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NXP Semiconductors RW610HN/A2IK
- Part No.:
- RW610HN/A2IK
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- -
- Datasheet:
-
RW610HN/A2IK.pdf
- Description:
- RW610HN/A2IK
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Product details
Overview
RW610HN/A2IK from NXP Semiconductors is a secure wireless MCU integrating a 260 MHz Arm Cortex-M33 with TrustZone-M, 1.2 MB on-chip SRAM, and dual-band (2.4/5 GHz) Wi-Fi 6 + Bluetooth 5.4 radios - enabling Matter-over-Wi-Fi and Matter-over-Thread operation in smart home gateways and industrial edge nodes.
For engineers reviewing the RW610HN/A2IK datasheet, RW610HN/A2IK pinout, RW610HN/A2IK application, or RW610HN/A2IK equivalent, key selection criteria include its single 3.3 V supply operation, integrated EdgeLock security (PUF, secure boot, PSA L3 certified), Tri-radio concurrency support, and 8 mm × 8 mm 145-pin TFBGA package for space-constrained IoT designs.
Technical Context
The RW610HN/A2IK implements a dedicated Wi-Fi 6 MAC/baseband with 1×1 20 MHz channel support at MCS9, integrated PA/LNA/T/R switch delivering up to +21 dBm TX power, and WPA3 personal/enterprise encryption. Its Bluetooth 5.4 subsystem supports 2 Mbps data rate, long-range mode, and extended advertising - distinct from the RW612's Bluetooth 5.2 + 802.15.4 dual-stack.
Unlike the RW612, the RW610HN/A2IK omits the on-chip 802.15.4 radio and Thread/Zigbee protocol stack, retaining only Wi-Fi 6 and Bluetooth 5.4 connectivity. It shares the same MCU subsystem: 260 MHz Cortex-M33, 1.2 MB SRAM, Quad FlexSPI with on-the-fly decryption, and IEEE 1588-capable RMII/Fast Ethernet interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| MCU Core | 260 MHz Arm Cortex-M33 with TrustZone-M for hardware-isolated secure execution |
| Wi-Fi Standard | IEEE 802.11ax (Wi-Fi 6), 1×1, 20 MHz channel, MCS9, dual-band 2.4/5 GHz |
| Bluetooth Version | Bluetooth 5.4 with 2 Mbps high-speed mode and long-range support |
| TX Output Power | +21 dBm (Wi-Fi), +15 dBm (Bluetooth) - enables robust link budget in dense RF environments |
| Security Certification | PSA Level 3, SESIP Level 3, CAVP certified - meets industrial IoT trust requirements |
| Package | 8 mm × 8 mm, 0.5 mm pitch, 145-pin TFBGA - compatible with standard SMT reflow profiles |
| Power Supply | Single 3.3 V external supply - eliminates need for multi-rail PMIC in compact designs |
Pinout & Package
Package: 8 mm × 8 mm, 0.5 mm pitch, 145-pin TFBGA (ball map per NXP document RW61XFS REV 0, Section 5.1). Thermal pad exposed on underside for PCB-level heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO | I/O power supply | 3.3 V tolerant bank powering all digital I/Os including FlexComm, SDIO, RMII |
| VDD_CORE | Core voltage supply | Internally regulated core rail - externally supplied at 3.3 V via integrated buck converter |
| WAKEUP_B | Asynchronous wake-up input | Low-power GPIO capable of waking entire SoC from deep-sleep mode (DSM) |
| SDIO_CLK/SDIO_CMD/SDIO_DATA[0:3] | SDIO 3.0 host interface | Direct connection to external Wi-Fi coexistence module or SD card - supports UHS-I timing |
| RMII_REF_CLK/RMII_RXD0/RMII_TXD | IEEE 1588-capable RMII interface | Enables deterministic Ethernet time synchronization for industrial control and gateway bridging |
Key Features
| Feature | Design Value |
|---|---|
| Matter-ready dual-stack | Native Wi-Fi 6 + Bluetooth 5.4 support enables concurrent Matter Controller and Matter Bridge roles without external protocol translation |
| Secure boot with PUF | Physically unclonable function generates unique device keys at first power-on - prevents firmware cloning and counterfeiting |
| Quad FlexSPI XIP decryption | On-the-fly AES-256 decryption of external flash allows secure execute-in-place - eliminates need for internal code storage expansion |
