My Inquiry
My Account
Infineon Technologies S25FL064LABMFI010
- Part No.:
- S25FL064LABMFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FL064LABMFI010.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,646
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL064LABMFI010 from Infineon is a 64 Mb (8 MB) serial NOR flash memory using 65-nm floating gate technology, operating from 2.7 V to 3.6 V, with industrial temperature range (–40°C to +85°C), supporting SPI single/dual/quad I/O and QPI/DDR read modes up to 108 MHz, and enabling XIP and code shadowing in embedded microcontroller systems.
For engineers reviewing the S25FL064LABMFI010 datasheet, S25FL064LABMFI010 pinout, S25FL064LABMFI010 application, or S25FL064LABMFI010 equivalent, this device delivers verified quad-I/O read throughput of 54 MBps, 100,000 program-erase cycles, uniform 4 KB sector erase, SFDP-compliant configuration, and hardware-based security regions for firmware integrity in resource-constrained designs.
Technical Context
The S25FL064LABMFI010 implements a serial peripheral interface with configurable clock polarity/phase (modes 0 and 3), supports both SDR and DDR command execution on Quad I/O and QPI buses, and uses Serial Flash Discoverable Parameters (SFDP) for automatic host configuration. Its architecture includes a 256-byte page programming buffer and suspend/resume capability for both program and erase operations.
It features uniform erase granularity across 4 KB sectors, 32 KB half-blocks, and 64 KB blocks, plus chip-erase, all with guaranteed 100,000 endurance cycles and 20-year data retention. Security is enforced via four dedicated 256-byte non-volatile Security Regions, individual block lock, pointer region control, and power-supply lock-down protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (8 MB) - sufficient for full MCU boot images and firmware binaries in space-constrained edge devices |
| Interface | SPI multi-I/O with QPI and DDR support - enables high-speed instruction fetch without parallel bus routing |
| Max Read Rate | 54 MBps (Quad I/O SDR @ 108 MHz) - matches asynchronous NOR performance with 4-pin reduction vs. parallel interface |
| Erase Granularity | Uniform 4 KB sectors - allows fine-grained firmware updates without disturbing adjacent application code |
| Endurance & Retention | 100,000 program-erase cycles / 20-year data retention - validated for long-life industrial deployments |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and brown-out tolerant operation |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified for factory automation, HMI, and network infrastructure equipment |
Pinout & Package
Package: 8-lead SOIC 208 mil (SOC008), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before each transaction |
| SCK | Serial Clock | Provides timing reference for all SPI transfers; supports up to 108 MHz SDR or 54 MHz DDR |
| IO0 (SI) | Serial Input / Data Line 0 | Primary input for commands and addresses in SIO mode; bidirectional in multi-I/O modes |
| IO1 (SO) | Serial Output / Data Line 1 | Primary output for read data in SIO mode; bidirectional in dual/quad I/O configurations |
| IO2 (WP#) | Write Protect / Data Line 2 | Hardware write-protection enable when low; also serves as second I/O line in dual/quad modes |
| IO3 (RESET#) | Reset / Data Line 3 | Resets internal state when pulsed low; doubles as fourth I/O line in quad/QPI operation |
| VCC | Power Supply | Single 2.7–3.6 V supply powering core and I/O circuits; no separate VIO required |
| VSS | Ground | Common reference for all signals and internal circuitry; requires low-impedance PCB connection |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Enables 4-bit-wide command/address/data transfer, reducing instruction latency by ~75% vs. SIO at same clock rate |
| Serial Flash Discoverable Parameters (SFDP) | Allows automatic host detection of supported commands, timing parameters, and erase block layout without hard-coded drivers |
| Program/Erase Suspend & Resume | Permits background interrupt handling during long flash operations-critical for real-time OS task scheduling |
| Four 256-byte Security Regions | Isolate bootloader keys, calibration data, or cryptographic seeds outside main array with independent lock controls |
| Uniform 4 KB Sector Erase | Supports atomic firmware patching without erasing entire application image-reduces update time and wear leveling overhead |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing boot firmware and configuration tables in programmable logic controllers with strict uptime requirements. IC Role / Device Role / Timing Role: Non-volatile code storage and XIP execution source for ARM Cortex-M7-based control CPUs. Use Value: 4 KB uniform erase enables field-upgradable safety-critical firmware patches without full reflash; 20-year retention ensures lifecycle alignment with industrial hardware. | Use Scenario: Holding boot code and sensor calibration data for radar/EPS ECUs requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary boot memory mapped into CPU address space for secure cold-start execution. Use Value: Hardware Security Regions protect bootloader signature keys from tampering; industrial-grade temp range covers under-hood thermal profiles. |
