My Inquiry
My Account
Infineon Technologies S25FL064LABNFM040
- Part No.:
- S25FL064LABNFM040
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-UDFN Exposed Pad
- Datasheet:
-
S25FL064LABNFM040.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8USON
- Quantity:
- Payment:
- Shipping:
Inventory:2,679
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL064LABNFM040 from Infineon Technologies is a 64 Mb (8 MB) serial NOR flash memory with SPI multi-I/O interface, supporting single/dual/quad I/O and QPI modes plus DDR quad read at up to 54 MBps. It features uniform 4 KB sectors, 32 KB half-blocks, 64 KB blocks, and chip-erase capability, with 100,000 program/erase cycles and 20-year data retention. Designed for XIP and code shadowing in space-constrained embedded systems operating from 2.7 V to 3.6 V.
For engineers reviewing the S25FL064LABNFM040 datasheet, S25FL064LABNFM040 pinout, S25FL064LABNFM040 application, or S25FL064LABNFM040 equivalent, key selection criteria include quad/DDR read throughput, sector-erase granularity, industrial temperature range (–40°C to +85°C), security register protection, and SOIC-16 lead compatibility with legacy S25FL-P/S25FL-S families.
Technical Context
The device implements a floating-gate 65 nm process architecture with a 256-byte page programming buffer and supports both standard SPI command subsets and extended multi-I/O protocols including QPI and DDR quad I/O. Its SFDP (JESD216B) table enables automatic host configuration of read modes and timing parameters.
It integrates four independent 256-byte security registers with volatile/non-volatile locking options, reset-controlled power-down states (deep power-down current: 2 µA), and hardware write-protection via WP# and status register bits SRP0/SRP1. Erase and program operations support suspend/resume functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (8 MB) - sufficient for boot code, firmware images, and configurable runtime data in resource-limited microcontrollers. |
| Interface Modes | Single/Dual/Quad I/O + QPI + DDR Quad Read - enables scalable bandwidth from 6.25 MBps (SDR read) to 54 MBps (DDR quad read). |
| Erase Granularity | Uniform 4 KB sectors / 32 KB half-blocks / 64 KB blocks - allows fine-grained firmware updates without full-chip erase. |
| Endurance & Retention | 100,000 program/erase cycles min / 20 years data retention min - meets long-life requirements for industrial and automotive control units. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of board-level voltage variation. |
| Operating Temperature | –40°C to +85°C (Industrial grade) - validated for deployment in factory automation, networking equipment, and motor drives. |
| Deep Power-Down Current | 2 µA - enables ultra-low standby power in battery-backed or energy-harvesting edge nodes. |
Pinout & Package
Package: 16-lead SOIC (300 mil), RoHS-compliant, footprint-compatible with Infineon's S25FL-P and S25FL-S families.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command latching; must be held low during entire transaction including address/data phases. |
| SCK | Serial Clock | Input clock for SDR (mode 0/3) or DDR (dual-edge sampling); max 108 MHz for SDR, 54 MHz for DDR quad reads. |
| IO0 (SI) | Serial Input / Data Line 0 | Primary input for commands/address in SIO mode; bidirectional in DIO/QIO/QPI for multiplexed data transfer. |
| IO1 (SO) | Serial Output / Data Line 1 | Primary output for read data in SIO; bidirectional in DIO/QIO/QPI; supports dual-edge sampling in DDR mode. |
| IO2 (WP#) | Write Protect / Data Line 2 | Hardware write lock when asserted low; also functions as quad I/O line in QIO/QPI modes. |
| IO3 (RESET#) | Reset Input / Data Line 3 | Asynchronous reset trigger; also serves as fourth I/O line in quad modes; internal pull-up ensures safe default state. |
| VCC | Power Supply | Core and I/O supply (2.7–3.6 V); decoupling capacitor required within 10 mm of pin per layout guidelines. |
| VSS | Ground | Digital ground reference; separate analog ground not required; shared return path with host MCU ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Quad + DDR Read Support | 54 MBps effective bandwidth - eliminates need for parallel NOR in cost-sensitive, high-pin-count constrained designs. |
| SFDP (JESD216B) Compliance | Self-describing parameter table - enables automatic host driver initialization without hard-coded timing constants. |
| Four Independent Security Registers | 256-byte isolated regions with password/power-lock options - supports secure bootloader partitioning and field firmware authentication keys. |
| Suspend/Resume for Erase & Program | Interruptible background operations - allows real-time system response during long-duration flash maintenance tasks. |
| Legacy Footprint Compatibility | Pin-for-pin and command-set match with S25FL-P/S25FL-S families - simplifies migration from older Infineon flash generations. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing programmable logic controller firmware updated quarterly via field service tools. IC Role / Device Role / Timing Role: Nonvolatile boot memory executing XIP code directly from flash, reducing external RAM dependency. Use Value: 4 KB sector erase enables patch-level updates without disrupting operational logic; 100K-cycle endurance exceeds 15-year field life. |
Use Scenario: Holding boot image and safety-critical sensor calibration data in radar ECU with AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary boot flash with hardware write protection and deep power-down for low-quiescent current during vehicle sleep mode. Use Value: –40°C to +105°C operation and 2 µA deep power-down meet ISO 16750-2 cold cranking and UNECE R100 thermal requirements. |
