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Renesas RMLV1616AGSD-5S2#HC0

Part No.:
RMLV1616AGSD-5S2#HC0
Manufacturer:
Renesas
Category:
Memory
Package:
52-TFSOP (0.350", 8.89mm Width)
Datasheet:
AetrixRMLV1616AGSD-5S2#HC0.pdf
Description:
IC SRAM 16MBIT PAR 52TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,990

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Product details

Overview

RMLV1616AGSD-5S2 from Renesas Electronics is a 16Mb advanced low-power static RAM (LPSRAM), organized as 1,048,576 words × 16 bits or 2,097,152 words × 8 bits, operating from a single 2.7–3.6V supply with 55ns max access time and 0.5µA typical standby current. It supports byte/word mode operation via BYTE#, UB#, and LB# controls and is designed for battery-backed memory systems in industrial and embedded controllers.

For engineers reviewing the RMLV1616AGSD-5S2 datasheet, RMLV1616AGSD-5S2 pinout, RMLV1616AGSD-5S2 application, or RMLV1616AGSD-5S2 equivalent, key selection criteria include µTSOP (II) package compatibility, low-voltage data retention down to 1.5V, TTL-level I/O compatibility, and dual chip-select architecture enabling multi-bank memory mapping.

Technical Context

The RMLV1616AGSD-5S2 implements a dual-chip-select interface (CS1# active-low, CS2 active-high) with independent byte enable (LB#/UB#) and byte-mode control (BYTE#), allowing flexible 8-bit or 16-bit data bus interfacing without external logic. Its address buffer and sense amplifier architecture supports simultaneous word- and byte-access modes, with BYTE# pin functional only in TSOP (I) and µTSOP (II) packages.

It features three-state output drivers compatible with TTL voltage thresholds (VIH ≥ 2.2V, VIL ≤ 0.6V), low-noise output timing (tOE ≤ 22ns, tOLZ ≤ 5ns), and multiple data retention entry paths-via CS2 ≤ 0.2V, CS1# ≥ VCC−0.2V, or LB#/UB# ≥ VCC−0.2V-enabling robust power-loss recovery in backup systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory capacity16 Mbit (1M × 16 or 2M × 8), enabling compact code/data storage in space-constrained embedded designs
Supply voltage2.7–3.6V single supply, eliminating need for dual-rail regulators and simplifying power design
Access time55 ns max, supporting 18.2 MHz synchronous read cycles in microcontroller or FPGA-based systems
Standby current0.5 µA typical at +25°C, extending battery life to years in always-on backup applications
Data retention voltage1.5V min, permitting operation during brown-out conditions without data loss
Operating temperature−40°C to +85°C, qualified for industrial-grade reliability in harsh environments
Input/output compatibilityTTL-compatible I/O (VIH ≥ 2.2V, VIL ≤ 0.6V), ensuring direct interfacing with legacy MCU buses

Pinout & Package

Package: 52-pin plastic µTSOP (II), dimensions 10.79 mm × 10.49 mm, surface-mount, JEDEC standard footprint.

Pin/Terminal Circuit Role Design Meaning
A0–A19Address input (word mode)20-bit address bus supporting full 1M-word addressing; A-1 used only in byte mode
DQ0–DQ15Data input/output16-bit bidirectional data bus with three-state output control via OE#, LB#, UB#
CS1#, CS2Chip select inputsCS1# active-low + CS2 active-high enables hierarchical memory banking and reduces address decoding complexity
WE#, OE#, LB#, UB#Control inputsIndependent write enable, output enable, and byte-select signals allow granular 8-bit or 16-bit access without glue logic
BYTE#Byte/word mode selectConfigures memory organization: BYTE# ≤ 0.2V = byte mode (2M × 8); BYTE# ≥ VCC−0.2V = word mode (1M × 16)
VCC, VSSPower and groundSingle 3V supply rail; decoupling required per JEDEC µTSOP layout guidelines for signal integrity

