial-grade reliability in harsh environments |
| Input/output compatibility | TTL-compatible I/O (VIH ≥ 2.2V, VIL ≤ 0.6V), ensuring direct interfacing with legacy MCU buses |
Pinout & Package
Package: 52-pin plastic µTSOP (II), dimensions 10.79 mm × 10.49 mm, surface-mount, JEDEC standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address input (word mode) | 20-bit address bus supporting full 1M-word addressing; A-1 used only in byte mode |
| DQ0–DQ15 | Data input/output | 16-bit bidirectional data bus with three-state output control via OE#, LB#, UB# |
| CS1#, CS2 | Chip select inputs | CS1# active-low + CS2 active-high enables hierarchical memory banking and reduces address decoding complexity |
| WE#, OE#, LB#, UB# | Control inputs | Independent write enable, output enable, and byte-select signals allow granular 8-bit or 16-bit access without glue logic |
| BYTE# | Byte/word mode select | Configures memory organization: BYTE# ≤ 0.2V = byte mode (2M × 8); BYTE# ≥ VCC−0.2V = word mode (1M × 16) |
| VCC, VSS | Power and ground | Single 3V supply rail; decoupling required per JEDEC µTSOP layout guidelines for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Low-power standby | 0.5 µA typical current at +25°C enables >10-year battery backup in SRAM-based real-time clocks and configuration storage |
| Multi-mode data access | Hardware-selectable 8-bit or 16-bit bus width via BYTE# pin, reducing PCB layer count versus fixed-width alternatives |
| Robust data retention | Guaranteed data hold at VCC ≥ 1.5V with multiple entry conditions (CS2, CS1#, or LB#/UB#), critical for fail-safe power-loss recovery |
| TTL-compatible I/O | All pins meet VIH ≥ 2.2V / VIL ≤ 0.6V specs, eliminating level-shifter requirements when interfacing with 3.3V MCUs |
| Dual chip-select architecture | CS1# and CS2 provide independent bank enable control, supporting interleaved memory maps in multi-processor systems |
Applications
| Industrial PLC Data Buffer | Medical Device Configuration Storage |
|---|---|
Use Scenario: Real-time buffering of sensor acquisition data between ADC sampling and CPU processing in programmable logic controllers. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as a temporary FIFO with deterministic 55ns read/write timing. Use Value: Enables deterministic cycle times under interrupt-driven loads while maintaining <0.5µA quiescent draw during idle scan cycles. |
Use Scenario: Storing calibration coefficients, device settings, and audit logs in portable diagnostic equipment requiring guaranteed data integrity during battery swaps. IC Role / Device Role / Timing Role: Battery-backed nonvolatile memory surrogate using low-VCC data retention mode. Use Value: Preserves critical configuration across power interruptions without external NVSRAM or EEPROM, reducing BOM cost and board area. |
| Automotive Telematics Log Memory | Network Edge Router Packet Buffer |
Use Scenario: Capturing CAN bus event logs during vehicle ignition-off periods in telematics control units. IC Role / Device Role / Timing Role: Low-power SRAM holding timestamped fault codes and GPS snapshots during sleep mode. Use Value: Achieves >5-year backup lifetime on coin-cell batteries due to 0.5µA standby current and 1.5V data retention threshold. |
Use Scenario: Temporary packet staging in small-form-factor enterprise switches handling bursty traffic on 10/100 Ethernet ports. IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting concurrent ingress/egress DMA transfers via LB#/UB# byte steering. Use Value: Eliminates external bus transceivers by enabling 8-bit or 16-bit data path optimization per traffic flow, improving throughput efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density low-power SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-10TLI | 10ns faster access (45ns), but 5V-tolerant I/O and higher 2µA standby current; 48-pin TSOP (I) only | Preferred where speed dominates over power; unsuitable for battery-critical designs requiring sub-1µA standby | Select only if system clock exceeds 22 MHz and backup runtime is secondary to performance |
| AS6C4008-55TIN | Same 55ns access and 16Mb density, but 2.2–3.6V range and 1µA standby; 48-ball FBGA package | Better voltage flexibility but lacks BYTE# pin and µTSOP (II) footprint; requires PCB redesign | Choose when board space allows FBGA and wider input voltage margin is needed over pin compatibility |
Compared with IS61LV25616AL-10TLI and AS6C4008-55TIN, the RMLV1616AGSD-5S2 uniquely balances ultra-low standby current (0.5µA), µTSOP (II) mechanical compatibility, and hardware-configurable byte/word mode-making it optimal for battery-constrained industrial edge devices where pinout stability and retention robustness are non-negotiable.
Availability
RMLV1616AGSD-5S2 is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical device configuration storage, automotive telematics logging, network edge router packet staging, and battery-backed real-time clock applications requiring stable component supply across extended product lifecycles.
