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Renesas RMLV3216AGSA-5S2#KA0
- Part No.:
- RMLV3216AGSA-5S2#KA0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
RMLV3216AGSA-5S2#KA0.pdf
- Description:
- IC SRAM 32MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:3,425
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Product details
Overview
RMLV3216AGSA-5S2#KA0 from Renesas Electronics is a 32Mb Advanced LPSRAM organized as 2,097,152-word × 16-bit (or 4,194,304-word × 8-bit), operating from a single 2.7V–3.6V supply with 55ns max access time and 0.6µA typical standby current at +25°C. It supports battery backup operation and is used in low-power embedded systems requiring non-volatile data retention during power loss.
For engineers reviewing the RMLV3216AGSA-5S2#KA0 datasheet, RMLV3216AGSA-5S2#KA0 pinout, RMLV3216AGSA-5S2#KA0 application, or RMLV3216AGSA-5S2#KA0 equivalent, key selection criteria include TSOP (I) package compatibility, byte/word mode flexibility via BYTE# control, low-voltage data retention down to 1.5V, and TTL-level I/O compatibility without level-shifting.
Technical Context
This SRAM implements dual chip select (CS1#, CS2), independent upper/lower byte control (UB#, LB#), and configurable byte/word addressing via BYTE#. Its architecture supports three distinct data retention entry modes-CS1#, CS2, or LB#/UB#-controlled-with guaranteed data hold at VCC ≥ 1.5V and sub-microamp ICCDR across industrial temperature range.
The device uses Renesas' Advanced LPSRAM process to achieve simultaneous high density, fast 55ns read/write cycles, and ultra-low standby power. Pin-compatible operation between word (A0–A20) and byte (A–1–A20) addressing modes enables flexible memory mapping in microcontroller-based systems with varying bus widths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 32 Mbit (2M × 16-bit or 4M × 8-bit); supports dual-width addressing for MCU bus alignment |
| Access time | 55 ns max; ensures timing compliance with 18 MHz synchronous bus interfaces |
| Supply voltage | 2.7V–3.6V single supply; compatible with 3.3V logic domains without regulators |
| Standby current | 0.6 µA typ. at +25°C; enables multi-year battery backup in RTC or SRAM-critical subsystems |
| Data retention VCC | 1.5V min; maintains stored data during brown-out or backup battery discharge |
| Operating temp | −40°C to +85°C; qualified for industrial-grade embedded control and telemetry applications |
| I/O compatibility | TTL input thresholds (VIH = 2.2V, VIL = 0.6V) and output drive (VOH = 2.4V @ −1mA, VOL = 0.4V @ 2mA) |
Pinout & Package
Package: 48-pin plastic TSOP (I), 12 mm × 20 mm body, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs (word mode) | 21-bit address bus supporting 2M-word × 16-bit configuration |
| A−1–A20 | Address inputs (byte mode) | A−1 enables 8-bit addressing; A0–A20 map to DQ0–DQ7 in byte mode |
| DQ0–DQ15 | Bi-directional data I/O | Three-state outputs; shared pins for read/write; support byte/word transfers |
| CS1#, CS2 | Chip select inputs | CS1# active-low primary enable; CS2 active-high secondary control for retention mode selection |
| WE#, OE#, LB#, UB# | Control inputs | WE# initiates write; OE# enables output; LB#/UB# select lower/upper byte during 16-bit access |
| BYTE# | Mode configuration | High = word mode (A0–A20); low = byte mode (A−1–A20); supported only on TSOP (I) and µTSOP (II) |
| VCC, VSS | Power and ground | Single 3.3V supply; decoupling required per JEDEC TSOP layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Battery backup operation | Guaranteed data retention at VCC ≥ 1.5V with ICCDR ≤ 8 µA up to +85°C |
| Flexible bus interface | Configurable 8-bit or 16-bit data width via BYTE# pin, eliminating external multiplexing logic |
| Ultra-low standby power | 0.6 µA typical ISB1 at +25°C enables >10-year coin-cell backup in always-on systems |
