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Renesas RMWV6416AGSD-5S2#HA0

Part No.:
RMWV6416AGSD-5S2#HA0
Manufacturer:
Renesas
Category:
Memory
Package:
52-TFSOP (0.350", 8.89mm Width)
Datasheet:
AetrixRMWV6416AGSD-5S2#HA0.pdf
Description:
IC SRAM 64MBIT PAR 52TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,993

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Product details

Overview

RMWV6416AGSD-5S2 from Renesas Electronics is a 64Mb Advanced LPSRAM organized as 4,194,304-word × 16-bit (or 8,388,608-word × 8-bit), fabricated using high-performance low-power SRAM technology. It operates from a single 3V supply (2.7–3.6V), delivers 55ns max access time, draws only 1.2µA typical standby current, and supports battery backup operation in industrial temperature range (−40°C to +85°C). It is used in embedded systems requiring non-volatile data retention during power loss.

For engineers reviewing the RMWV6416AGSD-5S2 datasheet, RMWV6416AGSD-5S2 pinout, RMWV6416AGSD-5S2 application, or RMWV6416AGSD-5S2 equivalent, key selection criteria include byte/word mode flexibility via BYTE#, dual chip select architecture (CS1#/CS2), ultra-low ISB1 standby current at temperature, TTL-compatible I/O, and µTSOP (II) package compatibility with space-constrained PCB layouts.

Technical Context

The RMWV6416AGSD-5S2 implements a dual-bank 32Mb × 2 memory array with independent column decoding for x8/x16 configurable data width. Its control logic supports three distinct operational modes-word, byte, and upper/lower byte write-enabled by coordinated assertion of CS1#, CS2, WE#, LB#, UB#, and BYTE#.

It features two independent chip select inputs (CS1# active-low, CS2 active-high) enabling hierarchical memory mapping, and includes dedicated byte-select pins (LB#, UB#) plus BYTE# to configure address interpretation (A−1 vs A0–A21) and DQ bus partitioning. Standby entry is triggered by CS2 low or CS1# high or simultaneous LB#/UB# high under defined voltage thresholds.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density64 Mbit (4M × 16 or 8M × 8), enabling compact code/data storage in resource-limited microcontroller subsystems
Access Time55 ns max - ensures timing compliance with 18.2 MHz synchronous bus interfaces without wait states
Supply Voltage2.7 V to 3.6 V - compatible with standard 3.3V logic rails and tolerant of brown-out conditions down to 2.7V
Standby Current1.2 µA typ. at +25°C - enables multi-year battery backup in RTC or SRAM-cached firmware applications
Operating Temperature−40°C to +85°C - qualified for industrial-grade deployment in automotive body controllers and factory automation nodes
Data Retention VCC1.5 V min - maintains stored data during deep sleep or capacitor-backed power failure scenarios
Package52-pin µTSOP (II), 10.79 mm × 10.49 mm - provides fine-pitch surface-mount compatibility while easing thermal dissipation vs. TSOP-I

Pinout & Package

RMWV6416AGSD-5S2 uses a 52-pin plastic µTSOP (II) package with 0.5 mm pitch, optimized for high-density PCB layouts and automated assembly. Pin numbering follows standard counter-clockwise orientation starting from the index mark.

Pin/Terminal Circuit Role Design Meaning
A0–A21Address input (word mode)22-bit address bus supporting full 4M-word addressing; A−1 used only in byte mode
DQ0–DQ15Data input/output16-bit bidirectional data bus with three-state output control; shared I/O reduces pin count vs. separate DQ/DI
CS1#, CS2Chip select inputsCS1# (active-low) and CS2 (active-high) enable hierarchical decode; both must be asserted for read/write activation
WE#, OE#, LB#, UB#Control inputsWE# initiates writes; OE# enables outputs; LB#/UB# select byte lanes; all TTL-compatible (VIH ≥ 2.2V, VIL ≤ 0.6V)
BYTE#Mode configurationSelects word (BYTE# ≥ VCC−0.2V) or byte (BYTE# ≤ 0.2V) addressing; required for A−1 usage and byte-mode operation
VCC, VSSPower terminalsSingle 3V supply rail; decoupling near package essential due to 38 mA max operating current and fast edge rates

