Infineon Technologies S25FL064LABNFI043
- Part No.:
- S25FL064LABNFI043
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-UDFN Exposed Pad
- Datasheet:
-
S25FL064LABNFI043.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8USON
- Quantity:
- Payment:

- Shipping:

Inventory:29,861
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL064LABNFI043 from Infineon is a 64 Mb (8 MB) serial NOR flash memory IC using 65-nm floating gate technology, operating from 2.7 V to 3.6 V, supporting SPI multi-I/O (SIO/DIO/QIO/QPI), DDR read modes, and uniform 4 KB/32 KB/64 KB erase sectors. It enables XIP execution and code shadowing in space-constrained embedded systems such as industrial controllers and automotive infotainment head units.
For engineers reviewing the S25FL064LABNFI043 datasheet, S25FL064LABNFI043 pinout, S25FL064LABNFI043 application, or S25FL064LABNFI043 equivalent, key selection criteria include Quad I/O read bandwidth (54 MBps), 100,000 program-erase cycles, industrial temperature grade (–40°C to +85°C), SOIC-16 package compatibility, and SFDP-based configuration support.
Technical Context
The S25FL064LABNFI043 implements a serial flash architecture with configurable addressing (24-/32-bit), dual- and quad-data-rate command sets, and programmable security regions outside the main array. Its SPI-MIO interface supports clock polarity modes 0 and 3, and QPI mode eliminates instruction overhead for high-throughput sequential reads.
It integrates dedicated hardware for erase suspend/resume, program suspend/resume, and deep power-down (2 µA), with status/configuration register protection and volatile/non-volatile block locking. The device uses JEDEC JESD216B-compliant SFDP for automatic host initialization and parameter discovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 64 Mb (8 MB) - sufficient for full firmware images and parameter storage in mid-tier microcontrollers |
| Interface type | SPI multi-I/O with QPI support - reduces pin count vs parallel NOR while enabling burst wrap and XIP operation |
| Max read rate | 54 MBps (Quad I/O @ 108 MHz) - matches asynchronous parallel NOR performance with only 6 signal lines |
| Erase granularity | Uniform 4 KB sectors - enables fine-grained firmware update without disturbing adjacent code/data |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial deployments |
| Data retention | 20 years at +85°C - validated for long-life applications including automotive ECUs and medical devices |
| Supply voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and brown-out tolerant designs |
Pinout & Package
Package: 16-lead SOIC 300 mil (SO3016), Pb-free, industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command latching; supports daisy-chain configuration when tied low externally |
| SCK | Serial Clock | Input clock for all SPI operations; supports up to 108 MHz SDR and 54 MHz DDR modes |
| IO0 | Serial Input / Data I/O 0 | Primary data line for SIO mode; becomes bidirectional DQ0 in QIO/QPI modes |
| IO1 | Serial Output / Data I/O 1 | Primary output in SIO; bidirectional DQ1 in multi-I/O modes; used for address/data in QPI |
| IO2 | Write Protect / Data I/O 2 | Hardware write protection input in legacy mode; DQ2 in QIO/QPI; supports volatile lock control |
| IO3 | Reset / Data I/O 3 | Active-low reset input; functions as DQ3 in QIO/QPI; enables hardware reset without host software intervention |
| VCC | Power Supply | Single 2.7–3.6 V supply; decoupling required within 10 mm of pin per layout guidelines |
| VSS | Ground | Signal and power ground reference; must be connected to low-impedance PCB plane |
Key Features
| Feature | Design Value |
|---|---|
| Quad Peripheral Interface (QPI) | Eliminates opcode overhead by using 4-bit wide command/address/data bus, enabling continuous burst reads without repeated instruction framing |
| Serial Flash Discoverable Parameters (SFDP) | JEDEC JESD216B-compliant register map allows automatic host configuration of timing, density, and feature set without hard-coded driver assumptions |
| Security Regions | Four 256-byte non-volatile regions outside main array for storing keys, certificates, or calibration data with independent lock-down and password protection |
| Erase suspend/resume | Allows background erase to be paused during high-priority interrupt service routines, then resumed without data loss or timing penalty |
| Deep power-down mode | 2 µA quiescent current enables battery-backed retention in always-on edge nodes and IoT sensors with multi-year shelf life |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support and sector-level erase for delta updates. Use Value: 4 KB uniform erase enables patch deployment without full reflash; 100K cycle endurance supports >500 firmware revisions over product lifetime. | Use Scenario: Holding boot code and sensor fusion algorithms for camera/radar processing units requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Automotive-grade boot memory with -40°C to +85°C operation and QPI-mode fast boot sequence execution. Use Value: 54 MBps Quad I/O read rate reduces boot time by >40% vs legacy SPI flash; security regions store cryptographic keys isolated from firmware partition. |
| Medical Imaging Device Parameter Storage | Smart Energy Meter Firmware & Calibration |