| Direct TTL compatibility | No level shifters needed: VIH/VIL and VOH/VOL meet 3.3V TTL specs across full temperature range |
| Dual chip select architecture | CS1# and CS2 jointly manage active/standby states and enable three independent data retention entry paths |
Applications
| Industrial PLC Data Buffer | Medical Device Real-Time Log Storage |
|---|---|
Use Scenario: Storing sensor calibration tables and runtime state variables in programmable logic controllers with intermittent mains power. IC Role / Device Role / Timing Role: Non-volatile SRAM buffer holding critical configuration during AC dropout; retains data at 1.5V VCC. Use Value: Eliminates need for external EEPROM write cycles and wear leveling; 55ns access enables real-time register updates during scan cycles. | Use Scenario: Capturing ECG waveform snapshots and diagnostic timestamps in portable patient monitors powered by rechargeable Li-ion cells. IC Role / Device Role / Timing Role: High-speed scratchpad memory for burst acquisition; switches to battery-backed retention when main power drops below 2.7V. Use Value: 0.6 µA standby current extends backup runtime >3 months on CR2032; BYTE# pin simplifies 8-bit microcontroller interface. |
| Automotive Telematics Event Logger | Smart Meter Firmware Parameter Cache |
Use Scenario: Recording CAN bus fault codes and GPS position history in vehicle black-box modules exposed to −40°C to +85°C ambient. IC Role / Device Role / Timing Role: Temperature-hardened SRAM storing crash-triggered event buffers; CS2-controlled retention activates during ignition-off. Use Value: Industrial temp rating and 18 µA ICCDR at +85°C ensure reliable logging under hood conditions without thermal derating. | Use Scenario: Caching tariff schedules, billing counters, and communication stack parameters in ANSI C12.19-compliant electricity meters with supercapacitor backup. IC Role / Device Role / Timing Role: Low-leakage memory preserving metering accuracy during grid outages; LB#/UB# enables atomic 16-bit parameter writes. Use Value: Dual-byte select allows safe concurrent update of high/low words without read-modify-write; 55ns tAA meets DLMS/COSEM response latency targets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-10TLI | 10ns faster access (45ns), 3.3V-only supply (3.135–3.465V), no BYTE# pin, same 48-pin TSOP (I) footprint | Lacks byte/word mode switching; requires fixed 16-bit bus; no sub-2.7V data retention | Select when system demands maximum speed and operates strictly within tight 3.3V tolerance; not suitable for battery-retention designs. |
| AS6C4008-55ZIN | Same 55ns speed, 2.7–3.6V supply, 48-pin TSOP (I), but only 4Mb density (256K × 16-bit) and no LB#/UB# or BYTE# control | Half the memory capacity; no byte-select capability; simpler control interface but less flexible addressing | Choose for cost-sensitive, space-constrained designs where 4Mb suffices and byte granularity is unnecessary. |
Compared with IS61LV25616AL-10TLI and AS6C4008-55ZIN, the RMLV3216AGSA-5S2#KA0 uniquely combines 32Mb density, 55ns speed, battery-retention capability down to 1.5V, and hardware-configurable 8/16-bit bus interface-making it optimal for next-generation industrial and medical edge devices requiring both capacity and ultra-low-power resilience.
Availability
RMLV3216AGSA-5S2#KA0 is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical real-time log storage, and automotive telematics event logging requiring stable component supply across extended temperature and long-life battery backup requirements.
Supply support for RMLV3216AGSA-5S2#KA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The RMLV3216A Series was designed specifically for low-power embedded systems needing reliable, high-density static RAM with robust battery backup operation and flexible bus interfacing across wide temperature ranges.
FAQ
What is the minimum supply voltage required to retain data in RMLV3216AGSA-5S2#KA0?