Key Features

Feature Design Value
Battery backup supportEnables data retention at VCC as low as 1.5 V with ISB1 ≤ 36 µA at +85°C, eliminating need for external backup batteries in many designs
Byte/word mode flexibilityBYTE# pin allows runtime reconfiguration between 16-bit word and 8-bit byte access, simplifying interface to 8-bit microcontrollers or legacy peripherals
Ultra-low standby power1.2 µA typical ISB1 at +25°C meets stringent energy budgets for always-on sensor nodes and IoT endpoints
TTL-compatible I/OAll inputs and outputs meet TTL voltage thresholds (VIH ≥ 2.2 V, VOL ≤ 0.4 V), enabling direct connection to 3.3V microcontrollers without level shifters
Dual chip select architectureCS1# and CS2 allow cascaded memory mapping - e.g., CS2 enables bank selection while CS1# gates individual device access within bank

Applications

Industrial PLC Data Buffer Automotive Body Control Module

Use Scenario: Temporary storage of I/O scan data and fault logs during cyclic PLC scan execution.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM buffer interfaced directly to ARM Cortex-M7 MCU's external bus interface.

Use Value: 55 ns access time eliminates wait states; 1.2 µA standby current extends backup runtime during main power interruption.

Use Scenario: Storing calibrated sensor offsets and EEPROM-emulated configuration parameters in door module ECUs.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding critical settings across ignition cycles, backed by coin cell during main power loss.

Use Value: 1.5 V data retention threshold ensures reliable holdover even as backup voltage sags; −40°C to +85°C rating matches under-hood requirements.

Medical Infusion Pump Controller Network Edge Router Packet Buffer

Use Scenario: Real-time buffering of dosage history and alarm event timestamps with deterministic latency.

IC Role / Device Role / Timing Role: Safety-critical SRAM providing fail-safe data capture path independent of main application processor.

Use Value: Dual CS architecture isolates pump controller access from diagnostic subsystem; byte-mode support simplifies integration with 8-bit safety monitor MCU.

Use Scenario: Temporary frame storage in Layer 2 switching ASIC subsystems requiring burst-access memory for QoS queue management.

IC Role / Device Role / Timing Role: Low-power, high-bandwidth SRAM serving as packet descriptor cache adjacent to traffic manager logic.

Use Value: 38 mA max ICC1 supports sustained 18.2 MHz bus throughput; µTSOP (II) footprint minimizes trace inductance for signal integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density low-power SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV6416BLL-10MLI10 ns faster access (45 ns max); 3.3 V only (3.135–3.465 V); no BYTE# pin; 48-pin TSOP-I packageLacks byte/word mode flexibility and extended voltage range; requires tighter VCC regulationPreferred where speed >5 MHz bus timing margin is critical and system VCC is tightly regulated
AS6C6416-55ZINSame 55 ns access; 2.7–3.6 V supply; 48-ball FBGA package; no BYTE# support; higher ISB (5 µA typ.)Smaller footprint but no byte-mode capability; less suitable for mixed 8/16-bit bus environmentsChosen when board space is constrained and FBGA assembly infrastructure exists; not drop-in for µTSOP layout

Compared with RMWV6416AGSD-5S2, IS61WV6416BLL-10MLI trades voltage flexibility and byte-mode configurability for raw speed, while AS6C6416-55ZIN sacrifices mode versatility and ultra-low standby for compact packaging - making RMWV6416AGSD-5S2 optimal for thermally demanding, battery-backed, mixed-bus industrial designs.

Availability

RMWV6416AGSD-5S2 is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive body control modules, and medical infusion pump controllers requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for RMWV6416AGSD-5S2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RMWV6416A Series was designed specifically for battery-backed, low-power embedded systems needing reliable static RAM with flexible bus interface options and extended temperature operation.