Key Features

Feature Design Value
Low-power standby0.5 µA typical current at +25°C enables >10-year battery backup in SRAM-based real-time clocks and configuration storage
Multi-mode data accessHardware-selectable 8-bit or 16-bit bus width via BYTE# pin, reducing PCB layer count versus fixed-width alternatives
Robust data retentionGuaranteed data hold at VCC ≥ 1.5V with multiple entry conditions (CS2, CS1#, or LB#/UB#), critical for fail-safe power-loss recovery
TTL-compatible I/OAll pins meet VIH ≥ 2.2V / VIL ≤ 0.6V specs, eliminating level-shifter requirements when interfacing with 3.3V MCUs
Dual chip-select architectureCS1# and CS2 provide independent bank enable control, supporting interleaved memory maps in multi-processor systems

Applications

Industrial PLC Data Buffer Medical Device Configuration Storage

Use Scenario: Real-time buffering of sensor acquisition data between ADC sampling and CPU processing in programmable logic controllers.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as a temporary FIFO with deterministic 55ns read/write timing.

Use Value: Enables deterministic cycle times under interrupt-driven loads while maintaining <0.5µA quiescent draw during idle scan cycles.

Use Scenario: Storing calibration coefficients, device settings, and audit logs in portable diagnostic equipment requiring guaranteed data integrity during battery swaps.

IC Role / Device Role / Timing Role: Battery-backed nonvolatile memory surrogate using low-VCC data retention mode.

Use Value: Preserves critical configuration across power interruptions without external NVSRAM or EEPROM, reducing BOM cost and board area.

Automotive Telematics Log Memory Network Edge Router Packet Buffer

Use Scenario: Capturing CAN bus event logs during vehicle ignition-off periods in telematics control units.

IC Role / Device Role / Timing Role: Low-power SRAM holding timestamped fault codes and GPS snapshots during sleep mode.

Use Value: Achieves >5-year backup lifetime on coin-cell batteries due to 0.5µA standby current and 1.5V data retention threshold.

Use Scenario: Temporary packet staging in small-form-factor enterprise switches handling bursty traffic on 10/100 Ethernet ports.

IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting concurrent ingress/egress DMA transfers via LB#/UB# byte steering.

Use Value: Eliminates external bus transceivers by enabling 8-bit or 16-bit data path optimization per traffic flow, improving throughput efficiency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density low-power SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV25616AL-10TLI10ns faster access (45ns), but 5V-tolerant I/O and higher 2µA standby current; 48-pin TSOP (I) onlyPreferred where speed dominates over power; unsuitable for battery-critical designs requiring sub-1µA standbySelect only if system clock exceeds 22 MHz and backup runtime is secondary to performance
AS6C4008-55TINSame 55ns access and 16Mb density, but 2.2–3.6V range and 1µA standby; 48-ball FBGA packageBetter voltage flexibility but lacks BYTE# pin and µTSOP (II) footprint; requires PCB redesignChoose when board space allows FBGA and wider input voltage margin is needed over pin compatibility

Compared with IS61LV25616AL-10TLI and AS6C4008-55TIN, the RMLV1616AGSD-5S2 uniquely balances ultra-low standby current (0.5µA), µTSOP (II) mechanical compatibility, and hardware-configurable byte/word mode-making it optimal for battery-constrained industrial edge devices where pinout stability and retention robustness are non-negotiable.

Availability

RMLV1616AGSD-5S2 is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical device configuration storage, automotive telematics logging, network edge router packet staging, and battery-backed real-time clock applications requiring stable component supply across extended product lifecycles.

Supply support for RMLV1616AGSD-5S2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.

The RMLV1616A Series was developed to deliver high-density, low-power static RAM for battery-backed and energy-sensitive embedded systems-emphasizing data retention integrity, wide temperature operation, and simplified interface design.

FAQ

What is the minimum supply voltage required to retain data in RMLV1616AGSD-5S2?

The RMLV1616AGSD-5S2 guarantees data retention down to 1.5V VCC when entering retention mode via CS2 ≤ 0.2V, CS1# ≥ VCC−0.2V, or LB#/UB# ≥ VCC−0.2V. This specification is validated across the full −40°C to +85°C operating range and enables reliable operation during brown-out events without external supervision circuitry. The RMLV1616AGSD-5S2 retains stored values even when main power drops below normal operating levels, provided one of the defined retention entry conditions is met.