The RMLV3216AGSA-5S2#KA0 guarantees data retention down to 1.5V VCC when entering retention mode via CS1#, CS2, or LB#/UB# control. At this voltage, ICCDR remains ≤ 8 µA at +85°C, enabling multi-month backup on small coin cells. This specification is validated per the Low VCC Data Retention Characteristics table on page 13 of the R10DS0277EJ0200 datasheet.
Does RMLV3216AGSA-5S2#KA0 support both 8-bit and 16-bit data bus configurations?
Yes, the RMLV3216AGSA-5S2#KA0 supports both configurations using the BYTE# pin: when BYTE# = VIH, it operates in 16-bit word mode (A0–A20, DQ0–DQ15); when BYTE# = VIL, it switches to 8-bit byte mode (A−1–A20, DQ0–DQ7). This feature is exclusive to the 48-pin TSOP (I) and 52-pin µTSOP (II) packages - confirmed in the Pin Description and Operation Table sections of the datasheet.
What is the maximum operating current of RMLV3216AGSA-5S2#KA0 during active read/write cycles?
The RMLV3216AGSA-5S2#KA0 draws up to 35 mA typical ICC1 under worst-case active conditions: 55ns cycle time, 100% duty, all controls active, and VCC = 3.0V at +25°C. This value is specified in the DC Characteristics table (page 5) and reflects peak dynamic consumption during continuous high-speed access - critical for power budgeting in battery-powered systems.
Can RMLV3216AGSA-5S2#KA0 be used with 5V-tolerant microcontrollers?
No, the RMLV3216AGSA-5S2#KA0 is not 5V-tolerant: its absolute maximum input voltage is VCC + 0.3V (≤ 3.9V at 3.6V supply), and VIH is defined as ≥ 2.2V. Direct connection to 5V logic will exceed VIH and VT ratings, risking damage. Level translation is required for interfacing with 5V microcontrollers - as explicitly stated in the Absolute Maximum Ratings and DC Operating Conditions sections.
How does the dual chip select (CS1# and CS2) architecture improve power management in RMLV3216AGSA-5S2#KA0?
The dual chip select architecture in the RMLV3216AGSA-5S2#KA0 enables three independent data retention entry paths: CS1#-controlled, CS2-controlled, or LB#/UB#-controlled. This allows system designers to choose the most appropriate signal for initiating low-power retention - for example, tying CS2 to a dedicated backup supervisor or routing LB#/UB# from a low-power GPIO - improving design flexibility and reducing external component count compared to single-CS SRAMs.
RMLV3216AGSA-5S2#KA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
RMLV3216AGSA-5S2#KA0 FAQ
1.How can I place an order for RMLV3216AGSA-5S2#KA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for RMLV3216AGSA-5S2#KA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RMLV3216AGSA-5S2#KA0 reliable?
The price and inventory of RMLV3216AGSA-5S2#KA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV3216AGSA-5S2#KA0 is usually 5 days.
3.What payment methods are accepted for RMLV3216AGSA-5S2#KA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMLV3216AGSA-5S2#KA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RMLV3216AGSA-5S2#KA0?
RMLV3216AGSA-5S2#KA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RMLV3216AGSA-5S2#KA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RMLV3216AGSA-5S2#KA0?
For technical support, including RMLV3216AGSA-5S2#KA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV3216AGSA-5S2#KA0 requirements.
6.How does Aetrix verify that RMLV3216AGSA-5S2#KA0 is sourced from the original manufacturer or authorized distributors?
All RMLV3216AGSA-5S2#KA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV3216AGSA-5S2#KA0 meets industry standards.
7.What is the process for return or replacement of RMLV3216AGSA-5S2#KA0?
All RMLV3216AGSA-5S2#KA0 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV3216AGSA-5S2#KA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RMLV3216AGSA-5S2#KA0 part is unused and in its original packaging.
Return procedure for RMLV3216AGSA-5S2#KA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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