Infineon Technologies S25FL064P0XMFB003
- Part No.:
- S25FL064P0XMFB003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL064P0XMFB003.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S25FL064P0XMFB003 from Cypress Semiconductor is a 64-Mbit, 3.0 V SPI flash memory with uniform 64-kB sectors, 4-kB sub-sectors, 256-byte page size, and support for Quad I/O FAST_READ at 80 MHz (40 MB/s). It operates across 2.7–3.6 V, delivers 100,000 erase/program cycles per sector, and retains data for 20 years. Used in embedded boot code storage, firmware update partitions, and configuration memory for industrial controllers.
For engineers reviewing the S25FL064P0XMFB003 datasheet, S25FL064P0XMFB003 pinout, S25FL064P0XMFB003 application, or S25FL064P0XMFB003 equivalent, key selection criteria include SPI quad I/O timing compliance, OTP area availability (16 bytes + 490 bytes), sector/sub-sector erase granularity, and W#/ACC-accelerated programming capability.
Technical Context
The S25FL064P implements a 90-nm MirrorBit® NOR architecture with CFI-compliant command set and dual/quad I/O modes enabled via dedicated IO0–IO3 pins. It supports five high-performance read instructions-including QIOR and DIOR-each requiring specific pin reconfiguration and clock-synchronized sampling on rising/falling edges.
Internal voltage regulation enables single-supply 3.0 V operation for read, program, and erase; accelerated programming requires externally applied 9 V to W#/ACC. Memory protection uses Status Register BP2–BP0 bits combined with W#/ACC logic level, while OTP locking is irreversible after execution of LOCK_OTP command.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 64 Mbit (8 MB) organized as 128 × 64-kB sectors |
| Supply Voltage | 2.7 V to 3.6 V - enables direct interface with 3.3 V system rails without level shifters |
| Read Speed | QUAD I/O FAST_READ at 80 MHz → 40 MB/s effective throughput |
| Erase Granularity | 64-kB sector, 4-kB sub-sector, and bulk erase - supports fine-grained firmware patching |
| Endurance & Retention | 100,000 program/erase cycles per sector; 20-year data retention at 85°C |
| OTP Area | 16 bytes (128-bit) factory- or customer-programmable secure ID + 490 bytes general-purpose OTP |
| Power Modes | Standby: 80 μA typical; Deep Power-Down: 3 μA typical - critical for battery-backed systems |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm), 6 × 4 pin configuration (per ordering code '003'). Pinout validated per Cypress Document 002-00649 Rev. *J, Figure 2.4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command initiation; required falling edge post-power-up before first instruction |
| SCK | Serial Clock | Master-generated clock; commands/addresses latched on rising edge, SO data output triggered on falling edge |
| SI/IO0 | Serial Input / I/O0 | Primary data input; becomes bidirectional I/O0 in Dual/Quad I/O modes |
| SO/IO1 | Serial Output / I/O1 | Primary data output; becomes bidirectional I/O1 in Dual/Quad I/O modes |
| W#/ACC/IO2 | Write Protect / Acceleration / I/O2 | Low = write protection; 9 V = accelerated programming; bidirectional I/O2 in Quad modes |
| HOLD#/IO3 | Hold / I/O3 | Pauses ongoing SPI transfer without CS# deassertion; bidirectional I/O3 in Quad I/O modes |
| VCC | Supply Voltage | 2.7–3.6 V single supply powers all operations; internal charge pumps generate programming voltages |
| GND | Ground | Reference for all I/O and internal logic; exposed pad in WSON variant must be tied to GND at 0 mV potential |
Key Features
| Feature | Design Value |
|---|---|
| Quad I/O High Performance Read (QIOR) | Enables 40 MB/s read bandwidth using SI, SO, W#/ACC, and HOLD# as parallel data lines |
| Sub-sector erase (4-kB P4E) | Allows firmware patching without disturbing adjacent 64-kB sectors - reduces update latency |
| One-Time Programmable (OTP) space | 16-byte secure ID + 490-byte field-programmable region - supports device binding and calibration storage |
| Accelerated programming via W#/ACC | Reduces page program time to <1.5 ms typical when 9 V applied - improves production programming throughput |
| CFI compliance | Enables automatic flash detection and parameter loading by host bootloader without hard-coded geometry |
Applications
| Industrial PLC Firmware Storage | Medical Device Bootloader Partition |
|---|---|
Use Scenario: Stores boot firmware and safety-critical control logic in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped to microcontroller's XIP address space; accessed via SPI with QIOR for fast startup. Use Value: 20-year data retention ensures firmware integrity over equipment lifetime; sub-sector erase allows field updates without full reflash. | Use Scenario: Holds certified bootloader and cryptographic keys in Class II medical imaging systems requiring regulatory traceability. IC Role / Device Role / Timing Role: Secure configuration store with OTP-locked device ID; accessed during power-on self-test via standard SPI commands. Use Value: Irreversible OTP locking prevents tampering; CFI compliance simplifies bootloader compatibility across product revisions. |
| Automotive Telematics Module | Network Router Configuration Memory |