| Medical Imaging UI Flash | Smart Meter Firmware Archive |
Use Scenario: Hosting GUI assets, localization strings, and regulatory-compliant diagnostic logs in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability storage for human-interface assets accessed via DMA bursts during display refresh. Use Value: 54 MBps Quad I/O read rate sustains 60 Hz UI rendering; 100K-cycle endurance supports frequent log rotation over 10+ year service life. | Use Scenario: Archiving firmware revisions, tariff tables, and metering history in ANSI C12.22-compliant utility meters. IC Role / Device Role / Timing Role: Field-updatable firmware repository with rollback capability and tamper-evident version tracking. Use Value: Individual sector lock prevents accidental overwrite of certified firmware partitions; deep power-down mode (<2 µA) extends battery life in AMI endpoints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064LAFMFI010 | Same die, 16-lead SOIC 300 mil package - larger footprint, higher thermal mass | Better suited for manual assembly or high-temperature reflow profiles where 8-lead SOIC may lift | Select when board-level reliability under thermal cycling >2000 cycles is prioritized over PCB area |
| MX25L6433FZNI-10G | 64 Mb Macronix part; supports only SDR (no DDR/QPI); 100K cycles but no Security Regions | Lacks hardware security and DDR read acceleration - unsuitable for secure boot or high-throughput XIP | Choose only for cost-sensitive, non-security applications where 13.5 MBps Fast Read suffices |
Compared with S25FL064LABMFI010, the S25FL064LAFMFI010 offers identical functionality in a larger package for enhanced mechanical robustness, while the MX25L6433FZNI-10G trades security and speed for lower unit cost-making it viable only in open-architecture consumer products.
Availability
S25FL064LABMFI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging UI flash requiring stable component supply across multi-year production programs.
Supply support for S25FL064LABMFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT markets.
The FL-L family was designed specifically for high-reliability embedded systems needing fast, secure, and space-efficient code storage with flexible interface options beyond legacy SPI.
FAQ
Does S25FL064LABMFI010 support execute-in-place (XIP) operation?
Yes, the device supports continuous read mode and burst wrap addressing required for XIP. Its Quad I/O and QPI interfaces deliver sustained read bandwidth up to 54 MBps, enabling direct CPU instruction fetch without RAM buffering. The 256-byte page buffer and uniform 4 KB erase also facilitate atomic firmware updates during runtime execution.
What security mechanisms does S25FL064LABMFI010 provide for firmware protection?
It provides four dedicated 256-byte Security Regions outside the main array, each independently lockable via volatile/non-volatile controls. Additional protections include Status/Configuration Register write protection, individual sector/block lock, pointer region for range-based access control, and power-supply lock-down to prevent unauthorized unlock sequences during voltage manipulation attacks.
Can S25FL064LABMFI010 operate at 1.8 V?
No. This variant operates exclusively from 2.7 V to 3.6 V. It is not compatible with 1.8 V I/O systems. For dual-voltage support, Infineon offers the S25FL128S series with 1.65–3.6 V operation-but those parts use different process technology and lack the FL-L family's DDR QPI capability.
Is the SOIC-8 package (SOC008) RoHS-compliant and lead-free?
Yes. The S25FL064LABMFI010 uses a Pb-free SOIC-8 package per JEDEC J-STD-020 and RoHS Directive 2011/65/EU. All solderable terminations are matte tin-plated, and the body material meets halogen-free requirements (≤900 ppm Cl, ≤900 ppm Br, ≤1500 ppm total halogens).
S25FL064LABMFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FL064LABMFI010 FAQ
1.How can I place an order for S25FL064LABMFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064LABMFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064LABMFI010 reliable?
The price and inventory of S25FL064LABMFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064LABMFI010 is usually 5 days.
3.What payment methods are accepted for S25FL064LABMFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL064LABMFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL064LABMFI010?
S25FL064LABMFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL064LABMFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064LABMFI010?
For technical support, including S25FL064LABMFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064LABMFI010 requirements.
6.How does Aetrix verify that S25FL064LABMFI010 is sourced from the original manufacturer or authorized distributors?
All S25FL064LABMFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064LABMFI010 meets industry standards.
7.What is the process for return or replacement of S25FL064LABMFI010?
All S25FL064LABMFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064LABMFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064LABMFI010 part is unused and in its original packaging.
Return procedure for S25FL064LABMFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL064LABMFI010 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
