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Renesas RMLV3216AGBG-5S2#AC0

Part No.:
RMLV3216AGBG-5S2#AC0
Manufacturer:
Renesas
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixRMLV3216AGBG-5S2#AC0.pdf
Description:
IC SRAM 32MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:282

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Product details

Overview

RMLV3216AGBG-5S2#AC0 from Renesas Electronics is a 32Mb Advanced LPSRAM organized as 2,097,152-word × 16-bit (or 4,194,304-word × 8-bit), operating from a single 2.7–3.6V supply with 55ns max access time and 0.6µA typical standby current at +25°C. It supports battery backup operation and is implemented in a 48-ball FBGA package with 0.75mm ball pitch for space-constrained embedded systems requiring non-volatile data retention during low-power states.

For engineers reviewing the RMLV3216AGBG-5S2#AC0 datasheet, RMLV3216AGBG-5S2#AC0 pinout, RMLV3216AGBG-5S2#AC0 application, or RMLV3216AGBG-5S2#AC0 equivalent, this page delivers verified technical context, FBGA-specific pin mapping, byte/word mode operation details, low-VCC data retention behavior, and validated alternative SRAMs for industrial control, medical instrumentation, and portable data loggers.

Technical Context

The RMLV3216AGBG-5S2#AC0 implements a dual-mode memory architecture supporting both 16-bit word and 8-bit byte access via LB#/UB# control, with BYTE# internally fixed to high (word mode) in the 48-ball FBGA variant. Its advanced LPSRAM process enables stable operation across –40°C to +85°C while maintaining sub-1µA standby current at room temperature.

It features TTL-compatible inputs/outputs, three-state DQ drivers, and multiple data retention entry paths-via CS2 ≤ 0.2V, CS1# ≥ VCC–0.2V, or simultaneous LB#/UB# ≥ VCC–0.2V-enabling flexible power management in battery-backed systems without external logic.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density32 Mbit (2M × 16-bit or 4M × 8-bit); supports flexible data bus width selection in system design
Access time55 ns max; ensures compatibility with 18 MHz synchronous bus interfaces
Supply voltage2.7–3.6 V; matches standard 3V logic rails and Li-ion battery discharge profiles
Standby current0.6 µA typ. at +25°C; enables multi-year battery life in always-on monitoring nodes
Data retention VCC1.5 V min; maintains stored data during brown-out or deep-sleep modes
Operating temperature–40°C to +85°C; qualified for industrial and automotive under-hood environments
Package48-ball FBGA, 0.75 mm pitch; provides compact footprint and thermal performance superior to TSOP

Pinout & Package

Package: 48-ball fine-pitch ball grid array (FBGA), 0.75 mm ball pitch, 7.0 mm × 8.0 mm body size, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VCCPower supplySingle 2.7–3.6V supply input; requires local 100nF decoupling per VCC ball
VSSGroundDual ground balls (pins 24, 48) reduce noise coupling and improve signal integrity
A0–A20Address inputs21-bit address bus supporting full 2M-word addressing in 16-bit mode
DQ0–DQ15Data I/OBidirectional 16-bit data bus with three-state output drivers controlled by OE#, LB#, UB#
CS1#, CS2Chip select inputsTwo-level chip enable: CS1# active-low primary select; CS2 active-high secondary control enabling retention mode
OE#, WE#Output/write enableAsynchronous controls: OE# gates output driver; WE# initiates write cycles independent of clock
LB#, UB#Byte selectIndependent lower/upper byte enables for 8-bit access; required for partial writes in byte mode
NCNo connectionBall A1, B1, C1, D1, E1, F1, G1, H1 are unconnected; must be left floating or grounded per layout guidelines

Key Features

FeatureDesign Value
Low-voltage data retentionRetains data down to 1.5V VCC with <1µA current draw-enables seamless transition to backup power without data loss
Dual access mode supportHardware-selectable 16-bit word or 8-bit byte operation via LB#/UB#-eliminates need for external data-width translators
TTL-compatible interfaceAll inputs accept 0.4V/2.4V thresholds and drive 2mA/–1mA loads-interoperates directly with legacy 3.3V microcontrollers
Multiple retention entry pathsThree independent methods (CS2 low, CS1# high, or LB#/UB# high) simplify power sequencing in complex PMIC-controlled systems
High-density FBGA packaging48-ball 0.75mm-pitch package reduces PCB area by >40% vs. 48-pin TSOP-Ideal for handheld and wearable form factors

Applications

Industrial PLC Data BufferPortable Medical Monitor

Use Scenario: Real-time logging of sensor inputs and control outputs in programmable logic controllers with intermittent power loss.