Use Scenario: Stores OTA update payload staging area and vehicle-specific calibration tables in AEC-Q100 Grade 2 telematics units. IC Role / Device Role / Timing Role: Dual-boot partitioned flash supporting fail-safe firmware rollback; erased via P4E during update preparation. Use Value: 100,000-cycle endurance supports frequent OTA updates; 4-kB sub-sector granularity minimizes erase time and wear. | Use Scenario: Retains routing table defaults, VLAN configurations, and vendor-specific settings across power cycles in enterprise-grade Layer 3 switches. IC Role / Device Role / Timing Role: SPI-configurable non-volatile memory accessed during boot initialization and runtime CLI save operations. Use Value: Deep Power-Down mode (3 μA) reduces standby power in always-on infrastructure gear; W#/ACC protection prevents accidental config corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064L0XMFB003 | Successor device; identical 64-Mbit density, same 6×4 BGA package, but built on 65-nm process with improved 1.8 V compatibility and lower deep power-down current (1 μA) | Supports wider voltage range (1.7–3.6 V); required for new designs per Cypress migration notice | Select for new designs requiring extended voltage margin, longer lifecycle support, and reduced standby power |
| MX25L6433FZNI-10G | 64-Mbit SPI flash from Macronix; supports DTR mode up to 133 MHz; no W#/ACC acceleration pin; OTP area limited to 1024 bytes (no secure lock) | Lacks hardware-accelerated programming and irreversible OTP locking; uses standard /WP pin instead of W#/ACC | Choose where ultra-high-speed DTR reads are prioritized over secure ID binding or accelerated production programming |
Compared with S25FL064P0XMFB003, the S25FL064L offers better long-term supply assurance and lower power, while MX25L6433F provides higher peak read speed but sacrifices secure OTP locking and acceleration capability - trade-offs directly impact firmware security and manufacturing throughput.
Availability
S25FL064P0XMFB003 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader partitioning, and automotive telematics module configuration requiring stable component supply despite end-of-life status.
Supply support for S25FL064P0XMFB003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability non-volatile memory and microcontroller solutions for industrial, automotive, and communications markets.
The S25FL family targets embedded systems requiring robust, SPI-compatible flash with advanced features like quad I/O, sub-sector erase, and secure OTP - optimized for firmware storage and field-upgradable devices.
FAQ
Is S25FL064P0XMFB003 still recommended for new designs?
No. Cypress explicitly states this part is retired and not recommended for new designs. The S25FL064L0XMFB003 is the factory-recommended migration path, offering identical pinout, enhanced process node, and extended voltage support. Design reuse is possible only for legacy repair or continuity programs with documented lifecycle risk acceptance.
What does the '003' suffix indicate in S25FL064P0XMFB003?
The '003' suffix specifies the 24-ball BGA package with 6 × 4 pin configuration (per Cypress ordering guide). It distinguishes this variant from '002' (5 × 5 BGA), '00' (SO-16), and 'N' (WSON-8). Mechanical dimensions are 6 mm × 8 mm with 1.00 mm ball pitch, and the package is lead-free and low-halogen compliant.
How is the W#/ACC pin used for accelerated programming?
The W#/ACC pin must be driven to 9 V (±0.5 V) during Page Program or Quad Page Program commands to activate accelerated mode, reducing typical programming time to ≤1.5 ms per 256-byte page. This voltage is supplied externally - the device does not generate it internally. Standard 3.3 V operation remains valid but yields slower programming.
Can the OTP area be reprogrammed after locking?
No. Once the LOCK_OTP command is executed, the 16-byte secure OTP region becomes permanently read-only. The 490-byte general-purpose OTP region can be written once per byte but cannot be erased or rewritten. Neither region supports post-lock modification - design verification and secure key injection must occur before final locking.
S25FL064P0XMFB003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL064P0XMFB003 FAQ
1.How can I place an order for S25FL064P0XMFB003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL064P0XMFB003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL064P0XMFB003 reliable?
The price and inventory of S25FL064P0XMFB003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL064P0XMFB003 is usually 5 days.
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Once your S25FL064P0XMFB003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL064P0XMFB003?
For technical support, including S25FL064P0XMFB003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL064P0XMFB003 requirements.
6.How does Aetrix verify that S25FL064P0XMFB003 is sourced from the original manufacturer or authorized distributors?
All S25FL064P0XMFB003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL064P0XMFB003 meets industry standards.
7.What is the process for return or replacement of S25FL064P0XMFB003?
All S25FL064P0XMFB003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL064P0XMFB003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL064P0XMFB003 part is unused and in its original packaging.
Return procedure for S25FL064P0XMFB003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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