FAQ

What is the minimum supply voltage required for data retention in RMWV6416AGSD-5S2?

The RMWV6416AGSD-5S2 guarantees data retention down to 1.5 V on VCC when entering standby via CS2 low, CS1# high, or LB#/UB# high assertion. This threshold is validated across the full −40°C to +85°C temperature range and enables robust operation during brown-out or capacitor-based backup scenarios without external supervision circuitry.

Does RMWV6416AGSD-5S2 support both 8-bit and 16-bit data bus configurations?

Yes, RMWV6416AGSD-5S2 supports both configurations via the BYTE# pin: when BYTE# ≥ VCC−0.2V, it operates in 16-bit word mode (A0–A21, DQ0–DQ15); when BYTE# ≤ 0.2V, it enters 8-bit byte mode (A−1–A21, DQ0–DQ7). This eliminates need for external multiplexing or bus-width adaptation logic in mixed-architecture systems.

What is the function of the dual chip select signals (CS1# and CS2) in RMWV6416AGSD-5S2?

CS1# (active-low) and CS2 (active-high) provide hierarchical chip enable control: CS2 acts as a master bank enable, while CS1# serves as a per-device select within that bank. Both must be asserted simultaneously for read/write operations, allowing scalable memory expansion with minimal address decoder complexity and reduced contention on shared data buses.

How does RMWV6416AGSD-5S2 achieve ultra-low standby current of 1.2 µA?

The RMWV6416AGSD-5S2 achieves 1.2 µA typical standby current (ISB1) through Renesas' Advanced LPSRAM process, which minimizes subthreshold leakage and employs dynamic power gating on internal buffers (address, WE#, OE#, LB#/UB#, DQ) when CS2 is low or CS1# is high. This design eliminates need for external power switches in battery-critical applications.

Is RMWV6416AGSD-5S2 pin-compatible with other members of the RMWV6416A Series?

No, RMWV6416AGSD-5S2 is not pin-compatible with RMWV6416AGSA-5S2 (48-pin TSOP-I) or RMWV6416AGBG-5S2 (48-ball FBGA). The 52-pin µTSOP (II) package has unique pin count, pitch, and layout - including dedicated NC pins and relocated control signals - requiring distinct PCB footprints and routing strategies.

RMWV6416AGSD-5S2#HA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
52-TFSOP (0.350", 8.89mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
64Mbit
Memory Organization:
8M x 8, 4M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
52-TSOP II

RMWV6416AGSD-5S2#HA0 FAQ

1.How can I place an order for RMWV6416AGSD-5S2#HA0 through Aetrix?

Please submit a Request for Quotation (RFQ) for RMWV6416AGSD-5S2#HA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for RMWV6416AGSD-5S2#HA0 reliable?

The price and inventory of RMWV6416AGSD-5S2#HA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RMWV6416AGSD-5S2#HA0 is usually 5 days.

3.What payment methods are accepted for RMWV6416AGSD-5S2#HA0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RMWV6416AGSD-5S2#HA0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for RMWV6416AGSD-5S2#HA0?

RMWV6416AGSD-5S2#HA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your RMWV6416AGSD-5S2#HA0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for RMWV6416AGSD-5S2#HA0?

For technical support, including RMWV6416AGSD-5S2#HA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RMWV6416AGSD-5S2#HA0 requirements.

6.How does Aetrix verify that RMWV6416AGSD-5S2#HA0 is sourced from the original manufacturer or authorized distributors?

All RMWV6416AGSD-5S2#HA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RMWV6416AGSD-5S2#HA0 meets industry standards.

7.What is the process for return or replacement of RMWV6416AGSD-5S2#HA0?

All RMWV6416AGSD-5S2#HA0 units undergo pre-shipment inspection (PSI). If there is an issue with RMWV6416AGSD-5S2#HA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The RMWV6416AGSD-5S2#HA0 part is unused and in its original packaging.

Return procedure for RMWV6416AGSD-5S2#HA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

RMWV6416AGSD-5S2#HA0 Tags

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