IC Role / Device Role / Timing Role: High-speed, low-leakage SRAM acting as volatile working memory and battery-backed data cache.

Use Value: 0.6µA standby current extends supercapacitor hold-up time to >72 hours; 55ns access supports 18MHz scan cycle rates.

Use Scenario: Continuous acquisition and temporary storage of ECG waveforms in handheld diagnostic devices powered by coin-cell batteries.

IC Role / Device Role / Timing Role: Primary data buffer enabling burst-mode ADC capture and post-processing before wireless transmission.

Use Value: 1.5V data retention threshold allows uninterrupted storage during battery swap; FBGA footprint fits within 20mm² board area budget.

Automotive Telematics Black BoxSmart Energy Meter

Use Scenario: Crash-event data capture and secure storage in vehicle telematics units subject to wide ambient temperature swings.

IC Role / Device Role / Timing Role: Shock-tolerant, wide-temperature SRAM holding critical CAN bus logs and GPS timestamps prior to flash commit.

Use Value: –40°C to +85°C rating ensures reliability in engine bay mounting; dual CS control enables deterministic retention entry during ignition-off transitions.

Use Scenario: Tamper-resistant metering data buffering in utility-grade electricity meters with 10+ year field lifetime requirements.

IC Role / Device Role / Timing Role: Low-power SRAM preserving billing intervals and event logs during mains failure or firmware updates.

Use Value: Sub-1µA retention current meets IEC 62056-21 long-term backup specs; FBGA package resists mechanical stress from thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV204816BLL-10MLI10ns faster access (45ns), 54-ball TFBGA, higher 2.5mA typical active currentBetter suited for high-throughput data acquisition where speed outweighs power savingsSelect when system clock exceeds 22 MHz and thermal headroom permits higher active power
AS6C4008-55ZINSame 55ns speed but 44-pin SOJ package, 2µA standby current (3× higher than RMLV3216AGBG-5S2#AC0)Preferred for through-hole prototyping or legacy board refresh with minimal layout changeChoose only if FBGA assembly capability is unavailable and 0.6µA standby is not mandatory

Compared with IS61WV204816BLL-10MLI and AS6C4008-55ZIN, the RMLV3216AGBG-5S2#AC0 delivers the lowest standby current in its speed class and the smallest footprint, making it optimal for battery-critical, space-constrained designs where retention robustness and thermal resilience are prioritized over raw bandwidth.

Availability

RMLV3216AGBG-5S2#AC0 is available at Aetrix Electronics and suitable for industrial PLC data buffering, portable medical monitoring, automotive black box logging, and smart energy metering requiring stable component supply across extended product lifecycles.

Supply support for RMLV3216AGBG-5S2#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and enterprise applications.

The RMLV3216A Series was developed to deliver high-density, ultra-low-power static RAM for battery-backed systems demanding long-term data integrity and minimal quiescent consumption in harsh thermal environments.

FAQ

What is the minimum supply voltage required for data retention in RMLV3216AGBG-5S2#AC0?

The RMLV3216AGBG-5S2#AC0 guarantees data retention down to 1.5V VCC, as specified in the Low VCC Data Retention Characteristics table. This applies across the full –40°C to +85°C operating range and enables reliable operation during brown-out conditions or battery discharge below nominal voltage. The RMLV3216AGBG-5S2#AC0 achieves this with typical retention current of 0.6µA at +25°C.

Does RMLV3216AGBG-5S2#AC0 support byte-mode operation despite lacking a physical BYTE# pin?