Supply support for RMLV1616AGSD-5S2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.
The RMLV1616A Series was developed to deliver high-density, low-power static RAM for battery-backed and energy-sensitive embedded systems-emphasizing data retention integrity, wide temperature operation, and simplified interface design.
FAQ
What is the minimum supply voltage required to retain data in RMLV1616AGSD-5S2?
The RMLV1616AGSD-5S2 guarantees data retention down to 1.5V VCC when entering retention mode via CS2 ≤ 0.2V, CS1# ≥ VCC−0.2V, or LB#/UB# ≥ VCC−0.2V. This specification is validated across the full −40°C to +85°C operating range and enables reliable operation during brown-out events without external supervision circuitry. The RMLV1616AGSD-5S2 retains stored values even when main power drops below normal operating levels, provided one of the defined retention entry conditions is met.
Does RMLV1616AGSD-5S2 support both 8-bit and 16-bit data bus configurations?
Yes, the RMLV1616AGSD-5S2 supports both configurations through its BYTE# pin: when BYTE# ≤ 0.2V, it operates in 2M-word × 8-bit mode; when BYTE# ≥ VCC−0.2V, it operates in 1M-word × 16-bit mode. This hardware-selectable mode eliminates the need for external multiplexing logic and allows dynamic reconfiguration based on system bus width. The RMLV1616AGSD-5S2 maintains full timing compliance in both modes, with identical 55ns access time and 0.5µA standby current.
What is the function of the dual chip-select signals (CS1# and CS2) on RMLV1616AGSD-5S2?
CS1# (active-low) and CS2 (active-high) form a two-signal chip-select pair that enables hierarchical memory banking and reduces address decoder complexity. Both must be asserted simultaneously (CS1# = L, CS2 = H) for normal read/write operations. This architecture allows multiple RMLV1616AGSD-5S2 devices to share address/data buses while using unique CS combinations-supporting scalable memory expansion without additional gating logic. The RMLV1616AGSD-5S2 uses CS2 to control internal buffers, making it essential for data retention mode activation.
Can RMLV1616AGSD-5S2 be directly interfaced with 3.3V microcontrollers without level shifters?
Yes, the RMLV1616AGSD-5S2 is fully TTL-compatible: its input thresholds require VIH ≥ 2.2V and VIL ≤ 0.6V, and its outputs drive VOH ≥ 2.4V (at −1mA) and VOL ≤ 0.4V (at 2mA)-all within standard 3.3V logic margins. This ensures interoperability with common 3.3V MCUs, FPGAs, and ASICs without external level translation. The RMLV1616AGSD-5S2 also features 8pF input capacitance and 10pF I/O capacitance, minimizing signal integrity concerns on typical 3.3V bus layouts.
How does the standby current of RMLV1616AGSD-5S2 compare to standard SRAMs in the same density class?
The RMLV1616AGSD-5S2 delivers 0.5µA typical standby current at +25°C-up to 10× lower than conventional 16Mb SRAMs (e.g., IS61LV25616AL at 2µA). This ultra-low quiescent draw is achieved through Renesas's Advanced LPSRAM process and optimized cell design, enabling multi-year battery life in backup applications. The RMLV1616AGSD-5S2 maintains this advantage across temperature, with only 5µA max at +85°C, making it suitable for unregulated, thermally demanding deployments.
RMLV1616AGSD-5S2#HC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 52-TFSOP (0.350", 8.89mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 52-TSOP II
RMLV1616AGSD-5S2#HC0 FAQ
1.How can I place an order for RMLV1616AGSD-5S2#HC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for RMLV1616AGSD-5S2#HC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RMLV1616AGSD-5S2#HC0 reliable?
The price and inventory of RMLV1616AGSD-5S2#HC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV1616AGSD-5S2#HC0 is usually 5 days.
3.What payment methods are accepted for RMLV1616AGSD-5S2#HC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMLV1616AGSD-5S2#HC0 transactions.
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4.How is shipping managed for RMLV1616AGSD-5S2#HC0?
RMLV1616AGSD-5S2#HC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RMLV1616AGSD-5S2#HC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RMLV1616AGSD-5S2#HC0?
For technical support, including RMLV1616AGSD-5S2#HC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV1616AGSD-5S2#HC0 requirements.
6.How does Aetrix verify that RMLV1616AGSD-5S2#HC0 is sourced from the original manufacturer or authorized distributors?
All RMLV1616AGSD-5S2#HC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV1616AGSD-5S2#HC0 meets industry standards.
7.What is the process for return or replacement of RMLV1616AGSD-5S2#HC0?
All RMLV1616AGSD-5S2#HC0 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV1616AGSD-5S2#HC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RMLV1616AGSD-5S2#HC0 part is unused and in its original packaging.
Return procedure for RMLV1616AGSD-5S2#HC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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