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Infineon Technologies S25FL064P0XBHIS30
- Part No.:
- S25FL064P0XBHIS30
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL064P0XBHIS30.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,175
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Product details
Overview
S25FL064P0XBHIS30 from Cypress Semiconductor is a 64-Mbit, 2.7–3.6 V SPI flash memory with uniform 64-kB sectors, 4-kB sub-sectors, 256-byte page size, and Quad I/O FAST_READ support up to 80 MHz (40 MB/s). It implements SPI bus-compatible serial interface, OTP area (16 bytes + 490 bytes), and accelerated programming via W#/ACC pin for embedded firmware storage in industrial controllers.
For engineers reviewing the S25FL064P0XBHIS30 datasheet, S25FL064P0XBHIS30 pinout, S25FL064P0XBHIS30 application, or S25FL064P0XBHIS30 equivalent, key selection criteria include sector/sub-sector erase granularity, 100,000-cycle endurance, 20-year data retention, Deep Power-Down (3 μA), and JEDEC-compliant Device ID support.
Technical Context
The S25FL064P0XBHIS30 uses Cypress's 90-nm MirrorBit® process and supports five high-performance SPI modes: FAST_READ (104 MHz), DUAL I/O (20 MB/s), QUAD I/O (40 MB/s), Dual Output Read, and Quad Page Programming - all using SI/IO0, SO/IO1, W#/ACC/IO2, and HOLD#/IO3 as configurable I/O pins.
It features dual protection mechanisms: hardware-based W#/ACC pin control combined with software-configurable Status Register Block Protection bits (BP2–BP0), plus CFI compliance for host-system auto-identification and interoperability with multi-device flash configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB) organized as 128 × 64-kB sectors, enabling fine-grained firmware partitioning |
| Read Speed | QUAD I/O FAST_READ at 80 MHz clock → 40 MB/s effective throughput for fast boot code loading |
| Erase Granularity | Supports 4-kB sub-sector (P4E), 8-kB sub-sector (P8E), 64-kB sector (SE), and bulk erase (BE) for flexible update management |
| Endurance & Retention | 100,000 program/erase cycles per sector; 20 years data retention at +85°C - suitable for field-upgradable industrial firmware |
| Power Modes | Deep Power-Down draws 3 μA typical; Standby Mode draws 80 μA - critical for battery-backed or low-power edge nodes |
| OTP Area | 16-byte factory- or customer-programmable secure ID region + 490-byte general-purpose OTP space for calibration or binding data |
| Voltage Range | Single 2.7–3.6 V supply - eliminates need for external voltage translators in 3.3 V systems |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm), 6 × 4 pin configuration (per ordering code '03' in part number), lead-free and low-halogen compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable; required falling edge after power-up before command acceptance; places device in standby when high |
| SCK | Serial Clock | Drives timing for all SPI operations; commands/addresses latched on rising edge; SO output triggered on falling edge |
| SI/IO0 | Serial Input / I/O0 | Primary data input; becomes bidirectional I/O0 in Dual/Quad I/O and Quad Page Program modes |
| SO/IO1 | Serial Output / I/O1 | Primary data output; becomes bidirectional I/O1 in Dual/Quad I/O modes; high-impedance during HOLD# assertion |
| W#/ACC/IO2 | Write Protect / Accelerate / I/O2 | Hardware write protection when low; enables accelerated programming when driven to 9 V; serves as I/O2 in Quad modes |
| HOLD#/IO3 | Hold / I/O3 | Pauses ongoing SPI transfer without chip deselect; functions as I/O3 in Quad I/O and Quad Page Program modes |
| VCC | Supply Voltage | 2.7–3.6 V single supply; internally regulates voltages for program/erase - no external high-voltage generator needed |
| GND | Ground | Reference for all I/O and internal logic; exposed thermal pad in WSON variant must be tied to GND at 0 mV potential |
Key Features
| Feature | Design Value |
|---|---|
| Quad I/O High Performance Read | Enables 40 MB/s read throughput using four pins (IO0–IO3), reducing boot time vs. standard SPI in resource-constrained MCUs |
| Sub-sector Erase (4-kB) | Allows updating small firmware patches or configuration blocks without erasing full 64-kB sectors - preserves adjacent data integrity |
| One-Time Programmable (OTP) Space | 16-byte secure ID region + 490-byte general OTP area supports device binding, calibration storage, and anti-cloning measures |
| CFI Compliance | Permits host system to auto-detect device geometry, timing, and command set - simplifies firmware abstraction layer across flash families |
| Accelerated Programming Mode | 9 V applied to W#/ACC pin reduces page program time to ≤1.5 ms (typical), improving production programming efficiency |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code Retention |
|---|---|
Use Scenario: Storing and updating firmware images in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Nonvolatile firmware storage with sub-sector erase capability for delta updates and field patching. Use Value: 100,000-cycle endurance and 20-year data retention ensure reliable operation over 10+ year product lifecycles without refresh. |
Use Scenario: Holding certified boot loader and safety-critical application code in Class II medical instruments requiring traceable firmware versions. IC Role / Device Role / Timing Role: Secure, tamper-resistant code storage with OTP-based cryptographic key binding and version locking. Use Value: 16-byte OTP region enables permanent device identity embedding; CFI compliance simplifies regulatory audit of flash configuration. |
| Automotive Telematics Module | Smart Energy Meter Calibration Data |