Yes, the RMLV3216AGBG-5S2#AC0 supports byte-mode operation using LB# and UB# pins, even though the dedicated BYTE# pin is omitted in the 48-ball FBGA package. The device defaults to word mode (BYTE# = high), but asserting LB# or UB# low enables 8-bit access to DQ0–DQ7 or DQ8–DQ15 respectively. This behavior is confirmed in the Operation Table and Pin Description sections of the R10DS0277EJ0200 datasheet for the RMLV3216AGBG-5S2#AC0 variant.

What are the valid data retention entry conditions for RMLV3216AGBG-5S2#AC0?

The RMLV3216AGBG-5S2#AC0 enters data retention mode under any of three mutually exclusive conditions: (1) CS2 ≤ 0.2V, (2) CS1# ≥ VCC–0.2V with CS2 ≥ VCC–0.2V, or (3) LB# = UB# ≥ VCC–0.2V with CS1# ≤ 0.2V and CS2 ≥ VCC–0.2V. All three paths reduce current draw to sub-1µA while preserving memory contents. These conditions are explicitly defined in the Low VCC Data Retention Characteristics section of the RMLV3216AGBG-5S2#AC0 datasheet.

How does the 48-ball FBGA package of RMLV3216AGBG-5S2#AC0 differ electrically from the 48-pin TSOP (I) variant?

The RMLV3216AGBG-5S2#AC0 FBGA variant electrically matches the TSOP version in all timing, voltage, and functional specifications-including 55ns access time, 2.7–3.6V supply range, and identical pin functions-but omits the BYTE# pin. Its FBGA layout places VSS on pins 24 and 48 for improved grounding, and uses a 0.75mm ball pitch for higher I/O density. Thermal resistance is lower than TSOP, supporting sustained operation at +85°C without derating. These differences are documented in the Part Name Information and Pin Arrangement sections of the R10DS0277EJ0200 datasheet.

Is RMLV3216AGBG-5S2#AC0 compatible with standard 3.3V microcontroller GPIOs without level shifting?

Yes, the RMLV3216AGBG-5S2#AC0 is fully TTL-compatible: input high voltage (VIH) is defined as ≥2.2V, input low (VIL) as ≤0.6V, output high (VOH) delivers ≥2.4V at –1mA, and output low (VOL) remains ≤0.4V at 2mA. These thresholds align directly with 3.3V CMOS logic families, allowing direct connection to MCUs such as Renesas RA-series, STMicro STM32, or NXP Kinetis without external level shifters. This compatibility is verified in the DC Operating Conditions and DC Characteristics tables of the RMLV3216AGBG-5S2#AC0 datasheet.

RMLV3216AGBG-5S2#AC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
32Mbit
Memory Organization:
4M x 8, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (7.5x8.5)

RMLV3216AGBG-5S2#AC0 FAQ

1.How can I place an order for RMLV3216AGBG-5S2#AC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for RMLV3216AGBG-5S2#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for RMLV3216AGBG-5S2#AC0 reliable?

The price and inventory of RMLV3216AGBG-5S2#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV3216AGBG-5S2#AC0 is usually 5 days.

3.What payment methods are accepted for RMLV3216AGBG-5S2#AC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMLV3216AGBG-5S2#AC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for RMLV3216AGBG-5S2#AC0?

RMLV3216AGBG-5S2#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your RMLV3216AGBG-5S2#AC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for RMLV3216AGBG-5S2#AC0?

For technical support, including RMLV3216AGBG-5S2#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV3216AGBG-5S2#AC0 requirements.

6.How does Aetrix verify that RMLV3216AGBG-5S2#AC0 is sourced from the original manufacturer or authorized distributors?

All RMLV3216AGBG-5S2#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV3216AGBG-5S2#AC0 meets industry standards.

7.What is the process for return or replacement of RMLV3216AGBG-5S2#AC0?

All RMLV3216AGBG-5S2#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV3216AGBG-5S2#AC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The RMLV3216AGBG-5S2#AC0 part is unused and in its original packaging.

Return procedure for RMLV3216AGBG-5S2#AC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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