Infineon Technologies S25FL032P0XMFB013
- Part No.:
- S25FL032P0XMFB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FL032P0XMFB013.pdf
- Description:
- IC FLASH 32MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,051
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL032P0XMFB013 from Cypress Semiconductor is a 32-Mbit, single-power-supply SPI Flash memory operating from 2.7 V to 3.6 V, featuring uniform 64-KB sectors, 4-KB/8-KB sub-sectors, 256-byte page programming, and Quad I/O read speeds up to 40 MB/s. It supports accelerated programming via W#/ACC pin, OTP area (16 bytes + 490 bytes), and CFI compliance for host system auto-configuration in embedded boot code storage.
For engineers reviewing the S25FL032P0XMFB013 datasheet, S25FL032P0XMFB013 pinout, S25FL032P0XMFB013 application, or S25FL032P0XMFB013 equivalent, key selection criteria include sector/sub-sector erase granularity, 100,000-cycle endurance, 20-year data retention, Deep Power-Down (3 µA), and compatibility with legacy S25FL032A designs.
Technical Context
The S25FL032P implements a serial peripheral interface with five extended command sets: Dual Output Read (DOR), Quad Output Read (QOR), Dual I/O High Performance Read (DIOR), Quad I/O High Performance Read (QIOR), and Quad Page Programming (QPP). All modes use SI, SO, W#/ACC, and HOLD# as bidirectional I/O pins under clock control.
Internally, it uses 0.09 µm MirrorBit® process technology, integrates SRAM-based program buffers, and employs on-chip charge pumps for internal high-voltage generation during write/erase - eliminating need for external VPP. Memory protection is enforced via Status Register BP2–BP0 bits and W#/ACC pin assertion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (4 MB) organized as 64 × 64-KB sectors |
| Supply Voltage | 2.7 V to 3.6 V - enables direct integration with 3.3-V logic without level shifters |
| Read Speed | QUAD I/O FAST_READ: 80 MHz clock rate or 40 MB/s effective throughput |
| Page Program Time | 1.5 ms typical for 1–256 bytes - supports fast firmware patching |
| Erase Granularity | 64-KB sector, 4-KB sub-sector (P4E), or 8-KB sub-sector (P8E) - enables fine-grained update of configuration data |
| Endurance & Retention | 100,000 program/erase cycles per sector; 20 years data retention at +85°C |
| Power Modes | Standby: 80 µA typical; Deep Power-Down: 3 µA typical - critical for battery-backed systems |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm), 6 × 4 pin configuration (FAC024 footprint), lead-free, low-halogen.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI transaction; required falling edge after power-up before command acceptance |
| SCK | Serial Clock | Input timing reference; commands/addresses latched on rising edge, SO output triggered on falling edge |
| SI/IO0 | Serial Input / I/O0 | Primary input for commands/addresses/data; becomes bidirectional in Dual/Quad I/O modes |
| SO/IO1 | Serial Output / I/O1 | Primary output for read data; becomes bidirectional in Dual/Quad I/O and QPP modes |
| HOLD#/IO3 | Hold Control / I/O3 | Pauses ongoing SPI transfer without deselecting device; functions as I/O3 in Quad I/O mode |
| W#/ACC/IO2 | Write Protect / Acceleration / I/O2 | Enables hardware write protection when low; supplies 9-V acceleration voltage when driven high; acts as I/O2 in Quad modes |
| VCC | Power Supply | Single 2.7–3.6 V supply powers all operations including internal charge pump for erase/program |
| GND | Ground | Reference for all signals and internal voltage regulation |
Key Features
| Feature | Design Value |
|---|---|
| Quad I/O High Performance Read (QIOR) | 40 MB/s effective bandwidth using four I/O lines - doubles throughput vs standard SPI reads |
| Sub-sector Erase (P4E/P8E) | Enables erasing only 4-KB or 8-KB blocks - preserves adjacent firmware/config data during partial updates |
| One-Time Programmable Area | 16-byte factory- or user-programmable secure ID + 490-byte general-purpose OTP - supports device binding and calibration storage |
| Common Flash Interface (CFI) | Allows host bootloader to auto-detect geometry, command set, and timing - eliminates hard-coded flash drivers |
| Accelerated Programming Mode | 1.5 ms page program time achieved by applying 9 V to W#/ACC pin - reduces firmware update latency |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Code |
|---|---|
Use Scenario: Storing firmware images and field-upgradeable logic in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Non-volatile boot memory holding FPGA configuration bitstreams and real-time OS kernels. Use Value: Sub-sector erase allows updating safety-critical control algorithms without disturbing I/O mapping tables stored in adjacent sectors. | Use Scenario: Holding primary boot loader and secure boot keys in automotive head units operating from –40°C to +105°C. IC Role / Device Role / Timing Role: SPI-connected trusted execution environment (TEE) root-of-trust storage. Use Value: OTP area stores immutable cryptographic keys; CFI compliance enables dynamic driver initialization across multiple vehicle platforms. |
| Medical Diagnostic Imaging Buffer | Networking Equipment Configuration |
