My Inquiry
My Account
Infineon Technologies S25FL064LABBHN033
- Part No.:
- S25FL064LABBHN033
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL064LABBHN033.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,972
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL064LABBHN033 from Infineon is a 64 Mb (8 MB) serial NOR flash memory using 65-nm floating gate technology, supporting SPI multi-I/O (SIO/DIO/QIO/QPI) and DDR read modes. It operates from 2.7 V to 3.6 V, features uniform 4 KB sector erase, 100,000 program-erase cycles, and 20-year data retention, and is packaged in an 8-lead SOIC 208 mil (SOC008) for industrial-grade (–40°C to +85°C) embedded code storage and XIP execution.
For engineers reviewing the S25FL064LABBHN033 datasheet, S25FL064LABBHN033 pinout, S25FL064LABBHN033 application, or S25FL064LABBHN033 equivalent, this device delivers Quad I/O read throughput up to 54 MBps at 108 MHz, supports SFDP configuration, and enables secure reprogrammable data storage with four dedicated 256-byte Security Regions.
Technical Context
The S25FL064LABBHN033 implements a serial peripheral interface with configurable clock polarity/phase (modes 0 and 3), full command compatibility with legacy S25FL-A/S25FL1-K families, and extended addressing (24-/32-bit). Its architecture includes a 256-byte page programming buffer and supports suspend/resume for both program and erase operations.
It integrates dual-mode security: volatile individual block lock and non-volatile pointer region control, with Power Supply Lock-down, password, or permanent protection options for Security Regions 2/3 and the pointer region. The device uses CMOS I/O and supports Deep Power Down mode drawing only 2 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (8 MB) - sufficient for boot code, firmware images, and parameter tables in space-constrained embedded systems |
| Interface | SPI multi-I/O with QPI and DDR support - reduces pin count vs parallel NOR while matching its bandwidth |
| Max Read Rate | 54 MBps (Quad I/O, 108 MHz SDR) - enables fast code shadowing and real-time XIP execution |
| Erase Granularity | Uniform 4 KB sectors - allows fine-grained firmware updates without disturbing adjacent code/data |
| Endurance & Retention | 100,000 cycles / 20 years - validated for long-life industrial deployments with frequent field updates |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of supply variation |
| Operating Temp | –40°C to +85°C (Industrial grade) - qualified for use in uncontrolled ambient environments |
Pinout & Package
Package: 8-lead SOIC 208 mil (SOC008), Pb-free, surface-mountable with standard reflow profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before each instruction cycle |
| SO / IO1 | Serial Output / I/O Line 1 | Primary output during SIO reads; bidirectional in DIO/QIO modes for data transfer |
| WP# / IO2 | Write Protect / I/O Line 2 | Hardware write lock when low; functions as IO2 in multi-I/O commands |
| RESET# | Reset Input | Asynchronous hardware reset; returns device to known state and exits Deep Power Down |
| VCC | Power Supply | Single 2.7–3.6 V supply powering core and I/O circuits |
| VSS | Ground | Reference return path for all signals and power; requires low-impedance PCB connection |
| SI / IO0 | Serial Input / I/O Line 0 | Command/address input in SIO; bidirectional in multi-I/O for full-duplex communication |
| SCK | Serial Clock | Master-generated clock synchronizing all SPI transfers; supports up to 108 MHz (SDR) or 54 MHz (DDR) |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Reduces instruction overhead by enabling 4-bit command/address/data transfers per clock edge |
| Serial Flash Discoverable Parameters (SFDP) | Enables automatic host configuration via JEDEC JESD216B-compliant register map |
| Security Regions (4 × 256 B) | Isolated non-volatile storage for keys, certificates, or calibration data outside main array |
| Erase Suspend/Resume | Allows background interrupt handling during long 64 KB block erases without data corruption |
| Deep Power Down Mode | Reduces standby current to 2 µA - critical for battery-backed or energy-harvesting systems |
Applications
| Automotive Instrument Clusters | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated display assets, boot firmware, and over-the-air update images in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile code and graphics storage with XIP capability and AEC-Q100 Grade 2 qualification. Use Value: Enables deterministic boot timing and secure firmware rollback via 4 KB sector erase granularity. | Use Scenario: Holding ladder logic programs, configuration databases, and safety-critical firmware in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability flash memory supporting 100,000+ field updates across 20-year product lifecycle. Use Value: Uniform 4 KB sector erase prevents corruption during partial firmware patches in mission-critical automation. |
| Medical Diagnostic Imaging Boot | Edge AI Sensor Node Code Storage |
