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Renesas RMLV3216AGSD-5S2#HA0

Part No.:
RMLV3216AGSD-5S2#HA0
Manufacturer:
Renesas
Category:
Memory
Package:
52-TFSOP (0.350", 8.89mm Width)
Datasheet:
AetrixRMLV3216AGSD-5S2#HA0.pdf
Description:
IC SRAM 32MBIT PAR 52TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,434

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Product details

Overview

RMLV3216AGSD-5S2 from Renesas Electronics is a 32Mb Advanced LPSRAM organized as 2,097,152-word × 16-bit (or 4,194,304-word × 8-bit), operating from a single 2.7–3.6V supply with 55ns max access time and 0.6µA typical standby current at +25°C. It supports byte/word mode operation via LB#/UB#/BYTE# control and is designed for low-power battery-backed memory applications in industrial and embedded systems.

For engineers reviewing the RMLV3216AGSD-5S2 datasheet, RMLV3216AGSD-5S2 pinout, RMLV3216AGSD-5S2 application, or RMLV3216AGSD-5S2 equivalent, key selection criteria include µTSOP (II) package compatibility, 52-pin footprint, TTL-level I/O compatibility, low-voltage data retention down to 1.5V, and dual chip-select architecture enabling multi-bank memory expansion.

Technical Context

The RMLV3216AGSD-5S2 implements a dual-select static RAM architecture with independent CS1# and CS2 inputs, where CS2 enables address/data buffers and controls entry into data retention mode. Its BYTE# pin-present only in TSOP (I) and µTSOP (II) variants-configures word/byte addressing modes, while LB# and UB# enable selective 8-bit writes without affecting adjacent bytes.

It features three-state bidirectional DQ0–DQ15 I/Os with 2mA drive strength, 10pF input/output capacitance, and timing-critical parameters including tOE ≤ 22ns, tCLZ1 ≤ 10ns, and tCHZ1 ≤ 18ns, ensuring reliable interfacing with microcontrollers and ASICs operating at up to 18MHz read/write cycles.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density32 Mbit (2M × 16-bit or 4M × 8-bit); enables compact code/data storage in space-constrained designs.
Supply voltage2.7–3.6 V; compatible with standard 3.3V logic rails and tolerant of brown-out conditions during battery backup.
Access time55 ns max; supports 18 MHz synchronous bus operation with sufficient setup/hold margin.
Standby current0.6 µA typ. at +25°C; extends battery life in always-on or infrequently accessed memory subsystems.
Data retention voltage1.5 V min; maintains SRAM contents during deep sleep or main power loss without external backup circuitry.
Operating temperature−40°C to +85°C; qualified for industrial-grade deployment in harsh ambient environments.
I/O interfaceTTL-compatible inputs/outputs; eliminates level-shifting requirements when interfacing with legacy or mixed-voltage controllers.

Pinout & Package

Package: 52-pin plastic µTSOP (II), dimensions 10.79 mm × 10.49 mm, pitch 0.5 mm, JEDEC MO-218AC compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A20Address inputs21-bit address bus supporting full 2M-word × 16-bit or 4M-word × 8-bit addressing; A-1 used only in byte mode.
DQ0–DQ15Bidirectional data I/O16-bit common data bus with three-state output; shared for read and write transfers.
CS1#, CS2Chip select inputsCS1# active-low primary select; CS2 high-active secondary select that gates internal buffers and enables data retention mode.
WE#, OE#, LB#, UB#, BYTE#Control inputsWE# initiates write; OE# enables output drivers; LB#/UB# select lower/upper byte; BYTE# configures word/byte addressing mode.
VCC, VSSPower and groundSingle 3V supply domain; decoupling required per JEDEC µTSOP layout guidelines for noise immunity.
NCNo connectionUnbonded pins; must remain unconnected and floating per Renesas design rules.

