My Inquiry
My Account
Renesas RMLV3216AGBG-5S2#KC0
- Part No.:
- RMLV3216AGBG-5S2#KC0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
RMLV3216AGBG-5S2#KC0.pdf
- Description:
- IC SRAM 32MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,699
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
RMLV3216AGBG-5S2#KC0 from Renesas Electronics is a 32Mb Advanced LPSRAM organized as 2,097,152-word × 16-bit (or 4,194,304-word × 8-bit), operating from a single 2.7–3.6V supply with 55ns max access time and 0.6µA typical standby current at +25°C, enabling low-power battery backup operation in industrial memory subsystems.
For engineers reviewing the RMLV3216AGBG-5S2#KC0 datasheet, RMLV3216AGBG-5S2#KC0 pinout, RMLV3216AGBG-5S2#KC0 application, or RMLV3216AGBG-5S2#KC0 equivalent, key selection criteria include FBGA-48 package compatibility, byte/word mode flexibility via LB#/UB#, TTL-level I/O compatibility, and verified data retention down to 1.5V VCC.
Technical Context
This SRAM implements dual chip select (CS1#, CS2) and independent byte enable (LB#, UB#) logic to support flexible memory mapping in microcontroller- and FPGA-based systems. Its 48-ball FBGA package (0.75mm pitch) omits the BYTE# pin-locking operation into word mode (A-1 not used) per datasheet note on page 3 and page 4.
The device supports three data retention entry methods: CS2 ≤ 0.2V, CS1# ≥ VCC−0.2V (with CS2 high), or simultaneous LB#/UB# ≥ VCC−0.2V. Standby current scales predictably with temperature: 0.6µA @ +25°C, 1µA @ +40°C, 4µA @ +70°C, and 8µA @ +85°C under specified bias conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 32 Mbit (2M × 16-bit or 4M × 8-bit organization) |
| Access time | 55 ns max - defines minimum read cycle for timing-critical control loops |
| Supply voltage | 2.7 V to 3.6 V - compatible with 3.3V logic rails and brown-out tolerant |
| Standby current | 0.6 µA typ. @ +25°C - enables multi-year battery backup in RTC or sensor nodes |
| Data retention VCC | 1.5 V min - maintains stored data during deep sleep or power-fail scenarios |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded applications |
| Package | 48-ball FBGA, 0.75 mm pitch - compact footprint for space-constrained PCB layouts |
Pinout & Package
48-ball fine-pitch ball grid array (FBGA) package with 0.75 mm ball pitch, top-view layout matching JEDEC MO-276AA standard. No BYTE# pin present; device operates exclusively in word mode (A-1 address line not implemented).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 2M-word × 16-bit addressing; A-1 unused in FBGA variant |
| DQ0–DQ15 | Bi-directional data I/O | 16-bit common data bus with 3-state output control via OE#, LB#, UB# |
| CS1#, CS2 | Chip select inputs | Two-level hierarchical chip select: CS1# active-low primary, CS2 active-high secondary for bank isolation |
| OE#, WE#, LB#, UB# | Control inputs | Output enable, write enable, and byte-select signals-all TTL-compatible, active-low |
| VCC, VSS | Power and ground | Single 3.3V supply domain; decoupling required per ball placement (VCC/VSS distributed across perimeter) |
Key Features
| Feature | Design Value |
|---|---|
| Low-voltage data retention | Maintains valid data down to 1.5V VCC without external backup power |
| TTL-compatible I/O | All inputs and outputs meet TTL voltage thresholds (VIH ≥ 2.2V, VIL ≤ 0.6V) for direct interface with legacy controllers |
| Multi-mode byte/word access | LB#/UB# enable true 8-bit or 16-bit access granularity without external logic |
| Ultra-low standby current | Sub-microampere ISB1 (0.6 µA typ.) reduces battery load in always-on systems |
| Industrial temperature range | Guaranteed operation from −40°C to +85°C without derating |
Applications
| Industrial PLC Data Buffer | Medical Device Real-Time Log Storage |
|---|---|
Use Scenario: Storing transient process variables and alarm history in programmable logic controllers with intermittent power. IC Role / Device Role / Timing Role: High-speed, non-refreshing data buffer interfacing directly to ARM Cortex-M7 bus with 55ns read latency. Use Value: 0.6µA standby current extends supercapacitor hold-up time beyond 72 hours during AC loss. | Use Scenario: Capturing ECG waveform snapshots and diagnostic metadata in portable patient monitors. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for real-time signal processing pipelines with deterministic 55ns access. Use Value: 1.5V data retention allows seamless transition to coin-cell backup during main power interruption. |
| Automotive ADAS Sensor Fusion Hub | Smart Meter Firmware Update Cache |
Use Scenario: Temporarily aggregating radar and camera frame metadata before CAN FD transmission in Level 2+ ADAS ECUs. IC Role / Device Role / Timing Role: Dual-port-accessible SRAM with independent LB#/UB# control for concurrent read/write of sensor buffers. Use Value: 48-ball FBGA footprint minimizes board area while meeting AEC-Q100 ambient temperature requirements. | Use Scenario: Caching encrypted firmware images during over-the-air updates in ANSI C12.22-compliant electricity meters. IC Role / Device Role / Timing Role: Battery-backed memory holding validated update payloads during power cycling. Use Value: Verified 8µA max ISB1 at +85°C ensures >10-year meter battery life with infrequent updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV204816BLL-10MLI | 10ns faster access (45ns), 48-pin TSOP-I package, no FBGA option | Requires PCB redesign for TSOP footprint; lacks 0.75mm FBGA miniaturization | Select when absolute minimum read latency is critical and board space permits TSOP |
| AS6C4008-55ZIN | Same 55ns speed but 4M × 8-bit only; 32-pin SOJ package; higher 2µA standby current | Fixed 8-bit bus width limits controller compatibility; larger SOJ footprint increases routing complexity | Select only for cost-sensitive 8-bit-only designs where standby current >1µA is acceptable |
Compared with IS61WV204816BLL-10MLI and AS6C4008-55ZIN, the RMLV3216AGBG-5S2#KC0 uniquely delivers FBGA-48 miniaturization, sub-1µA standby at +25°C, and dual-mode (x16/x8) configurability-making it optimal for space- and power-constrained industrial edge nodes.
