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Infineon Technologies S25FL064LABBHN023
- Part No.:
- S25FL064LABBHN023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL064LABBHN023.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,206
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Product details
Overview
S25FL064LABBHN023 from Infineon is a 64 Mb (8 MB) serial NOR flash memory using 65-nm floating gate technology, operating from 2.7 V to 3.6 V with industrial temperature range (–40°C to +85°C). It supports SPI multi-I/O modes (SIO/DIO/QIO/QPI), DDR read commands, and offers uniform 4 KB/32 KB/64 KB erase sectors. Used for XIP code execution and firmware storage in space-constrained embedded systems.
For engineers reviewing the S25FL064LABBHN023 datasheet, S25FL064LABBHN023 pinout, S25FL064LABBHN023 application, or S25FL064LABBHN023 equivalent, key selection factors include Quad I/O read bandwidth (54 MBps), 100,000 program-erase cycles, SFDP support, security region protection, and WSON 5 × 6 mm package compatibility.
Technical Context
The device implements a serial peripheral interface with configurable clock polarity/phase (modes 0 and 3), supporting both standard and DDR command protocols. Its architecture includes a 256-byte page programming buffer, suspend/resume capability for program and erase operations, and extended addressing (24-/32-bit) for seamless migration from legacy SPI flash families.
Security is enforced via four dedicated 256-byte Security Regions outside the main array, with non-volatile pointer region control, volatile individual sector lock, and power supply lock-down or password-based protection for Regions 2/3 - enabling secure boot and firmware update partitioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (8 MB) - sufficient for full firmware images and parameter tables in microcontroller-based edge devices. |
| Interface Protocol | SPI multi-I/O with QPI and DDR support - enables high-speed instruction fetch without parallel bus routing. |
| Max Read Rate | 54 MBps (Quad I/O, 108 MHz SDR or DDR Quad Read at 54 MHz) - matches asynchronous NOR performance with 4-pin interface. |
| Erase Granularity | Uniform 4 KB / 32 KB / 64 KB sectors - allows fine-grained firmware updates without erasing entire application space. |
| Endurance & Retention | 100,000 program-erase cycles, 20-year data retention - validated for long-life industrial deployments. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic domains and brown-out tolerant operation. |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified for factory automation, networking, and medical equipment environments. |
Pinout & Package
Package: WSON 5 × 6 mm (WND008), 8-lead, Pb-free, moisture-sensitive level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; required for all transactions including status polling and reset. |
| SCK | Serial Clock | Input clock synchronized to host controller; supports up to 108 MHz SDR or 54 MHz DDR operation. |
| IO0 (SI) | Serial Input / IO0 | Primary data input in SIO mode; bidirectional in DIO/QIO/QPI for multiplexed address/data transfer. |
| IO1 (SO) | Serial Output / IO1 | Primary data output in SIO mode; bidirectional in DIO/QIO/QPI; supports dual-edge sampling in DDR reads. |
| IO2 (WP#) | Write Protect / IO2 | Hardware write protection when asserted low; also functions as second I/O line in multi-I/O modes. |
| IO3 (RESET#) | Reset / IO3 | Hardware reset input; doubles as fourth I/O line in QIO/QPI; enables cold restart without power cycle. |
| VCC | Power Supply | Single 2.7–3.6 V supply; powers core logic and I/O buffers; decoupling capacitor required per datasheet layout guidelines. |
| VSS | Ground | Signal and power reference plane; must be connected to low-impedance PCB ground plane for noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces command overhead by encoding multiple instructions per clock cycle, improving effective throughput in XIP applications. |
| Serial Flash Discoverable Parameters (SFDP) | Enables automatic configuration of read latency, timing parameters, and feature sets by host bootloader without hard-coded initialization. |
| Program/Erase Suspend & Resume | Allows background interrupt servicing during long-duration flash operations - critical for real-time OS task scheduling. |
| Four Dedicated Security Regions | Isolates boot code, keys, and configuration data from main array; supports independent lock-down via password or permanent fuse. |
| Uniform Erase Architecture | Eliminates need for complex wear-leveling algorithms in firmware; simplifies partition management for OTA update schemes. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing ladder logic, configuration profiles, and calibration data in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP support and hardware write protection against accidental overwrite. Use Value: Enables secure, field-deployable firmware updates without requiring external programming hardware or system downtime. | Use Scenario: Holding boot loader and safety-critical sensor fusion firmware in radar or camera ECU modules compliant with ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: Trusted boot source with Security Regions protecting cryptographic keys and integrity-checked image headers. Use Value: Meets AEC-Q100 grade 2 requirements and supports secure boot chain verification prior to MCU initialization. |
| Medical Imaging Device Parameter Tables | Network Router Configuration Storage |