Use Scenario: Hosting boot loader, FPGA configuration bitstreams, and DICOM protocol stacks in portable ultrasound units. IC Role / Device Role / Timing Role: Low-power, high-integrity flash with Deep Power Down and Security Regions for HIPAA-compliant data isolation. Use Value: 2 µA deep sleep current extends battery life; isolated Security Regions store encryption keys separately from application code. | Use Scenario: Storing inference models, sensor fusion algorithms, and OTA update payloads in battery-powered environmental monitors. IC Role / Device Role / Timing Role: SPI multi-I/O flash enabling rapid model loading into RAM for low-latency edge inference. Use Value: 54 MBps Quad I/O read rate minimizes CPU wait states during model reload, improving duty-cycle efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064LADNFI000 | Same die, 16-lead SOIC 300 mil package - larger footprint, higher thermal mass | Preferred where board-level rework tolerance or thermal cycling robustness is prioritized over size | Select when mechanical reliability under thermal stress outweighs PCB area constraints |
| MX25L6433FZNI-10G | 64 Mb Macronix part; supports only SIO/DIO/QIO (no QPI or DDR); 100 MHz max clock | Lacks QPI/DDR modes and SFDP v1.6 compliance; lower max read bandwidth (40 MBps) | Choose only if QPI/DDR features are unused and cost sensitivity exceeds performance requirements |
Compared with S25FL064LADNFI000, the S25FL064LABBHN033 saves board space with its 8-lead SOIC but offers identical electrical and functional behavior; versus MX25L6433FZNI-10G, it provides higher bandwidth, broader command compatibility, and enhanced security architecture for demanding embedded systems.
Availability
S25FL064LABBHN033 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical diagnostic imaging boot requiring stable component supply across extended product lifecycles.
Supply support for S25FL064LABBHN033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q standards.
The FL-L family targets high-performance, secure embedded storage-designed specifically for code execution (XIP), firmware updates, and trusted data retention in automotive, industrial, and medical systems requiring AEC-Q100 or industrial temperature grading.
FAQ
Does S25FL064LABBHN033 support execute-in-place (XIP) operation?
Yes, it supports continuous read mode for XIP operation, allowing the host processor to execute code directly from flash without prior copying to RAM. This is enabled via Fast Read, Dual I/O, Quad I/O, or QPI commands with burst wrap addressing, reducing system memory footprint and boot latency.
What security mechanisms protect firmware integrity on this device?
The device implements layered security: Status/Configuration Register protection, four dedicated 256-byte Security Regions outside the main array, volatile individual block lock, non-volatile pointer region control, and Power Supply Lock-down with optional password or permanent protection for critical regions.
Can S25FL064LABBHN033 replace older S25FL-A series devices without hardware changes?
Yes, it maintains pin-to-pin and command-set compatibility with S25FL-A, S25FL1-K, S25FL-P, S25FL-S, and S25FS-S families. No PCB or firmware modifications are required-only updated initialization sequences may leverage new features like QPI or DDR.
What is the minimum supported clock frequency for reliable Quad I/O operation?
The device guarantees Quad I/O functionality down to 1 MHz clock frequency in standard temperature range. Timing parameters remain valid across the full 1 MHz–108 MHz range, enabling flexible host controller clocking and low-power active modes.
S25FL064LABBHN033 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL064LABBHN033 FAQ
1.How can I place an order for S25FL064LABBHN033 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064LABBHN033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064LABBHN033 reliable?
The price and inventory of S25FL064LABBHN033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064LABBHN033 is usually 5 days.
3.What payment methods are accepted for S25FL064LABBHN033?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL064LABBHN033 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL064LABBHN033?
S25FL064LABBHN033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL064LABBHN033 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064LABBHN033?
For technical support, including S25FL064LABBHN033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064LABBHN033 requirements.
6.How does Aetrix verify that S25FL064LABBHN033 is sourced from the original manufacturer or authorized distributors?
All S25FL064LABBHN033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064LABBHN033 meets industry standards.
7.What is the process for return or replacement of S25FL064LABBHN033?
All S25FL064LABBHN033 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064LABBHN033, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064LABBHN033 part is unused and in its original packaging.
Return procedure for S25FL064LABBHN033:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL064LABBHN033 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