| Integrated RF front-end | On-die PA, LNA, and T/R switch reduce BOM count by 7 components and improve 2.4/5 GHz antenna matching stability |
| Independent subsystem power domains | Wi-Fi, Bluetooth, and MCU can be powered down individually - enables sub-μA retention current during sensor monitoring |
Applications
| Smart Home Gateway | Industrial Edge Node |
|---|---|
Use Scenario: Local Matter controller aggregating Wi-Fi, Thread, and Bluetooth LE devices in residential automation systems. IC Role / Device Role / Timing Role: Primary application processor and secure radio coordinator - manages concurrent Wi-Fi 6 AP/client and Bluetooth 5.4 peripheral roles. Use Value: Eliminates need for discrete Wi-Fi + BLE + MCU combo; single-chip solution reduces latency between local control decisions and actuator response. | Use Scenario: Wireless PLC companion module performing real-time diagnostics and over-the-air firmware updates in factory-floor machinery. IC Role / Device Role / Timing Role: Secure edge runtime host - executes deterministic control logic while maintaining encrypted OTA update channel via Wi-Fi 6. Use Value: PSA L3-certified secure boot ensures firmware integrity; +21 dBm Wi-Fi output sustains reliable link through metal enclosures and EMI noise. |
| Healthcare Sensor Hub | EV Charging Station Controller |
Use Scenario: Portable medical device hub collecting Bluetooth LE vitals data (ECG, SpO₂) and relaying via Wi-Fi 6 to cloud HIPAA-compliant backend. IC Role / Device Role / Timing Role: Dual-radio concentrator with hardware-accelerated TLS 1.3 - handles simultaneous BLE GATT reads and Wi-Fi HTTPS uploads. Use Value: On-die cryptography engine offloads 100% of AES-256/GCM and ECDSA signing - preserves Cortex-M33 cycles for clinical algorithm processing. | Use Scenario: DIN-rail mounted EVSE controller managing OCPP 2.0 communication, load balancing, and user authentication via QR-scanned Bluetooth LE. IC Role / Device Role / Timing Role: Secure connectivity SoC - hosts web UI, enforces PKI-based client certificate validation, and bridges Wi-Fi 6 LAN to Bluetooth LE commissioning interface. Use Value: EdgeLock-assured secure debug disabled post-deployment prevents physical tampering; single 3.3 V supply simplifies power design in constrained enclosure space. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RW612HN/A2IK | Includes integrated 802.15.4 radio and Thread/Zigbee stack; Bluetooth 5.2 (not 5.4); larger 151-pin WLCSP option available | Required for full Matter Border Router functionality with native Thread backhaul | Select RW612HN/A2IK when Thread mesh networking and Zigbee interoperability are mandatory |
| ESP32-H2 | Supports IEEE 802.15.4 + Bluetooth 5.0 LE only; no Wi-Fi; RISC-V core; 384 KB SRAM; lacks PSA L3 certification | Suitable for cost-sensitive, low-throughput sensor nodes where Wi-Fi is unnecessary | Choose ESP32-H2 only for Bluetooth + 802.15.4-only use cases without Matter-over-Wi-Fi or enterprise-grade security |
Compared with RW612HN/A2IK, the RW610HN/A2IK trades Thread capability for Bluetooth 5.4 enhancements and tighter integration in TFBGA packaging; versus ESP32-H2, it delivers Wi-Fi 6 throughput, PSA L3 assurance, and deterministic real-time performance - making RW610HN/A2IK optimal for Matter-enabled gateways requiring both local control and cloud sync.
Availability
RW610HN/A2IK is available at Aetrix Electronics and suitable for smart home gateways, industrial edge controllers, healthcare sensor hubs, and EV charging station management systems requiring stable component supply across multi-year production cycles.
Supply support for RW610HN/A2IK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The RW610HN/A2IK belongs to NXP's RW61x wireless MCU family, engineered specifically to deliver Matter-certified, low-power, tri-radio–capable (Wi-Fi 6 + Bluetooth 5.4) edge intelligence for next-generation smart infrastructure.