Key Features

FeatureDesign Value
Low-power standby0.6 µA typical current at +25°C enables >10-year battery backup in real-time clock or configuration memory applications.
Multi-mode addressingHardware-configurable BYTE# pin supports seamless transition between 16-bit word and 8-bit byte access without firmware overhead.
Dual chip-select architectureIndependent CS1# and CS2 inputs allow hierarchical memory mapping and selective power gating of buffer circuits.
Low-voltage data retentionGuaranteed data hold at VCC ≥ 1.5V with ICCDR ≤ 8 µA at +85°C, eliminating need for external backup capacitors or supercapacitors.
TTL-compatible I/OVIH = 2.2V min and VOL = 0.4V max ensure robust signal integrity when interfacing with 3.3V microcontrollers and FPGAs.

Applications

Industrial PLC Data BufferMedical Device Configuration Memory

Use Scenario: Storing runtime I/O state and alarm history in programmable logic controllers with intermittent power loss.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding critical process variables during AC mains interruption.

Use Value: 0.6 µA standby current and 1.5V data retention threshold extend backup battery life beyond 5 years without refresh.

Use Scenario: Retaining calibration coefficients and patient-specific settings in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Battery-backed configuration store accessible via 8-bit microcontroller bus during boot and service mode.

Use Value: BYTE#-enabled byte-mode operation allows efficient 1-byte parameter updates without disturbing adjacent memory locations.

Automotive Telematics Log BufferNetwork Edge Router Packet Metadata Cache

Use Scenario: Capturing CAN bus event logs during vehicle ignition-off periods using supercapacitor-assisted backup.

IC Role / Device Role / Timing Role: High-speed SRAM acting as circular buffer for crash-triggered diagnostics with deterministic 55ns read latency.

Use Value: Dual CS architecture permits isolated memory banking-CS2 disabled during log capture to minimize leakage while preserving data integrity.

Use Scenario: Caching packet header metadata and flow identifiers in Layer-3 switching ASICs requiring fast lookup tables.

IC Role / Device Role / Timing Role: Low-latency 16-bit wide memory block interfaced directly to packet processing engine's address/data bus.

Use Value: 22ns tOE and 10ns tOH guarantee sub-25ns valid data window for pipelined forwarding decisions at 40Gbps line rates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density low-power SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV204816BLL-10MLI10ns faster access (45ns), 44-pin SOJ package, no BYTE# pin, higher standby current (2µA typ.)Lacks hardware byte/word mode switching; requires software-managed byte masking for partial writes.Choose for speed-critical buffering where µTSOP footprint is not mandatory and byte-mode flexibility is secondary.
AS6C4008-55ZINSame 55ns access, 48-pin TSOP (I), no CS2 pin, no low-VCC retention spec below 2.0VSingle CS architecture limits power-gating granularity; no guaranteed data hold below 2.0V.Choose for cost-sensitive industrial designs where dual-CS control and sub-2V retention are unnecessary.

Compared with IS61WV204816BLL-10MLI and AS6C4008-55ZIN, the RMLV3216AGSD-5S2 uniquely delivers µTSOP (II) packaging, hardware-configurable BYTE# for true byte/word mode, and verified 1.5V data retention-making it optimal for battery-constrained, space-limited, and retention-critical embedded systems.

Availability

RMLV3216AGSD-5S2 is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical device configuration storage, automotive telematics logging, and network edge router metadata caching requiring stable component supply across extended product lifecycles.

Supply support for RMLV3216AGSD-5S2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.

The RMLV3216A Series was developed to deliver high-density, low-leakage SRAM for battery-backed applications where long-term data retention and minimal standby power are critical system requirements.

FAQ

What is the maximum operating frequency supported by the RMLV3216AGSD-5S2?

The RMLV3216AGSD-5S2 has a 55ns maximum access time, corresponding to a theoretical maximum bus clock frequency of approximately 18.2 MHz for read cycles. This assumes proper setup/hold timing margins and meets tRC = 55ns minimum cycle time under worst-case voltage (2.7V) and temperature (+85°C) conditions. The RMLV3216AGSD-5S2 does not include an internal clock generator; timing is fully asynchronous and controlled by external host signals.