Does RMLV1616AGSD-5S2 support both 8-bit and 16-bit data bus configurations?

Yes, the RMLV1616AGSD-5S2 supports both configurations through its BYTE# pin: when BYTE# ≤ 0.2V, it operates in 2M-word × 8-bit mode; when BYTE# ≥ VCC−0.2V, it operates in 1M-word × 16-bit mode. This hardware-selectable mode eliminates the need for external multiplexing logic and allows dynamic reconfiguration based on system bus width. The RMLV1616AGSD-5S2 maintains full timing compliance in both modes, with identical 55ns access time and 0.5µA standby current.

What is the function of the dual chip-select signals (CS1# and CS2) on RMLV1616AGSD-5S2?

CS1# (active-low) and CS2 (active-high) form a two-signal chip-select pair that enables hierarchical memory banking and reduces address decoder complexity. Both must be asserted simultaneously (CS1# = L, CS2 = H) for normal read/write operations. This architecture allows multiple RMLV1616AGSD-5S2 devices to share address/data buses while using unique CS combinations-supporting scalable memory expansion without additional gating logic. The RMLV1616AGSD-5S2 uses CS2 to control internal buffers, making it essential for data retention mode activation.

Can RMLV1616AGSD-5S2 be directly interfaced with 3.3V microcontrollers without level shifters?

Yes, the RMLV1616AGSD-5S2 is fully TTL-compatible: its input thresholds require VIH ≥ 2.2V and VIL ≤ 0.6V, and its outputs drive VOH ≥ 2.4V (at −1mA) and VOL ≤ 0.4V (at 2mA)-all within standard 3.3V logic margins. This ensures interoperability with common 3.3V MCUs, FPGAs, and ASICs without external level translation. The RMLV1616AGSD-5S2 also features 8pF input capacitance and 10pF I/O capacitance, minimizing signal integrity concerns on typical 3.3V bus layouts.

How does the standby current of RMLV1616AGSD-5S2 compare to standard SRAMs in the same density class?

The RMLV1616AGSD-5S2 delivers 0.5µA typical standby current at +25°C-up to 10× lower than conventional 16Mb SRAMs (e.g., IS61LV25616AL at 2µA). This ultra-low quiescent draw is achieved through Renesas's Advanced LPSRAM process and optimized cell design, enabling multi-year battery life in backup applications. The RMLV1616AGSD-5S2 maintains this advantage across temperature, with only 5µA max at +85°C, making it suitable for unregulated, thermally demanding deployments.

RMLV1616AGSD-5S2#HC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
52-TFSOP (0.350", 8.89mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
16Mbit
Memory Organization:
2M x 8, 1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
52-TSOP II

RMLV1616AGSD-5S2#HC0 FAQ

1.How can I place an order for RMLV1616AGSD-5S2#HC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for RMLV1616AGSD-5S2#HC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for RMLV1616AGSD-5S2#HC0 reliable?

The price and inventory of RMLV1616AGSD-5S2#HC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV1616AGSD-5S2#HC0 is usually 5 days.

3.What payment methods are accepted for RMLV1616AGSD-5S2#HC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMLV1616AGSD-5S2#HC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for RMLV1616AGSD-5S2#HC0?

RMLV1616AGSD-5S2#HC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your RMLV1616AGSD-5S2#HC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for RMLV1616AGSD-5S2#HC0?

For technical support, including RMLV1616AGSD-5S2#HC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV1616AGSD-5S2#HC0 requirements.

6.How does Aetrix verify that RMLV1616AGSD-5S2#HC0 is sourced from the original manufacturer or authorized distributors?

All RMLV1616AGSD-5S2#HC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV1616AGSD-5S2#HC0 meets industry standards.

7.What is the process for return or replacement of RMLV1616AGSD-5S2#HC0?

All RMLV1616AGSD-5S2#HC0 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV1616AGSD-5S2#HC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The RMLV1616AGSD-5S2#HC0 part is unused and in its original packaging.

Return procedure for RMLV1616AGSD-5S2#HC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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