FAQ
What is the primary radio configuration supported by the RW610HN/A2IK?
The RW610HN/A2IK integrates a dual-radio architecture: IEEE 802.11ax (Wi-Fi 6) operating in 2.4 GHz and 5 GHz bands with 1×1 MIMO and MCS9 support, plus Bluetooth 5.4 with 2 Mbps high-speed mode and long-range extensions. It does not include an 802.15.4 radio - unlike the RW612HN/A2IK. This configuration makes RW610HN/A2IK ideal for Matter-over-Wi-Fi and Matter-over-Bluetooth applications requiring high-throughput local control.
Does the RW610HN/A2IK support Matter certification out of the box?
Yes, the RW610HN/A2IK supports Matter 1.3 protocol stack execution via NXP's MCUXpresso SDK and Zephyr middleware. Its Wi-Fi 6 and Bluetooth 5.4 radios meet Matter's transport layer requirements, and EdgeLock security fulfills the mandatory PSA Level 3 certification for Matter device attestation. Full Matter Controller and Bridge functionality is enabled in the reference firmware shipped with RW610HN/A2IK evaluation kits.
What package options are available for the RW610HN/A2IK?
The RW610HN/A2IK is offered exclusively in an 8 mm × 8 mm, 0.5 mm pitch, 145-ball TFBGA package (part number suffix "HN"). This package features an exposed thermal pad and is qualified for industrial temperature range (−40°C to +85°C). Unlike the RW612, the RW610HN/A2IK does not have HVQFN or WLCSP variants - the TFBGA is the sole production package for this variant.
How does the RW610HN/A2IK handle secure firmware updates?
The RW610HN/A2IK performs authenticated and encrypted firmware updates using EdgeLock's secure update framework. Updates are verified via ECDSA signatures against keys stored in PUF-protected secure memory, decrypted using on-die AES-256 engines, and applied only after successful hash validation. The RW610HN/A2IK supports both differential and full-image OTA updates over Wi-Fi 6 or Bluetooth 5.4 - with rollback protection and atomic write enforcement to prevent bricking.
Can the RW610HN/A2IK operate from a single 3.3 V supply?
Yes, the RW610HN/A2IK is designed for single-rail operation: all I/O banks, core logic, and integrated RF subsystems are powered from one external 3.3 V supply. Internal buck regulators and LDOs generate required sub-voltages (e.g., 1.1 V core, 1.8 V analog), eliminating the need for external PMICs. This simplifies power design and reduces bill-of-materials cost - a key advantage confirmed in RW610HN/A2IK's electrical characteristics table (VDD_IO = VDD_CORE = 3.3 V ± 10%).
RW610HN/A2IK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- -
- RF Family/Standard:
- -
- Protocol:
- -
- Modulation:
- -
- Frequency:
- -
- Data Rate (Max):
- -
- Power - Output:
- -
- Sensitivity:
- -
- Memory Size:
- -
- Serial Interfaces:
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- GPIO:
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- Voltage - Supply:
- -
- Current - Receiving:
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- Current - Transmitting:
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- Operating Temperature:
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- Qualification:
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- Supplier Device Package:
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RW610HN/A2IK FAQ
1.How can I place an order for RW610HN/A2IK through Aetrix?
Please submit a Request for Quotation (RFQ) for RW610HN/A2IK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RW610HN/A2IK reliable?
The price and inventory of RW610HN/A2IK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RW610HN/A2IK is usually 5 days.
3.What payment methods are accepted for RW610HN/A2IK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RW610HN/A2IK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RW610HN/A2IK?
RW610HN/A2IK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RW610HN/A2IK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RW610HN/A2IK?
For technical support, including RW610HN/A2IK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RW610HN/A2IK requirements.
6.How does Aetrix verify that RW610HN/A2IK is sourced from the original manufacturer or authorized distributors?
All RW610HN/A2IK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RW610HN/A2IK meets industry standards.
7.What is the process for return or replacement of RW610HN/A2IK?
All RW610HN/A2IK units undergo pre-shipment inspection (PSI). If there is an issue with RW610HN/A2IK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RW610HN/A2IK part is unused and in its original packaging.
Return procedure for RW610HN/A2IK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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