Use Scenario: Retaining modality-specific calibration coefficients, user presets, and DICOM metadata across power cycles in portable ultrasound units. IC Role / Device Role / Timing Role: High-reliability parameter storage with 20-year data retention and 100K endurance for frequent recalibration events. Use Value: Eliminates battery-backed SRAM dependency while maintaining regulatory compliance for Class II medical devices. | Use Scenario: Storing routing tables, VLAN configurations, and TLS certificates in enterprise-grade Layer 3 switches with zero-touch provisioning. IC Role / Device Role / Timing Role: Secure, fast-access configuration store supporting encrypted firmware signature verification and rollback protection. Use Value: Accelerates boot time via Quad I/O XIP and prevents unauthorized config tampering using individual sector lock and SFDP-managed protection bits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064LAFMFI00 | Same die, SOIC-16 package (300 mil); higher pin count, larger footprint, no thermal pad. | Preferred where board rework or socket-based prototyping is needed; less suitable for high-density layouts. | Select for legacy board compatibility or manual soldering workflows where WSON thermal management is impractical. |
| MX25L6433FZNI-10G | Micron-compatible pinout; lacks DDR read support and Security Regions; 65 nm but no QPI mode. | Lower security assurance; limited to basic firmware storage where cryptographic isolation is not required. | Choose only if cost sensitivity outweighs security and performance needs; verify SFDP register mapping differs. |
Compared with S25FL064LABBHN023, the SOIC variant trades compactness for assembly flexibility, while the Micron alternative sacrifices DDR bandwidth and hardware security for lower unit cost - making the WSON version optimal for secure, space-constrained embedded designs demanding verified boot and fast XIP.
Availability
S25FL064LABBHN023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging device parameter tables requiring stable component supply and long-term lifecycle support.
Supply support for S25FL064LABBHN023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FL-L family targets high-performance, secure embedded storage - designed specifically for code execution, firmware updates, and trusted boot in resource-constrained systems with stringent reliability requirements.
FAQ
What is the maximum clock frequency supported in Quad I/O mode?
The S25FL064LABBHN023 supports up to 108 MHz in Quad I/O SDR mode, delivering 54 MBps read bandwidth. In DDR Quad I/O mode, it operates at up to 54 MHz with dual-edge sampling, achieving the same 54 MBps throughput while reducing clock frequency-related EMI and timing closure challenges on the host interface.
Does this part support execute-in-place (XIP) operation?
Yes, the S25FL064LABBHN023 supports XIP via continuous read mode and burst wrap addressing in Fast Read, Dual I/O, Quad I/O, and QPI command sets. Host MCUs can directly fetch instructions from flash without copying to RAM, reducing boot latency and SRAM usage - confirmed in Section 8.4 of the official datasheet.
How are the Security Regions protected from unauthorized access?
Security Regions 2 and 3 support three protection levels: volatile lock via Status Register bits, non-volatile lock via Pointer Region configuration, or permanent lock-down using power supply voltage threshold detection and optional password entry. Protection is enforced independently of main array writes and survives power cycles unless explicitly unlocked via valid credentials.
Is the WSON 5 × 6 mm package RoHS and REACH compliant?
Yes, the S25FL064LABBHN023 uses a Pb-free WSON package fully compliant with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Material declarations and test reports are available through Infineon's official product change notifications and environmental compliance portal.
S25FL064LABBHN023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL064LABBHN023 FAQ
1.How can I place an order for S25FL064LABBHN023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064LABBHN023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064LABBHN023 reliable?
The price and inventory of S25FL064LABBHN023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064LABBHN023 is usually 5 days.
3.What payment methods are accepted for S25FL064LABBHN023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL064LABBHN023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL064LABBHN023?
S25FL064LABBHN023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL064LABBHN023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064LABBHN023?
For technical support, including S25FL064LABBHN023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064LABBHN023 requirements.
6.How does Aetrix verify that S25FL064LABBHN023 is sourced from the original manufacturer or authorized distributors?
All S25FL064LABBHN023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064LABBHN023 meets industry standards.
7.What is the process for return or replacement of S25FL064LABBHN023?
All S25FL064LABBHN023 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064LABBHN023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064LABBHN023 part is unused and in its original packaging.
Return procedure for S25FL064LABBHN023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL064LABBHN023 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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