Infineon Technologies S25FL064P0XBHI023
- Part No.:
- S25FL064P0XBHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL064P0XBHI023.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,700
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Product details
Overview
S25FL064P0XBHI023 from Cypress Semiconductor is a 64-Mbit, 2.7–3.6 V SPI flash memory with uniform 64-kB sectors, 4-kB sub-sectors, 256-byte page size, and Quad I/O FAST_READ up to 80 MHz (40 MB/s). It supports accelerated programming via W#/ACC pin, 100,000 erase/program cycles per sector, and 20-year data retention. Used for firmware storage in industrial microcontroller boot systems requiring SPI-compatible nonvolatile code memory.
For engineers reviewing the S25FL064P0XBHI023 datasheet, S25FL064P0XBHI023 pinout, S25FL064P0XBHI023 application, or S25FL064P0XBHI023 equivalent, key selection criteria include sector/sub-sector erase granularity, OTP area (16 bytes + 490 bytes), JEDEC-compliant Device ID, CFI compliance, and dual/quad I/O read modes - all critical for secure, high-speed embedded boot memory design.
Technical Context
The S25FL064P implements a 90-nm MirrorBit® process-based NOR flash architecture with configurable block protection (BP2–BP0 bits), status/configuration registers, and five extended SPI instructions for Dual/Quad I/O and Quad Page Programming. Its memory map comprises 128 × 64-kB sectors, with top/bottom 64-kB parameter blocks subdivided into thirty-two 4-kB sub-sectors.
It operates in standard SPI Mode 0/3, supports Deep Power-Down (3 μA typical), Standby (80 μA), and accelerated programming using 9V on W#/ACC. Command set includes P4E (20h), P8E (40h), SE (D8h), BE (C7h), QPP (38h), QIOR (EBh), and OTPR/OTPP - enabling fine-grained control over program, erase, and identification functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB) - sufficient for full MCU boot image + configuration + secure OTP identity storage |
| Supply Voltage | 2.7–3.6 V - single-supply operation compatible with 3.3 V industrial logic rails without level shifting |
| Read Speed | QUAD I/O FAST_READ at 80 MHz (40 MB/s effective) - enables rapid firmware load during cold boot |
| Erase Granularity | 4-kB sub-sector (P4E), 64-kB sector (SE), and bulk erase - supports partial firmware updates without full reflash |
| Endurance & Retention | 100,000 program/erase cycles per sector; 20 years data retention - meets long-life industrial deployment requirements |
| OTP Area | 16-byte factory/cust-programmable + 490-byte user OTP - provides tamper-resistant device ID and calibration data storage |
| Interface Standard | JEDEC JESD216-compliant CFI - allows host system auto-detection and dynamic flash parameter negotiation |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm), 6 × 4 pin configuration, lead-free, low-halogen, industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable; required falling edge after power-up before command acceptance; controls standby/active power state |
| SCK | Serial Clock | Input timing reference; latches SI on rising edge, triggers SO output on falling edge; supports up to 104 MHz clock rate |
| SI/IO0 | Serial Input / I/O0 | Command/address/data input (rising edge); becomes bidirectional I/O0 in Dual/Quad modes for parallelized data transfer |
| SO/IO1 | Serial Output / I/O1 | Data output (falling edge); becomes bidirectional I/O1 in Dual/Quad modes; high-impedance when HOLD# active |
| W#/ACC/IO2 | Write Protect / Acceleration / I/O2 | Low-voltage write protect; 9V enables accelerated programming; acts as I/O2 in Quad modes for 4-line data bus expansion |
| HOLD#/IO3 | Hold / I/O3 | Pauses ongoing SPI transaction without CS# deassertion; acts as I/O3 in Quad modes; requires CS# low to activate |
| VCC | Power Supply | 2.7–3.6 V supply; powers internal charge pumps for erase/program; no external high-voltage generator needed |
| GND | Ground | Reference for all I/O and internal logic; must be low-impedance connection to minimize noise in high-speed read operations |
Key Features
| Feature | Design Value |
|---|---|
| Dual/Quad I/O Read Modes | Enables 2× or 4× throughput vs standard SPI: DUAL I/O FAST_READ (20 MB/s), QUAD I/O FAST_READ (40 MB/s) |
| Sub-sector Erase (P4E/P8E) | Allows 4-kB or 8-kB erase granularity - essential for OTA firmware patching without disrupting adjacent code sections |
| Accelerated Programming | 9V applied to W#/ACC reduces page program time to ≤1.5 ms (typical) - cuts firmware update latency in production programming |
| CFI Compliance | Host reads JEDEC-standard CFI query structure to auto-configure timing, density, and command set - eliminates hard-coded flash drivers |
| OTP Security Space | 16-byte factory-lockable region + 490-byte user-programmable region - supports unique device ID, cryptographic keys, and calibration constants |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Memory |
|---|---|
|
Use Scenario: Storing bootloader, application firmware, and calibration tables in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with fast QUAD I/O read for sub-100ms cold boot; sub-sector erase enables field firmware patches. Use Value: 4-kB erase granularity prevents full reflash during updates; 20-year retention ensures reliability across 15+ year PLC service life. |
Use Scenario: Holding certified boot loader and diagnostic firmware in Class II medical imaging equipment requiring traceable, immutable startup code. IC Role / Device Role / Timing Role: Secure boot memory with OTP-locked device ID and CFI-driven auto-configuration for regulatory auditability. Use Value: JEDEC Device ID + OTP area satisfies FDA 21 CFR Part 11 electronic record integrity requirements for firmware provenance. |