| Network Router Configuration Storage | Medical Imaging FPGA Bitstream Loader |
Use Scenario: Persisting routing tables, TLS certificates, and firmware signatures across reboots in enterprise-grade switches. IC Role / Device Role / Timing Role: Secure configuration store with individual sector locking and SFDP-driven read optimization. Use Value: Four security registers isolate root CA keys from user-configurable parameters; QPI mode reduces signal count versus parallel interface. |
Use Scenario: Loading FPGA configuration bitstreams on power-up in portable ultrasound devices requiring fast boot and low EMI. IC Role / Device Role / Timing Role: High-speed configuration source using DDR quad read to achieve sub-100 ms FPGA initialization. Use Value: 54 MBps DDR quad read cuts bitstream load time by >3× vs. standard SPI; SOIC-16 package fits tight PCB layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL164K0XMFI040 | 64 Mb density, same SOIC-16 package, but only supports SDR and dual I/O (no QPI or DDR). | Lacks DDR quad read and QPI command set - limits maximum throughput to 27 MBps vs. 54 MBps. | Select when DDR/QPI features are unnecessary and legacy Cypress toolchain compatibility is prioritized. |
| Winbond W25Q64JVSIQ | 64 Mb, SOIC-8 package (not pin-compatible), supports QPI and DDR but no SFDP v1.6; different security register mapping. | Smaller 8-lead footprint saves area but requires PCB redesign; lacks Infineon's four dedicated security regions. | Choose for space-constrained designs where QPI suffices and security isolation is handled externally. |
Compared with S25FL064LABNFM040, the Cypress alternative trades bandwidth and modern protocol support for legacy ecosystem alignment, while the Winbond part offers smaller packaging at the cost of pin compatibility and enhanced security architecture - making the Infineon device optimal for new industrial and automotive designs demanding both performance and robust firmware integrity.
Availability
S25FL064LABNFM040 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, network infrastructure routers, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant flash memory.
Supply support for S25FL064LABNFM040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
The S25FL-L family delivers high-performance, secure serial NOR flash targeting boot code storage, firmware updates, and configuration data in systems where reliability, density, and interface flexibility are critical.
FAQ
Does S25FL064LABNFM040 support execute-in-place (XIP) operation?
Yes, it supports true XIP operation via continuous burst read mode in all interface configurations (SIO, DIO, QIO, QPI). The device delivers deterministic latency under 100 ns for sequential instruction fetches, enabling direct CPU execution without RAM buffering - verified across all supported clock rates up to 108 MHz SDR and 54 MHz DDR.
What is the function of the IO3/RESET# pin in normal operation?
In normal operation, IO3 serves as the fourth I/O line for quad and QPI modes. When asserted low, RESET# forces the device into hardware reset state, clearing internal state machines and returning to power-on default configuration. It is internally pulled up and requires no external resistor unless actively driven by the host for controlled reset sequencing.
How does the security region protection differ from standard status register write protection?
Standard SRP0/SRP1 bits protect the entire flash array from accidental writes. In contrast, the four 256-byte security regions support independent locking via volatile/non-volatile bits and optional password or power-lock mechanisms - allowing isolated protection of bootloader, keys, calibration data, and customer-specific parameters without affecting main array accessibility.
Is SOIC-16 pinout identical across all S25FL-L variants?
Yes - all S25FL-L devices in SOIC-16 (300 mil) packaging share identical pin assignment, electrical characteristics, and command set. This includes S25FL064L, S25FL128L, and S25FL256L, enabling drop-in capacity upgrades without PCB or firmware changes.
S25FL064LABNFM040 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 8-UDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-USON (4x4)
S25FL064LABNFM040 FAQ
1.How can I place an order for S25FL064LABNFM040 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064LABNFM040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064LABNFM040 reliable?
The price and inventory of S25FL064LABNFM040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064LABNFM040 is usually 5 days.
3.What payment methods are accepted for S25FL064LABNFM040?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL064LABNFM040 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL064LABNFM040?
S25FL064LABNFM040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL064LABNFM040 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064LABNFM040?
For technical support, including S25FL064LABNFM040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064LABNFM040 requirements.
6.How does Aetrix verify that S25FL064LABNFM040 is sourced from the original manufacturer or authorized distributors?
All S25FL064LABNFM040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064LABNFM040 meets industry standards.
7.What is the process for return or replacement of S25FL064LABNFM040?
All S25FL064LABNFM040 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064LABNFM040, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064LABNFM040 part is unused and in its original packaging.
Return procedure for S25FL064LABNFM040:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL064LABNFM040 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