Availability
RMLV3216AGBG-5S2#KC0 is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical real-time log storage, automotive ADAS sensor fusion, smart meter firmware caching, and battery-backed instrumentation requiring stable component supply across extended temperature ranges.
Supply support for RMLV3216AGBG-5S2#KC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The RMLV3216A Series was designed specifically for low-power, high-reliability embedded memory applications requiring battery backup, wide temperature operation, and compact packaging-targeting industrial automation and medical equipment designers.
FAQ
What is the maximum access time specification for RMLV3216AGBG-5S2#KC0?
The RMLV3216AGBG-5S2#KC0 has a maximum access time of 55 ns under all operating conditions (VCC = 2.7–3.6 V, TA = −40°C to +85°C), measured as address-to-data valid (tAA) with VIH = 2.4 V and VIL = 0.4 V. This value is guaranteed across the full industrial temperature range and forms the basis for minimum read cycle timing in system design.
Does RMLV3216AGBG-5S2#KC0 support byte-mode operation?
No, the RMLV3216AGBG-5S2#KC0 does not support byte-mode operation. As confirmed on page 3 of the datasheet, the BYTE# pin is omitted in the 48-ball FBGA package variant, fixing the device in word mode (2M × 16-bit). Address line A-1 is not implemented, and LB#/UB# function solely as byte-write enables within the 16-bit data bus-not as mode selectors.
What is the minimum supply voltage required to retain data in RMLV3216AGBG-5S2#KC0?
The RMLV3216AGBG-5S2#KC0 guarantees data retention down to 1.5 V VCC when placed in standby using any of three supported methods: CS2 ≤ 0.2 V, CS1# ≥ VCC−0.2 V (with CS2 high), or simultaneous LB#/UB# ≥ VCC−0.2 V. This 1.5 V threshold is tested and specified in the Low VCC Data Retention Characteristics table on page 13.
How many address lines does RMLV3216AGBG-5S2#KC0 require for full memory access?
The RMLV3216AGBG-5S2#KC0 requires 21 address lines (A0 through A20) to access its full 2,097,152-word × 16-bit capacity. In word mode (the only mode supported by this FBGA variant), A-1 is not present or used. The 21-bit address bus provides direct linear addressing without banking or multiplexing overhead.
Is RMLV3216AGBG-5S2#KC0 pin-compatible with other packages in the RMLV3216A Series?
No, RMLV3216AGBG-5S2#KC0 is not pin-compatible with the TSOP-I or µTSOP-II variants. Its 48-ball FBGA layout (page 2, top view) differs electrically and physically from the 48-pin TSOP-I and 52-pin µTSOP-II packages. Critical differences include the absence of BYTE# and NC pins, relocated power/ground balls, and incompatible pin functions-requiring unique PCB layout and footprint.
RMLV3216AGBG-5S2#KC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (7.5x8.5)
RMLV3216AGBG-5S2#KC0 FAQ
1.How can I place an order for RMLV3216AGBG-5S2#KC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for RMLV3216AGBG-5S2#KC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RMLV3216AGBG-5S2#KC0 reliable?
The price and inventory of RMLV3216AGBG-5S2#KC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV3216AGBG-5S2#KC0 is usually 5 days.
3.What payment methods are accepted for RMLV3216AGBG-5S2#KC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMLV3216AGBG-5S2#KC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RMLV3216AGBG-5S2#KC0?
RMLV3216AGBG-5S2#KC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RMLV3216AGBG-5S2#KC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RMLV3216AGBG-5S2#KC0?
For technical support, including RMLV3216AGBG-5S2#KC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV3216AGBG-5S2#KC0 requirements.
6.How does Aetrix verify that RMLV3216AGBG-5S2#KC0 is sourced from the original manufacturer or authorized distributors?
All RMLV3216AGBG-5S2#KC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV3216AGBG-5S2#KC0 meets industry standards.
7.What is the process for return or replacement of RMLV3216AGBG-5S2#KC0?
All RMLV3216AGBG-5S2#KC0 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV3216AGBG-5S2#KC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RMLV3216AGBG-5S2#KC0 part is unused and in its original packaging.
Return procedure for RMLV3216AGBG-5S2#KC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
RMLV3216AGBG-5S2#KC0 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