Use Scenario: Storing OTA-updatable telematics stack and vehicle configuration profiles in AEC-Q100 Grade 2 modules (-40°C to +105°C). IC Role / Device Role / Timing Role: High-speed Quad I/O read interface for rapid boot under cold-start conditions; Deep Power-Down mode minimizes quiescent current. Use Value: 3 μA Deep Power-Down current extends battery backup life; 80 MHz Quad I/O read ensures <500 ms boot latency. |
Use Scenario: Retaining metrology calibration coefficients and tariff tables in ANSI C12.20-certified electricity meters deployed in outdoor enclosures. IC Role / Device Role / Timing Role: Radiation-tolerant, long-retention nonvolatile storage for mission-critical calibration parameters subject to 20+ year field deployment. Use Value: 20-year data retention at +85°C meets ANSI/IEEE longevity requirements; 4-kB sub-sector erase prevents corruption during coefficient updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064L0XBHIS30 | Successor device; same density, package, and pinout; adds 133 MHz Quad I/O, enhanced security registers, and improved ECC | Required for new designs per Cypress migration path; supports secure boot chains and higher-speed firmware loads | Select for new designs needing extended lifecycle support, security enhancements, and higher bandwidth |
| MX25L6433FZNI-10G | 64-Mbit SPI flash from Macronix; 104 MHz max clock; no Quad Page Program; 64-kB sector only (no 4-kB sub-sector) | Lacks sub-sector erase and Quad Page Programming; lower endurance (50,000 cycles); no OTP area | Acceptable for cost-sensitive, non-upgradable firmware where erase granularity and secure ID are not required |
Compared with S25FL064P0XBHIS30, the S25FL064L0XBHIS30 delivers higher read bandwidth and security features for future-proof designs, while the MX25L6433FZNI-10G offers basic SPI flash functionality at lower cost but sacrifices sub-sector flexibility, OTP, and endurance.
Availability
S25FL064P0XBHIS30 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code retention, automotive telematics modules, and smart energy meter calibration data requiring stable component supply despite end-of-life status.
Supply support for S25FL064P0XBHIS30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability nonvolatile memory and microcontroller solutions for industrial, automotive, and IoT applications.
The S25FL family targets embedded systems requiring robust, high-speed SPI flash with advanced erase granularity and secure identification - optimized for firmware storage in safety- and uptime-critical equipment.
FAQ
Is S25FL064P0XBHIS30 still recommended for new designs?
No. Cypress explicitly states this part is "Not Recommended for New Designs" and designates S25FL064L0XBHIS30 as the factory-recommended migration path. The S25FL064P remains available for legacy production and repair, but lacks long-term roadmap support, security enhancements, and higher-speed modes found in the L-series.
What does the '03' in the part number indicate?
The '03' suffix in S25FL064P0XBHIS30 specifies the 24-ball BGA package with 6 × 4 pin configuration (FAC024 footprint), distinct from the 5 × 5 configuration ('02') or SO/WSON packages ('00'/'N'). This configuration places CS#, SO/IO1, HOLD#/IO3, SCK, SI/IO0, and GND on the outer perimeter for optimal signal routing.
Can the W#/ACC pin be used for both write protection and accelerated programming?
Yes - W#/ACC/IO2 serves three roles: logic-level write protection when pulled low (enabling BP2–BP0 register control), accelerated programming trigger when driven to 9 V (reducing page program time to ≤1.5 ms), and I/O2 in Quad I/O and Quad Page Program modes. These functions are mutually exclusive and mode-selected by voltage level and command sequence.
Does this device support JEDEC-standard Device ID and CFI?
Yes. It provides a two-byte JEDEC electronic signature (0x01, 0x20) via the RES command and full CFI compliance, allowing host systems to automatically detect memory geometry, timing parameters, and supported command sets - essential for generic flash abstraction layers in bootloader and OS firmware.
S25FL064P0XBHIS30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL064P0XBHIS30 FAQ
1.How can I place an order for S25FL064P0XBHIS30 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064P0XBHIS30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064P0XBHIS30 reliable?
The price and inventory of S25FL064P0XBHIS30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064P0XBHIS30 is usually 5 days.
3.What payment methods are accepted for S25FL064P0XBHIS30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL064P0XBHIS30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL064P0XBHIS30?
S25FL064P0XBHIS30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL064P0XBHIS30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064P0XBHIS30?
For technical support, including S25FL064P0XBHIS30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064P0XBHIS30 requirements.
6.How does Aetrix verify that S25FL064P0XBHIS30 is sourced from the original manufacturer or authorized distributors?
All S25FL064P0XBHIS30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064P0XBHIS30 meets industry standards.
7.What is the process for return or replacement of S25FL064P0XBHIS30?
All S25FL064P0XBHIS30 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064P0XBHIS30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064P0XBHIS30 part is unused and in its original packaging.
Return procedure for S25FL064P0XBHIS30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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