Use Scenario: Retaining calibration coefficients, user preferences, and diagnostic logs in portable ultrasound equipment. IC Role / Device Role / Timing Role: Re-programmable data storage with individual sector lock to prevent accidental overwrite of critical calibration data. Use Value: Volatile individual block lock allows runtime protection of active calibration sectors; 20-year data retention ensures accuracy across device service life. | Use Scenario: Hosting firmware, tariff tables, and metering history in ANSI C12.22-compliant smart meters deployed in utility grids. IC Role / Device Role / Timing Role: Secure, long-life firmware and data storage with deep power-down for battery backup during AC outage. Use Value: 2 µA deep power-down extends CR2032 backup battery life beyond 10 years; security regions store encryption keys separately from firmware image. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | 128 Mb density, same SOIC-16 package, identical QPI/SFDP features, but rated for industrial plus (–40°C to +105°C) | Required for extended temperature environments like motor drives or outdoor base stations | Select when higher density and wider temperature range are needed without changing board layout |
| MX25L6433FZNI-10G | 64 Mb, SOIC-8 package, no QPI mode, max 104 MHz clock, lacks SFDP and security regions | Suitable for cost-sensitive consumer electronics where security and advanced interface features are not required | Choose only if pin count reduction (SOIC-8) and lower BOM cost outweigh loss of QPI, SFDP, and security functionality |
Compared with S25FL064LABNFI043, the S25FL128SAGMFI000 offers double density and extended temperature tolerance at identical footprint and feature set, while the MX25L6433FZNI-10G sacrifices QPI, SFDP, and security for lower cost and smaller package-making it viable only in non-critical, non-automotive applications.
Availability
S25FL064LABNFI043 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging devices, and smart energy meters requiring stable component supply, long-term lifecycle support, and AEC-Q100-compatible sourcing.
Supply support for S25FL064LABNFI043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT markets.
The FL-L family targets high-reliability embedded systems needing fast, secure, and flexible serial flash with advanced interface modes and robust data integrity-designed specifically for code execution and firmware update in resource-constrained environments.
FAQ
What is the maximum clock frequency supported in QPI mode?
The S25FL064LABNFI043 supports up to 108 MHz in QPI mode for SDR operation and 54 MHz for DDR QPI read commands. At 108 MHz SDR, it achieves 54 MBps effective throughput using four data lines simultaneously, matching parallel NOR performance while using fewer PCB traces and pins.
Does this device support execute-in-place (XIP) operation?
Yes, the S25FL064LABNFI043 supports XIP via continuous read mode in both standard SPI and QPI interfaces. Host processors can fetch instructions directly from flash without copying to RAM, reducing boot latency and SRAM usage-validated across ARM Cortex-M and RISC-V platforms with appropriate cache and prefetch configuration.
How many security regions does this part provide, and what is their physical location?
This device provides four 256-byte Security Regions located outside the main 8 MB flash array, starting at address 0x00000000 in a dedicated address space. Each region supports independent volatile/non-volatile lock settings, password protection, and power-supply lock-down, ensuring cryptographic keys remain isolated from firmware updates.
Is the SOIC-16 package RoHS compliant and lead-free?
Yes, the S25FL064LABNFI043 in SOIC-16 (SO3016) packaging is fully RoHS compliant and Pb-free, meeting EU Directive 2011/65/EU and JEDEC JS709C requirements. The device carries the "Pb-free" marking on the top-side label and is qualified for reflow soldering per IPC/JEDEC J-STD-020D.3.
S25FL064LABNFI043 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 8-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-USON (4x4)
S25FL064LABNFI043 FAQ
1.How can I place an order for S25FL064LABNFI043 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064LABNFI043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064LABNFI043 reliable?
The price and inventory of S25FL064LABNFI043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064LABNFI043 is usually 5 days.
3.What payment methods are accepted for S25FL064LABNFI043?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL064LABNFI043 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL064LABNFI043?
S25FL064LABNFI043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL064LABNFI043 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064LABNFI043?
For technical support, including S25FL064LABNFI043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064LABNFI043 requirements.
6.How does Aetrix verify that S25FL064LABNFI043 is sourced from the original manufacturer or authorized distributors?
All S25FL064LABNFI043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064LABNFI043 meets industry standards.
7.What is the process for return or replacement of S25FL064LABNFI043?
All S25FL064LABNFI043 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064LABNFI043, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064LABNFI043 part is unused and in its original packaging.
Return procedure for S25FL064LABNFI043:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL064LABNFI043 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

