Infineon Technologies ROTATEKNOB3D2GOKITTOBO1

Overview

ROTATEKNOB3D2GOKITTOBO1 from Infineon Technologies is a mechanical evaluation kit comprising a 3D magnetic rotary knob with integrated push-button functionality, designed for rapid prototyping of contactless angular and axial position sensing using XENSIV™ 3D Hall sensors TLV493D-A1B6, TLE493D-A2B6, and TLI493D-A2B6. It delivers analog/digital rotation tracking (±180° mechanical range) and tactile push detection, enabling human-machine interface development in automotive HVAC controls and industrial HMI panels.

For engineers reviewing the ROTATEKNOB3D2GOKITTOBO1 datasheet, ROTATEKNOB3D2GOKITTOBO1 pinout, ROTATEKNOB3D2GOKITTOBO1 application, or ROTATEKNOB3D2GOKITTOBO1 equivalent, this kit provides calibrated mechanical actuation paired with I²C-compatible sensor output, supporting quick validation of angle resolution (0.1° typical), low-power operation (1.7 µA standby), and robust ESD tolerance (±4 kV HBM) in real-world mounting configurations.

Technical Context

This kit implements a non-contact 3D magnetic sensing solution where rotational movement modulates the orientation of a diametrically magnetized neodymium magnet relative to an underlying XENSIV™ 3D Hall sensor IC. Push actuation compresses a spring-loaded plunger that triggers a discrete mechanical switch signal independent of magnetic sensing.

The system requires no PCB-level soldering: the knob mounts directly onto the sensor carrier board via M3 threaded insert, and interfaces exclusively through the pre-wired 6-pin header (VDD, GND, SDA, SCL, SW, NC) compatible with Infineon's 2GO evaluation platform. Firmware interaction occurs via I²C at standard mode (100 kHz) or fast mode (400 kHz).

Key Specifications

Availability

ROTATEKNOB3D2GOKITTOBO1 is available at Aetrix Electronics and suitable for automotive HVAC interfaces, industrial HMI panels, and consumer appliance control dials requiring stable component supply and rapid functional validation.

Supply support for ROTATEKNOB3D2GOKITTOBO1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with global R&D and manufacturing infrastructure.

This kit belongs to the XENSIV™ 3D Magnetic Sensor 2GO family - engineered to accelerate development of contactless position sensing solutions by combining calibrated mechanical elements with plug-and-play sensor hardware and GUI-based configuration tools.

FAQ

Does ROTATEKNOB3D2GOKITTOBO1 include a sensor IC?

No. The kit contains only the mechanical rotary knob assembly, push-button mechanism, mounting hardware, and pre-wired 6-pin header cable. It is designed to mate with separate XENSIV™ 3D Hall sensor evaluation boards (e.g., TLE493D-A2B6 2GO board), which must be ordered separately.

What software is required to evaluate this kit?

The official Infineon GUI for 3D Magnetic Sensor 2Go (v03.30, ZIP archive, 29 MB) is required. It runs on Windows 7+ and communicates via USB-to-I²C bridge to display real-time angle, temperature, and push status - no firmware coding or driver installation needed.

Can this knob be mounted behind a metal panel?

No. Ferromagnetic materials within 5 mm of the magnet or sensor will distort the magnetic field and degrade angular accuracy. Mounting behind aluminum, plastic, or glass panels up to 3 mm thick is verified and supported per the user manual.

Is custom calibration supported?

Yes. The GUI includes offset and sensitivity adjustment tools, and raw I²C register access allows full customization of measurement range, averaging, and interrupt thresholds - documented in the TLE493D-A2B6 datasheet and application notes.