Use Scenario: Caching calibration profiles and sensor compensation tables in portable ultrasound devices requiring long-term data integrity. IC Role / Device Role / Timing Role: Parameter storage with guaranteed 20-year retention and 100K-cycle endurance for recalibration events. Use Value: 4-KB sub-sector erase isolates calibration updates from diagnostic image metadata, minimizing wear on critical sectors. | Use Scenario: Storing switch/router configuration files, MAC address tables, and firmware patches in enterprise Ethernet switches. IC Role / Device Role / Timing Role: SPI flash used for persistent configuration storage with fast read access during boot and runtime reconfiguration. Use Value: QUAD I/O read speed (40 MB/s) enables full config reload in <50 ms - meeting carrier-grade failover timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064L | 64-Mbit density; same 2.7–3.6 V supply; improved 133-MHz Quad I/O read; newer 45-nm process | Direct migration path recommended by Cypress for new designs; supports larger firmware images | Select when >32 Mbit capacity or higher read bandwidth is required; pin-compatible with most S25FL032P packages |
| MX25L3233F | 32-Mbit density; 2.3–3.6 V supply; 104-MHz Quad I/O; no OTP area; different status register layout | Lacks OTP and CFI support; requires modified driver for block protection and identification | Choose for cost-sensitive industrial applications where OTP and auto-configuration are not needed |
Compared with S25FL032P0XMFB013, S25FL064L offers double capacity and faster read performance while maintaining compatibility, whereas MX25L3233F trades OTP/CFI features for lower unit cost and broader voltage tolerance - both require validation of erase timing and status register behavior in existing firmware.
Availability
S25FL032P0XMFB013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot code, and medical diagnostic imaging buffer applications requiring stable component supply despite end-of-life status.
Supply support for S25FL032P0XMFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability non-volatile memory and microcontroller solutions for industrial, automotive, and communications markets.
The S25FL family delivers SPI Flash memory optimized for embedded boot code, firmware storage, and configuration data - emphasizing sector flexibility, low-power operation, and system-level interoperability via CFI.
FAQ
Is S25FL032P0XMFB013 still in production?
No - Cypress officially retired the S25FL032P family and does not recommend it for new designs. However, Aetrix Electronics maintains limited legacy inventory with full traceability and provides lifecycle coordination support for ongoing production programs that depend on this specific variant.
What package type does S25FL032P0XMFB013 use?
S25FL032P0XMFB013 uses a 24-ball BGA package (6 × 8 mm) with 6 × 4 pin configuration (FAC024), lead-free and low-halogen compliant. This matches the "F" (lead-free) and "B" (BGA) codes in the part number suffix.
Can S25FL032P0XMFB013 be used as a drop-in replacement for S25FL032A?
Yes - the S25FL032P is fully backward compatible with S25FL032A in pinout, command set, and electrical characteristics. It adds enhanced features (Quad I/O, sub-sector erase, OTP) but retains identical timing and protocol behavior for legacy commands.
Does S25FL032P0XMFB013 support Quad SPI mode without hardware modification?
Yes - Quad SPI operation is enabled via standard SPI commands (e.g., QIOR, QPP) and requires no PCB changes beyond ensuring HOLD# and W#/ACC pins are routed as I/Os. The device automatically configures internal I/O drivers when these commands are issued.
S25FL032P0XMFB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FL032P0XMFB013 FAQ
1.How can I place an order for S25FL032P0XMFB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL032P0XMFB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL032P0XMFB013 reliable?
The price and inventory of S25FL032P0XMFB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL032P0XMFB013 is usually 5 days.
3.What payment methods are accepted for S25FL032P0XMFB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL032P0XMFB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL032P0XMFB013?
S25FL032P0XMFB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL032P0XMFB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL032P0XMFB013?
For technical support, including S25FL032P0XMFB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL032P0XMFB013 requirements.
6.How does Aetrix verify that S25FL032P0XMFB013 is sourced from the original manufacturer or authorized distributors?
All S25FL032P0XMFB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL032P0XMFB013 meets industry standards.
7.What is the process for return or replacement of S25FL032P0XMFB013?
All S25FL032P0XMFB013 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL032P0XMFB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL032P0XMFB013 part is unused and in its original packaging.
Return procedure for S25FL032P0XMFB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL032P0XMFB013 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