Does the RMLV3216AGSD-5S2 support true byte-write operations without affecting adjacent bytes?

Yes, the RMLV3216AGSD-5S2 supports independent lower-byte (LB#) and upper-byte (UB#) writes. When BYTE# is asserted low (byte mode), asserting LB# alone writes only DQ0–DQ7 while leaving DQ8–DQ15 unchanged, and asserting UB# alone writes only DQ8–DQ15. This functionality is confirmed in the Operation Table on page 4 of the R10DS0277EJ0200 datasheet and applies specifically to the RMLV3216AGSD-5S2 µTSOP (II) variant.

What is the minimum supply voltage at which the RMLV3216AGSD-5S2 retains stored data?

The RMLV3216AGSD-5S2 guarantees data retention down to 1.5V, as specified in the Low VCC Data Retention Characteristics table (page 13). At this voltage, data is retained with ICCDR ≤ 8 µA at +85°C when entering retention mode via CS2 ≤ 0.2V, CS1# ≥ VCC−0.2V, or LB#/UB# ≥ VCC−0.2V. This specification is validated for the RMLV3216AGSD-5S2 and is not extrapolated from other variants.

Is the RMLV3216AGSD-5S2 pin-compatible with other members of the RMLV3216A Series?

No, the RMLV3216AGSD-5S2 is not pin-compatible with the 48-pin TSOP (I) or 48-ball FBGA variants. It uses a 52-pin µTSOP (II) footprint with distinct pin arrangement (e.g., NC pins at positions 25, 44, 45, 46, 51, 52), different CS2 polarity behavior, and inclusion of the BYTE# pin-features absent in the FBGA version and assigned to different pins in TSOP (I). Pin compatibility must be verified per package-specific diagrams in the R10DS0277EJ0200 datasheet.

How does the dual chip-select architecture (CS1# and CS2) improve power management in the RMLV3216AGSD-5S2?

The CS2 input in the RMLV3216AGSD-5S2 gates internal address, data, and control buffers. When CS2 is deasserted (low), all buffers enter high-impedance and leakage is minimized-even if CS1# remains active-enabling selective power-down of unused memory banks. This architecture reduces dynamic and standby current beyond what single-CS SRAMs achieve, and is explicitly documented in the Absolute Maximum Ratings and DC Characteristics sections of the R10DS0277EJ0200 datasheet for the RMLV3216AGSD-5S2.

RMLV3216AGSD-5S2#HA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
52-TFSOP (0.350", 8.89mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
32Mbit
Memory Organization:
4M x 8, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
52-TSOP II

RMLV3216AGSD-5S2#HA0 FAQ

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Please submit a Request for Quotation (RFQ) for RMLV3216AGSD-5S2#HA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of RMLV3216AGSD-5S2#HA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMLV3216AGSD-5S2#HA0 is usually 5 days.

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Once your RMLV3216AGSD-5S2#HA0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for RMLV3216AGSD-5S2#HA0?

For technical support, including RMLV3216AGSD-5S2#HA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMLV3216AGSD-5S2#HA0 requirements.

6.How does Aetrix verify that RMLV3216AGSD-5S2#HA0 is sourced from the original manufacturer or authorized distributors?

All RMLV3216AGSD-5S2#HA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMLV3216AGSD-5S2#HA0 meets industry standards.

7.What is the process for return or replacement of RMLV3216AGSD-5S2#HA0?

All RMLV3216AGSD-5S2#HA0 units undergo pre-shipment inspection (PSI). If there is an issue with RMLV3216AGSD-5S2#HA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The RMLV3216AGSD-5S2#HA0 part is unused and in its original packaging.

Return procedure for RMLV3216AGSD-5S2#HA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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