| Automotive ADAS Camera Module | Energy Meter Firmware Vault |
|
Use Scenario: Storing camera ISP firmware and lens correction parameters in AEC-Q100 qualified rear-view camera modules. IC Role / Device Role / Timing Role: SPI flash with industrial-grade temp range (–40°C to +85°C) and accelerated programming for end-of-line calibration writes. Use Value: W#/ACC 9V acceleration enables <2s calibration data programming during final test; 100k-cycle endurance supports lifetime recalibration. |
Use Scenario: Hosting metrology firmware and tariff tables in ANSI C12.20-certified smart electricity meters deployed outdoors for 20+ years. IC Role / Device Role / Timing Role: Long-retention, sector-protected flash with Deep Power-Down (3 μA) to extend battery backup runtime during outages. Use Value: 20-year data retention and BP2–BP0 software lock prevent unauthorized firmware modification - meeting ANSI 12.22 security mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064L0XBHI020 | Successor device; identical 64-Mbit density, same 6×4 BGA package, but uses 65-nm process and adds SFDP support | Supports newer SFDP v1.6 parameter tables; lacks P8E command; retains P4E and QPP compatibility | Select for new designs requiring SFDP-based auto-configuration and extended lifecycle availability |
| MX25L6433FZNI-10G | 64-Mbit SPI flash; 104 MHz max clock; no W#/ACC acceleration pin; OTP area limited to 1024-bit one-time lock | No accelerated programming mode; simpler command set; lower cost but no sub-sector erase below 4-kB | Choose where cost sensitivity outweighs need for 9V-accelerated programming or flexible OTP partitioning |
Compared with S25FL064P0XBHI023, the S25FL064L0XBHI020 offers SFDP compliance and longer-term supply, while the MX25L6433FZNI-10G trades acceleration and OTP flexibility for lower unit cost and simplified qualification - making each suitable for distinct design maturity and security tiers.
Availability
S25FL064P0XBHI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot memory, and automotive ADAS camera modules requiring stable component supply despite end-of-life status.
Supply support for S25FL064P0XBHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability nonvolatile memory and microcontrollers for industrial, automotive, and IoT applications, with emphasis on security, longevity, and system-level integration.
The S25FL family targets embedded systems needing SPI flash with advanced features like Quad I/O, sub-sector erase, and OTP security - specifically engineered for firmware storage in safety-critical and long-lifecycle applications.
FAQ
Is S25FL064P0XBHI023 still recommended for new designs?
No. Cypress explicitly states this part is retired and not recommended for new designs. The S25FL064L0XBHI020 is the factory-recommended migration path, offering identical pinout, density, and package with enhanced SFDP support and extended manufacturing availability.
What is the function of the W#/ACC pin beyond write protection?
The W#/ACC pin serves three roles: (1) write protection when pulled low, (2) acceleration trigger when 9V is applied to reduce page program time to ≤1.5 ms, and (3) I/O2 in Quad I/O modes for 4-line data transfer - enabling both security and performance optimization in a single terminal.
How does the OTP area work, and can it be reprogrammed?
The OTP area consists of two regions: 16 bytes (lockable at factory or by customer) and 490 bytes (user-programmable). Once locked, the 16-byte region is permanently immutable; the 490-byte region supports single-write programming only. Both are accessed via OTPP and OTPR commands and retain data for 20 years.
Does S25FL064P0XBHI023 support standard SPI Mode 0 only?
No. It supports both SPI Mode 0 (CPOL = 0, CPHA = 0) and Mode 3 (CPOL = 1, CPHA = 0), as confirmed in Section 6 of the datasheet. Mode selection is fixed by hardware design and must match host controller configuration; no runtime switching is supported.
S25FL064P0XBHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL064P0XBHI023 FAQ
1.How can I place an order for S25FL064P0XBHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064P0XBHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064P0XBHI023 reliable?
The price and inventory of S25FL064P0XBHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064P0XBHI023 is usually 5 days.
3.What payment methods are accepted for S25FL064P0XBHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL064P0XBHI023 transactions.
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4.How is shipping managed for S25FL064P0XBHI023?
S25FL064P0XBHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL064P0XBHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064P0XBHI023?
For technical support, including S25FL064P0XBHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064P0XBHI023 requirements.
6.How does Aetrix verify that S25FL064P0XBHI023 is sourced from the original manufacturer or authorized distributors?
All S25FL064P0XBHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064P0XBHI023 meets industry standards.
7.What is the process for return or replacement of S25FL064P0XBHI023?
All S25FL064P0XBHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064P0XBHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064P0XBHI023 part is unused and in its original packaging.
Return procedure for S25FL064P0XBHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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